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TH-50LFC70U/TH-50LFC70W

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground

such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U

1

 and U

2

, does not exceed the following values:

For a. c.: U

1

 = 35 V (peak) and U

2

 = 0.35 V (peak);

For d. c.: U

1

 = 1.0 V,

The limit value of U

2

 = 0.35 V (peak) for a. c. and U

1

 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

mA d. c.
The limit value U

1

 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

Figure 1

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TH-50LFC70U/TH-50LFC70W

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals.   These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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TH-50LFC70U/TH-50LFC70W

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d 
suggest the use of Pb free solder as well, although Pb solder may be used.

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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110 - 127 V ~ (110 - 127 V alternating current), 

50/60Hz

220 - 240 V ~ (220 - 240 V alternating current), 

50/60Hz

Power on

350 W

350 W

Stand-by condition

0.5 W

0.5 W

Power off condition

0.3 W

0.3 W

80-inch VA panel (LED backlight), 16:9 aspect ratio

1,771 mm (W) × 996 mm (H) × 2,032 mm (diagonal) /  

69.7” (W) × 39.2” (H) × 80.0” (diagonal)

(No.of pixels)

2,073,600 (1,920 (W) ×1,080 (H))

[5,760 × 1,080 dots]

Temperature

32 °F - 104 °F (0 °C - 40 °C)

Humidity

20 % - 80 % (no condensation) 

Colour System

NTSC, PAL, PAL60, SECAM, Modified NTSC

Scanning format

525 (480) / 60i · 60p, 625 (575) / 50i · 50p, 750 (720) / 60p · 50p, 1125 (1080) / 60i · 60p · 50i · 

50p · 24p · 25p · 30p · 24psF, 1250 (1080) / 50i 

PC signals

VGA, SVGA, XGA, SXGA 

UXGA  ···· (compressed)

Horizontal scanning frequency 15 - 110 kHz

Vertical scanning frequency 48 - 120 Hz

AV IN

VIDEO

AUDIO 1 IN

BNC

Stereo mini jack (M3) × 1

1.0 Vp-p (75 Ω)

0.5 Vrms, Shared with COMPONENT/RGB IN

HDMI 1

HDMI 2

TYPE A Connector × 2

COMPONENT/RGB IN

Y/G

PB/CB/B

PR/CR/R

AUDIO 1 IN

BNC

BNC

BNC

Stereo mini jack (M3) × 1

with sync 1.0 Vp-p (75 Ω)

0.7 Vp-p (75 Ω)

0.7 Vp-p (75 Ω)

0.5 Vrms, Shared with VIDEO

DVI-D IN

AUDIO 2 IN

DVI-D 24 Pin

Content Protection

Stereo mini jack (M3) × 1

Compliance with DVI Revision 1.0

Compatible with HDCP 1.1

0.5 Vrms, Shared with PC IN

PC IN

AUDIO 2 IN

High-Density Mini D-sub 15 Pin

Stereo mini jack (M3) × 1

Y or G with sync 1.0 Vp-p (75 Ω)

Y or G without sync 0.7 Vp-p (75 Ω)

PB/CB/B: 0.7 Vp-p (75 Ω)

PR/CR/R: 0.7 Vp-p (75 Ω)

TTL high impedance, positive polarity / 

negative polarity (automatic)

0.5 Vrms, Shared with DVI-D IN

SERIAL

External Control Terminal

D-sub 9 Pin

RS-232C compatible

PC OUT

R: 0.7 Vp-p (75 Ω)

G: 0.7 Vp-p (75 Ω)

B: 0.7 Vp-p (75 Ω)

HD/VD: 1.0 - 5.0 Vp-p

USB (VIEWER)

TYPE A USB connector

USB (TOUCH)

TYPE B USB connector

DIGITAL LINK / LAN

For RJ45 network and DIGITAL LINK connections, compatible with PJLink™

Communication method: RJ45 100BASE-TX

EXT SP

8 Ω, 20 W [10 W + 10 W] (10 % THD)

Speakers

120 mm × 40 mm × 2 pcs

Audio Output

20 W [10 W + 10 W] (10 % THD)

1,868 mm × 1,093 mm × 104 mm / 73.6” × 43.1” × 4.1”

approx. 81.0 kg / 178.6 lbs net