Panasonic KX-TDA620BX (serv.man8) Service Manual / Supplement ▷ View online
37
KX-TDA620 Series
10.2. Back Board
1. Remove four Screws (A).
2. Remove the Left Side Cover and the Right Side Cover.
2. Remove the Left Side Cover and the Right Side Cover.
3. Release the Hook and remove the Top Cover.
4. Remove nine Screws (B).
5. Remove the Back Cover.
5. Remove the Back Cover.
38
KX-TDA620 Series
6. Remove the FAN Connector and LED Connector from Back
Board 1.
7. Remove eight Screws (C).
8. Remove the Back Board 1.
Board 1.
7. Remove eight Screws (C).
8. Remove the Back Board 1.
9. Remove the LED Connector from the LED Board.
10. Remove the Screw (C).
11. Remove the LED Board.
10. Remove the Screw (C).
11. Remove the LED Board.
39
KX-TDA620 Series
11 Miscellaneous
11.1. How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
11.1.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
0.82.
Type
RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4).
11.1.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
11.1.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
11.1.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
40
KX-TDA620 Series
12 Schematic Diagram
12.1. BUS-S Block Diagram
CP
U
SH4
IC200
FL
A
S
H
4M
B
S
D
RA
M
16M
B
SR
A
M
Main_BUS
1M
B
AS
IC
IC101
E
C_BUS
CT_BUS
LED
Ad
d
/D
a
ta
Dr
iv
er
3.3V
1.5V
OS
C
16M
90
pi
n
16.384MHz
Ci
rc
-
Li
n
k
IC
401
OSC40M
LVDS
RS
T
I
C
3.3V
Sy
s
te
m
T
S
W
IC501
LVDS
SH
W
U
[2
:0
]
C
P
U_
S
T
A
T
US
[1
:0
]
SH
W
_
C
L
K
,SH
W
_
n
F
H
CPLD
IC
402
1/2
+1
5V
GN
D
3.3V
_B
B
EC
_C
L
K
EC
_nR
S
T
EC
_A
D
[15:
0
]
E
C
_
CBE
[1
:0
]
EC
_P
A
R
EC
_nF
R
A
ME
EC
_nT
R
D
Y
EC
_nS
T
O
P
EC
_nP
ER
R
EC
_nC
D
E
T
EC
_nI
N
T
EC
_I
DS
E
L
CT
_
N
E
T
RE
F
C
T
_D
[7
:0
]
C
T
_C
8
RI
N
G
E
R
n
HALT
PO
W
_
T
Y
PE
[1
:0
]
M/nS
MA
S
T
E
R
/nS
LE
D
R
UN
LE
D
A
LM
nB
A
T
T
nL
O
S
_B
B
n
S
L
F
F
A
N_
AL
M
nF
A
N
_
A
L
M
DC
_
A
L
M
AC
_
A
LM
R
IN
G
_
S
YNC
S
H
W
D
0_P
/N
S
H
W
D
1_P
/N
S
H
W
D
2_P
/N
S
H
W
U
0_P
/N
S
H
W
U
1_P
/N
S
H
W
U
2_P
/N
S_
R
IN
G
S
Y
N
C
_
P
/N
S_
n
R
ESET_
P/
N
SH
W
_
C
L
K
_
P/
N
SH
W
_
n
F
H
_
P/
N
CT
_
N
E
T
RE
F
_
P
/N
CC
L
IN
K
_
P
/N
nL
O
S
_P
/N
C
P
U_
S
T
A
T
US
0
_
P
/N
C
P
U_
S
T
A
T
US
1
_
P
/N
nS
L
F
_
P
R
S
S_
ESL
F
ID
[1
:0
]
SH
W
D
[2
:0
]
IC
113
X102
nCS4
L_nWE
L_nRD
L_nLB/UB
L_ADD[16:1]
L_nWE
L_nRD
L_nLB/UB
L_ADD[16:1]
L_DATA[15:0]
nCS0
L_nWE0
L_nRD
L_nLB/UB
L_ADD[16:1]
L_nWE0
L_nRD
L_nLB/UB
L_ADD[16:1]
L_DATA[15:0]
ADD[22:17]
L_DATA[15:0]
L_nRD
L_nWE0
L_ADD[16:1]
L_nWE1
L_nWE
L_R/nW
L
_
DAT
A[
1
5
:0
]
L
_
AD
D[
1
5
:0
]
nC
S
4
nC
S
5
nR
D
L
_
nW
E
[1:
0]
nB
S
n
W
AI
T
_
AS
IC
C
L
K
_16
M
nCS_CCLINK
L_nRD
L_nRD
nWR_CCLINK
L_ADD[5:1]
L_DATA[15:0]
nIRQ_CCLINK
CC
L
IN
K
_
R
XD
C
C
L
INK
_
T
XD
C
C
L
IN
K
_T
X
E
N
nDTACK
C
L
K
_20
M
CLK_40M
X
401
nDS
L_R/nW
L_R/nW
nCS_CTSW
L_ADD[14:1]
L_DATA[15:0]
C
T
_C
8,
C
T
_F
R
A
M
E
C
T
_D
[7
:0
]
DATA[15:0]
nRD
nWE0
ADD[16:1]
nWE1
RD/nWR
C
T
S
W
_E
N
IC
304
IC
303
IC
301,302
RI
NG_
S
Y
N
C
E
S
L
F
ID
[1:
0]
BM
_
n
R
E
S
E
T
S_
ESL
F
ID
[1
:0
]
S
_
RI
NG_
S
Y
N
C
S_
n
R
ESET
nL
O
S
n
C
S
_
CCL
IN
K
L_
n
W
E
nC
S
_
C
T
S
W
L_
n
R
D
L_
R
/n
W
nD
T
A
C
K
n
W
AI
T
_
NE
X
U
S
nC
S
5
n
W
R
_
CCL
IN
K
nD
S
nR
D
Y
nI
R
Q
_A
S
IC
n
IRQ
_
CCL
IN
K
nD
C
_
A
L
M
SS IC
IC
202
DATA[31:0]
ADD[15:2]
nCS2
nRAS, nCAS
RD/nWR
DQM[3:0]
CL
KI
O
DATA[31:0]
ADD[16:1]
nCS2
nRAS, nCAS
RD/nWR
DQM[3:0]
nS
L
F
_
P
R
S
LVDS
DC
/D
C
IC
701
IC
703
IC
203
RI
NGE
R
HA
L
T
PO
W
T
Y
P
E
M
A
STER
/n
S
M/
n
S
LE
D
_
A
L
M
LE
D
_
R
U
N
To
C
P
U
nB
A
T
T
nL
O
S
_B
B
n
S
L
F
F
AN_
A
L
M
n
F
AN_
A
L
M
DC_
A
L
M
AC_
A
L
M
Li
-B
AT
3.
3
V
B
S
h
eet
6
S
h
eet
4
She
e
t 1
She
e
t 3
She
e
t 7
RE
G
15
V
S
h
eet
2
S
h
eet
5
40
CN601
pi
n
Local_BUS
BUS-S CARD BLOCK DIAGRAM
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