Panasonic TH-80BF1U / TH-80BF1W / TH-80BF1E Service Manual ▷ View online
5
PREFACE
<80BF1>
5
TH-50LFC70U/TH-50LFC70W
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
to damage an ES device).
2. Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive
(ES) Devices
(ES) Devices
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PREFACE
<80BF1>
6
TH-50LFC70U/TH-50LFC70W
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
suggest the use of Pb free solder as well, although Pb solder may be used.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
2.2. About lead free solder (PbF)
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PREFACE
<80BF1>
3. Specifications
106
Specifications
TH-80BF1U
TH-80BF1E / TH-80BF1W
Power Source
110 - 127 V ~ (110 - 127 V alternating current),
50/60Hz
220 - 240 V ~ (220 - 240 V alternating current),
50/60Hz
Power Consumption
Power on
350 W
350 W
Stand-by condition
0.5 W
0.5 W
Power off condition
0.3 W
0.3 W
LCD Display panel
80-inch VA panel (LED backlight), 16:9 aspect ratio
Screen size
1,771 mm (W) × 996 mm (H) × 2,032 mm (diagonal) /
69.7” (W) × 39.2” (H) × 80.0” (diagonal)
(No.of pixels)
2,073,600 (1,920 (W) ×1,080 (H))
[5,760 × 1,080 dots]
Operating condition
Temperature
32 °F - 104 °F (0 °C - 40 °C)
Humidity
20 % - 80 % (no condensation)
Applicable signals
Colour System
NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format
525 (480) / 60i · 60p, 625 (575) / 50i · 50p, 750 (720) / 60p · 50p, 1125 (1080) / 60i · 60p · 50i ·
50p · 24p · 25p · 30p · 24psF, 1250 (1080) / 50i
PC signals
VGA, SVGA, XGA, SXGA
UXGA ···· (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
AV IN
VIDEO
AUDIO 1 IN
BNC
Stereo mini jack (M3) × 1
1.0 Vp-p (75 Ω)
0.5 Vrms, Shared with COMPONENT/RGB IN
HDMI 1
HDMI 2
TYPE A Connector × 2
COMPONENT/RGB IN
Y/G
PB/CB/B
PR/CR/R
AUDIO 1 IN
BNC
BNC
BNC
Stereo mini jack (M3) × 1
with sync 1.0 Vp-p (75 Ω)
0.7 Vp-p (75 Ω)
0.7 Vp-p (75 Ω)
0.5 Vrms, Shared with VIDEO
DVI-D IN
AUDIO 2 IN
DVI-D 24 Pin
Content Protection
Stereo mini jack (M3) × 1
Compliance with DVI Revision 1.0
Compatible with HDCP 1.1
0.5 Vrms, Shared with PC IN
PC IN
AUDIO 2 IN
High-Density Mini D-sub 15 Pin
Stereo mini jack (M3) × 1
Y or G with sync 1.0 Vp-p (75 Ω)
Y or G without sync 0.7 Vp-p (75 Ω)
PB/CB/B: 0.7 Vp-p (75 Ω)
PR/CR/R: 0.7 Vp-p (75 Ω)
TTL high impedance, positive polarity /
negative polarity (automatic)
0.5 Vrms, Shared with DVI-D IN
SERIAL
External Control Terminal
D-sub 9 Pin
RS-232C compatible
PC OUT
R: 0.7 Vp-p (75 Ω)
G: 0.7 Vp-p (75 Ω)
B: 0.7 Vp-p (75 Ω)
HD/VD: 1.0 - 5.0 Vp-p
USB (VIEWER)
TYPE A USB connector
USB (TOUCH)
TYPE B USB connector
DIGITAL LINK / LAN
For RJ45 network and DIGITAL LINK connections, compatible with PJLink™
Communication method: RJ45 100BASE-TX
EXT SP
8 Ω, 20 W [10 W + 10 W] (10 % THD)
Sound
Speakers
120 mm × 40 mm × 2 pcs
Audio Output
20 W [10 W + 10 W] (10 % THD)
Dimensions (W × H × D)
1,868 mm × 1,093 mm × 104 mm / 73.6” × 43.1” × 4.1”
Mass (weight)
approx. 81.0 kg / 178.6 lbs net
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PREFACE
<80BF1>
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