DOWNLOAD Panasonic KX-HDV230RU / KX-HDV230RUB Service Manual ↓ Size: 6.5 MB | Pages: 74 in PDF or view online for FREE

Model
KX-HDV230RU KX-HDV230RUB
Pages
74
Size
6.5 MB
Type
PDF
Document
Service Manual / Supplement
Brand
Device
PBX / SIP PHONE
File
kx-hdv230ru-kx-hdv230rub.pdf
Date

Panasonic KX-HDV230RU / KX-HDV230RUB Service Manual / Supplement ▷ View online

5
KX-HDV230 Series 
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.: 
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
2.3.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
6
KX-HDV230 Series 
3 Specifications
Item
Specifications
Power Supply
AC adaptor / PoE (IEEE 802.3af)
Power Consumption
PoE
Stand-by: approx. 3.1 W (ECO mode off), approx. 2.9 W (ECO
mode on)
Talking: approx. 3.2 W (ECO mode off), approx. 3.0 W (ECO mode
on)
AC Adaptor
Stand-by: approx. 2.8 W (ECO mode off), approx. 2.1 W (ECO
mode on)
Talking: approx. 2.9 W (ECO mode off), approx. 2.2 W (ECO mode
on)
Maximum Power Consumption
Approx. 4.2 W
Operating Environment
0 °C (32 °F) to 40 °C (104 °F)
Ethernet Port
LAN: 1 (RJ45), PC: 1 (RJ45)
Ethernet Interface
10Base-T/100Base-TX/1000Base-T
(Auto / 100MB-FULL / 100MB-HALF / 10MB-FULL / 10MB-HALF)
Auto MDI / MDIX
Wideband Codec
G.722
Narrowband Codec
G.711a-law / G.711μ-law / G.729a
Multiple Line
6
LCD Display
Main
Monochrome graphical
132 x 64 pixels, 4lines
LCD Backlight 3levels (Always ON/Automatic/Always Off)
Self-Label
Monochrome graphical
160 x 384 pixels, 12lines
LCD Backlight 3levels (Always ON/Automatic/Always Off)
LCD Backlight
6 levels (Always On/Automatic/Always Off)
VoIP Connection Method
SIP
Speaker
1
Microphone
1
Headset Jack
1 (RJ9)
EHS Jack
1 (ø3.5 mm [1/8 in], for EHS only)
Dimensions
(Width x  Depth x  Height;
stand attached)
"High" position:
252 mm x 179 mm x 188 mm
(9.9 in x 7.1 in x 7.4 in)
"Low" position:
252 mm x 187 mm x 154 mm
(9.9 in x 7.4 in x 6.1 in)
Weight (with handset, handset
cord and stand)
1030 g (2.28 lb)
7
KX-HDV230 Series 
4 Technical Descriptions
4.1.
Block Diagram
DDR3 
1Gbyte 
+5V 
AFE 
RGMII 
DSPG DVF9929 
GPIO 
Flash 
1Gbyte 
RJ45 CON 
To LAN 
10/100/1000BASE-T 
Ethernet I/F 
12 
MHz 
TXD[3:0] 
CRS 
TX_CLK 
RX_DV 
RX_ER 
RXD[3:0] 
RX_CLK 
COL 
PHY_nRST 
MDC 
MDIO 
TX_EN 
Audio 
Main LCD 
䛆Self-Labeling PCB䛇㻌
LED 
Redx12,Bluex12 
MLCD_RST 
Backlight  
Main LCD 
HOOK SW 
HOOK_DET 
Key matrix 
x13 
Dinamic 
SPI(2) 
DDR IF 
+12V 
DC IN 
 802.3af 
PoE IC 
+48V 
PDN 
DC/DC 
Power supply 
DC/DC 
+1.5V 
ASIC_RST 
ASIC_CLK 
INT0 
I2C(1) 
I2C_SCL 
I2C_SDA 
HEADSET_MIN 
HEADSET_SPOUT 
Headset 
(EHS) 
BKLT1 
LCD_D0 
MLCD_CS 
LCD_CLK 
Detect 
Voltage 
CN 
RSTN 
+10.6V 
Xtal 
GPIO 
Gigabit 
Switch 
with PHY 
RJ45 CON 
To PC 
10/100/1000BASE-T 
P-1 
P_5 
P-0 
PULSE 
Trans 
PULSE 
Trans 
DC/DC 
+1.1V 
+3.3V 
PHY_INT 
INT 
Handset 
HSSPOUT 
HSMICIN 
CN 
+5V 
+1.5V 
+5/3.3V 
+3.3V 
CN 
SYMCLK 
INT 
MIC 
Speaker 
MIP/MIN 
SPP/SPN 
GPIO 
DC/DC 
+3.3V 
+3.3V 
+5V 
ASIC 
+5V 
䛆㻹㼍㼕㼚 PCB䛇㻌
Xtal 
Xtal 
25 
MHz 
NAND IF 
25MHz 
+3.3V 
+3.3V 
USB(1) 
USB(2) 
SPI(1) 
Internal +1.8V 
Internal +1.2V 
㻴㻰㼂㻞㻟㻜㻌
㻌㻌㻮㼘㼛㼏㼗㻌㻰㼕㼍㼓㼞㼍㼙㻌
EHS_DET 
EHS 
EHS_RX 
EHS_TX 
CN 
Photo- 
Coupler 
(J
abr
a &
  
