Panasonic KX-NT136RU Service Manual ▷ View online
11 TERMINAL GUIDE OF ICs, TRANSISTORS AND DIODES
41
KX-NT136RU
12.1. PREPARATION
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•
•
• PbF (: Pb free) Solder
•
•
•
• Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where
someone with less experience could overheat and damage
the PCB foil.
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where
someone with less experience could overheat and damage
the PCB foil.
•
•
•
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free)
(P.3).
(P.3).
12.2. PROCEDURE
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on the
PCB.
PCB.
Be certain each pin is located over the
correct pad on the PCB.
correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the
soldering iron along the tips of the pins while feeding
enough solder to the tip so that it flows under the pins as
they are heated.
enough solder to the tip so that it flows under the pins as
they are heated.
12.3. REMOVING SOLDER FROM
BETWEEN PINS
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part of
2. With a hot iron, use a sweeping motion along the flat part of
the pin to draw the solder from between the adjacent pads.
12 HOW TO REPLACE A FLAT PACKAGE IC
42
KX-NT136RU
13 CABINET AND ELECTRICAL PARTS LOCATION
43
KX-NT136RU
14 ACCESSORIES AND PACKING MATERIALS
44
KX-NT136RU
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