Panasonic PT-RZ670 / PT-RW630 (serv.man4) Service Manual / Other ▷ View online
SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
6. Unscrew 4pcs the remove FM^PCB and DMD chip.
[ Caution ]
・Do not touch on the connection pads of interposer on FM-PCB.
・Do not touch on the chip surface and contacting pad of DMD.
・Do not touch on the chip surface and contacting pad of DMD.
[ Note for re-assembling ]
・ Screw up 4pcs in turn as show in the dwg. (torque : 50 - 60 N ・cm）
2.9. Removal of Rod (ASSY)
1. Remove the side cover (R) according to the section 2.4 "Removal of Side cover (L) / Side cover (R) / Front cover /
Rear cover.
2. Unscrew the 2 screws and remove the Radiator fan block.
3. Unscrew the 2 screws and remove the Liquid cooling tank plate.
FM-PCB
DMD chip
Interposer
Insulator
backer plate
①
②
③
④
Radiator fan block
Liquid cooling tank
(Upper）
4
2
2
DIS-13
SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
4. Deposition the radiator and liquid tank as shown in the dwg then unscres 3pcs & remove the rod unit.
2.10. Removal of Liqid Cooling Unit 1 / 2
1. Remove the Liquid cooling tank and Radiator according to the section 2.9 "Removal of Rod (ASSY).
2. Float the radiator block and then remove the fixing cover.
3. Unscrew the 3 screws and remove the Exhaust fan block.
4. Unscrew the 4 screws and remove the Liquid cooling pump 2.
（Torque:75±15 N・cm）
Rod (ASSY）
Exhaust fan block
Fixing cover
Liquid cooling pump 2 (Upper side)
3
3
4
DIS-14
SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
4. Unscrew the 4 screws and remove the Heat receiving plate 2.
And then remove the Liquid cooling unit 2 (upper side).
（Torque:75±15 N・cm）
[ caution for re-assembling ]
1) Evenly put the heat compound on the rear surface of heat absob jacket.
2) Place correctly with the position confirming projection.
5. Remove liquid cooling system-2 (lower) by the same process of liquid cooling system-2.
2.11. Removal of LD unit
1. Remove the Liquid cooling tank and Radiator according to the section 2.10 "Removal of Liquid Cooling Unit 1/2".
2. Unscrew the 4 screws and remove the LD block (LD2-3/LD2-4).
3. Unscrew the 4 screws and remove the LD block (LD2-1/LD2-2).
4. Remove the LD block of lighting block 1 (lower side) at the same procedure.
Heat receiving plate 2 (Upper)
Put heat compound
Position confirming projectioin
ＬＤ Block
(LD2-3/LD2-3)
(LD2-3/LD2-3)
LD Block
(LD2-1/LD2-2)
(LD2-1/LD2-2)
1
3
4
1
3
Heat compound : Shinnetsu Silicon X-23-7898D
DIS-15
SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
5. Unscrew the 5 screws and remove the LD unit from Heat spreader.
（Torque:25～35 N・cm）
[ Note for re-assembly ]
・ Evenly put heat compound on the rear surface of each LD unit.
2.12. Removal of Phosphor Wheel 1 / 2
1.Follow process till 2.9
2. Unscrew 3pcs then remove analysis block 2 (UPPER).
3. Unscrew 2pcs the remove RT-PCB
Lighting block 2
RT-P.C.Board
ＬＤ unit
Heat compound
4
3
2
Heat spreader
Heat Compound : Shinnetsu Silicon (X-23-7898D)
DIS-16
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