Pl
a
n
tr
o
n
ic
s I
F
+5V 
Self-labeling LCD 
LCD_A0 
SLCD_RST 
Backlight  
Self Labeling 
 LCD 
BKLT2 
SLCD_CS 
+3.3V 
CN 
GPIO 
PWM0 
PWM1 
+1.5V 
CN 
DSS IF 
DSS_DN 
DSS_RST 
Static 
Ringer LED 
     Blue x1 
Key matrix 
x28 
Dinamic 
+5V
LED&KEY 
Static 
EHS 
GPIO 
+12V 
DSS_DP 
GPIO 
+12V (To DSS
DCIN0 
MICBIAS 
MICBIAS 
MICBIAS 
Change 
8
KX-HDV230 Series 
4.2.
Circuit Operations
4.2.1.
Main LCD Circuit
LCD data are output from pin C19 of IC101 to LCD module.
LCD contrast is set by electronic control in LCD module.
+3.3V of the power supply voltage is pressurized about four/three times in the LCD module and used as LCD driving voltage
(approx. 10V).
The driving voltage is observed at pin12(VLCDIN) of CN1.
The lighting of the backlight is controlled by Q403.
The PWM (Pulse Width Modulation) signal is output from IC101 (pin U13) pin and the brightness is changed according to its duty
ratio.
4.2.2.
Self Label LCD Circuit
LCD data are output from pin C19 of IC101 to LCD module.
LCD contrast is set by electronic control in LCD module.
+3.3V of the power supply voltage is pressurized about four/three times in the LCD module and used as LCD driving voltage
(approx. 16V).
The driving voltage is observed at pin1(VLCD) of CN2.
The lighting of the backlight is controlled by Q402.
The PWM (Pulse Width Modulation) signal is output from IC101 (pin V13) pin and the brightness is changed according to its duty
ratio.
MLCD_CS
LCD_DI
LCD_CLK
LCD_DO
MLCD_RST
MLCD_RST
LCD_DO
LCD_DI
LCD_CLK
MLCD_CS
CN1
1
CS0
2
RST
3
CD
4
SCL
5
SI
6
VDD
7
VSS
8
VB0+
9
VB0-
10
VB1-
11
VB1+
12
VLCDIN
R161
R163
R164
R165
C187
DG
R166
C191
C189
C190
3.3V
C188
DG
DG
DG
R162
L106
L107
L103
DG
C106
C105
DG
C108
C109
DG
C110
C192
C193
To Main LCD
D18
D17
C19
D19
G18
IC101
IC101
D420
MLCD_K
MLCD_A
5V
DG
L412
C497
DG
M
_
A
_
D
C
L
M
M
_
K
_
D
C
L
M
Q403
R443
R444
IC101
pin U13
C512
R440
LCD_DO
LCD_DI
LCD_CLK
R163
R164
DG
R162
L106
L107
C105
C108
C109
C192
C193
D18
D17
C19
IC101
IC101
IC101
pin U13
LCD_CLK
LCD_DI
SLCD_RST
SLCD_CS
LCD_DO
SLCD_RST
SLCD_CS
DG
R169
R168
3.3V
C167
DG
CN2
1
1
2
1
3
1
4
1
5
1
6
7
8
9
10
11
12
13
14
15
L102
C163
C161
C162
DG
C160
L105
C104
DG
R126
3.3V
H18
G17
R125
C164
To SelfLabel LCD
5V
C496
L413
DG
DG
M
_
A
_
D
C
L
S
SLCD_K_M
Q402
R441
R442
C511
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