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TX-LR32S10

5

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground

such as a water pipe as shown in Figure 1.

3. Use the Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part and measure the voltage at each point.
5. The potential at any point (touch current) expressed as voltage U

1

 and U

2

, do not exceed the following values:

For AC: U

1

 = 35 V (peak) and U

2

 = 0.35 V (peak);

For DC: U

1

 = 1.0 V,

NOTE :
The limit value of U

2

 = 0.35 V (peak) for AC and U

1

 = 1.0 V for DC correspond to the values 0.7 mA (peak) AC and 2.0 mA

DC.
The limit value U

1

 = 35 V (peak) for AC correspond to the value 70 mA (peak) AC for frequencies greater than 100 kHz.

6. Should a measurement be out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

TX-LR32S10

6

BT

 → Divide

A

LCD P

A

NEL

IPK

Point Dip

Inspection

<V

isual check>

*V

oltage check

* LED Check Inverter (Blue LED)

<F

ACT

-TEST>

*ANALOG TUNE 

*VCXO ADJ

*LOCAL

 OSD  

*A

V_SW  CHECK 

     *A

V1/A

V2/A

V3---CVBS

     *A

V3---S(YC)

     *MONIT

OR-OUT

     *A

V1/A

V2---Component

     *PC  

     *HDMI1

     *HDMI2

     

*CEC_(HDMI1/HDMI2)

*Backlight

*SD Card  

*Software & EEPROM version

check by self check (1 set only) 

IP-PCB: 32” IPS ONL

Y

(Inverter & Power)

TNP4G455

P-PCB: 37” ONL

Y

(Power)

TNP4G454

BT

 → Divide

In coming check

W

riting

Assembly

A-PCB

TNP4G460

(Degital main)

V

-PCB

(LED)

TNP

A4834

PEAKS NOR Flash

       (W

riting IC)

         256Mbit

         IC8554

Sum : only ef

fective area

Add : 0 ~ 1FFFFFF

EEPROM W

riting (On board)

*GENX

    • EEPROM (8k) x 1

      IC1

101

*PEAKS

• EEPROM (16k) x 1

IC8601

<W

rite Protect command>

*GENX : Protect OFF = 70,88,00

               Protect ON = 70,88,f

f

*PEAKS : Protect OFF = 70,8B,00

                Protect ON  = 70,8B,f

f 

K-PCB

(Control)

TNP

A4901

BT

Inspection

FOR TNP4G455 

ONL

Y

*Adjust the frequency to 56 ± 1kHz by using VR7851

*Check to the output : J102 or 

TP7871

*Check to the Over V

oltage protection

*Check to the 

Arc protection

Inspection

LED CA

T

 EYES,REMOCON RECEIVER

TX-LR32S10

7

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).

TX-LR32S10

8

This model uses PbF in its manufacture due to environmental conservation issues. For service and repair work, we would suggest
the use of PbF as well, although Pb may be used.

PCBs manufactured using lead-free will have the “PbF within a leaf Symbol” stamped on their back.

• PbF has a higher melting point than that of standard solder. Typically the melting point is 50 ~ 70

°F (30~40°C) higher. 

Please use a high temperature soldering iron and set it to 700 ± 20

°F (370 ± 10°C).

• PbF will tend to splash when heated too high (about 1100

°F or 600°C).

If you must use Pb solder, please completely remove all of the PbF on the pins or solder area before applying Pb. If this is not
practical, be sure to heat the PbF until it melts, before applying Pb.

• After applying PbF to double layered boards, please check the component side for excess solder which may flow onto the

opposite side (see Figure 2).

Figure 2

Suggested PbF
There are several kinds of PbF available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu
(tin, copper) and Sn+Zn+Bi (tin, zinc, bismuth) solders can also be used.

Figure 3