Panasonic KX-TGA914EXS Service Manual ▷ View online
5
KX-TGA914EXS
2.1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-
als.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-
als.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.1.2.
How to Recognize that Pb Free Solder is Used
(Example: Main P. C. B.)
(Flow Solder Side View)
Note:
The location of the “PbF” mark is subject to change without notice.
PbF
Marked
KX-TGA914
PQUP11446Z
A
6
KX-TGA914EXS
3 Specifications
7
KX-TGA914EXS
4 Technical Descriptions
4.1.
Block Diagram (Camera Unit)
KX-TGA914 BLOCK DIA
GRAM
IC5
Flas
h ROM(
4M b
it
)
IC1
BBI
C
IC
105
RF mo
d
ule
EEP ROM
SCL2
*S
ENS
O
R
_
R
ES
ET
PS1
*A
C
S
0
*REA
D
*WRI
TE
AD1
^
AD1
8
DAB
0
^
DAB
1
5
P
1[0]
SDA
SDA1
SCL2
SCL
P
0[5]
WP
JT
IO
CMOS
Im
age censo
r
*C
E
*O
E
*WE
A0
^
A
1
7
DQ0
^
DQ1
5
SDA2
RFC
LKd
P
1[1]
PS2
P
1[5]
P
3[6]
SE
N
S
OR
_M
AIN
_CLK
SE
N
S
OR
_SCL
SE
N
S
OR
_SDA
Power voltage
d
e
tect
io
n I
C
(P
o
wer vo
lt
ag
e: 2.2 V)
RS
Tn
TD
O
RD
I
SK
SIO
LE
R
SSI
UT
X
URX
JTA
G
Call SW
P
3[4]
P
3[5]
P
2[1]
2.7v
1.8v
SW2
IC4
Q7
P
2[0]
Q5
Q6
D2
DCP (6.5 V)
Q8
Q9
IC2
JK2
X1
10.368MH
8
KX-TGA914EXS
4.2.
Circuit Operation (Camera Unit)
4.2.1.
Outline
Camera Unit consists of the following ICs as shown in Block Diagram (Camera Unit) (P.7).
• DECT BBIC (Base Band IC): IC1
- Handling all the audio, signal and data processing needed in a DECT camera unit
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- Echo-cancellation and Echo-suppression (DSP section)
- Registration tone generation (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.)
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- Echo-cancellation and Echo-suppression (DSP section)
- Registration tone generation (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.)
• RF Module: IC105
- PLL Oscillator
- Detector
- Compress/Expander
- First Mixer
- Amplifier for transmission and reception
- Detector
- Compress/Expander
- First Mixer
- Amplifier for transmission and reception
• EEPROM: IC2
- Temporary operating parameters (for RF, etc.)
• FLASH MEMORY: IC5
• Reset IC: IC4
• Reset IC: IC4
- +2.2 V reset
• Regulator IC: IC3
- +2.7 V regulator
• Regulator IC: IC104
- +2.5 V regulator
• Camera module,
- C-MOS image censor
- JPEG codec
- Signal processing
- JPEG codec
- Signal processing
• Additionally,
- Crystal Circuit (10.368MHz)
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