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MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
Thomson.

US and foreign patents licensed from Dolby 
Laboratories.

US Model

Canadian Model

AEP Model

UK Model

E Model

Chinese Model

Model Name Using Similar Mechanism

NEW

DVD Mechanism Type

MG-612-187

Optical Pick-up Block Name

KHS-340B

2007L05-1
© 2007.12

– Continued on next page –

This product incorporates copyright protection 
technology that is protected by U.S. patents and 
other intellectual property rights. Use of this 
copyright protection technology must be 
authorized by Macrovision, and is intended for 
home and other limited viewing uses only unless 
otherwise authorized by Macrovision. Reverse 
engineering or disassembly is prohibited.

Manufactured under license from Dolby 
Laboratories.
“Dolby” and the double-D symbol are 
trademarks of Dolby Laboratories.

“DTS” and “DTS 2.0 + Digital Out” are 
trademarks of Digital Theater Systems, Inc.

Laser

Semiconductor laser

Signal format system

NTSC
(US, Canadian models)
PAL 
(AEP, UK, Russian models)
PAL/NTSC switchable 
(E, Chinese model)

*

Signal-to-noise ratio

120 dB

Frequency response

10 – 20,000 Hz

Wow and flutter

Below measurable limit

Harmonic distortion (DVD)

0.01%

Wow and flutter

Less than detected value 
(

±0.001 % W PEAK)

*

Measured from the AUDIO OUT jacks. 
When you play PCM sound tracks with a 96 kHz 
sampling frequency, the output signals from the 
DIGITAL OUT jack are converted to 96 kHz 
sampling frequency.

Tuning range

Antenna terminal

External antenna connector

Intermediate frequency

10.7 MHz/450 kHz

Usable sensitivity

9 dBf

Selectivity

75 dB at 400 kHz

Signal-to-noise ratio

67 dB (stereo), 69 dB 
(mono)

Harmonic distortion at 1 kHz

0.5 % (stereo),
0.3 % (mono)

Separation

35 dB at 1 kHz

Frequency response

30 – 15,000 Hz

POWER OUTPUT AND TOTAL HARMONIC 
DISTORTION
23.2 watts per channel minimum continuous 
average power into 4 ohms, 4 channels driven 
from 20 Hz to 20 kHz with no more than 5% total 
harmonic distortion.

CEA2006 Standard
Power Output: 17 Watts RMS 

× 4 at 

4 Ohms < 1% THD+N 
SN Ratio: 82 dBA 
(reference: 1 Watt into 4 Ohms)

AEP, UK, Russian, 
Asian models: 

US, Canadian, 
Latin American models:
87.5 – 107.9 MHz

87.5 – 108.0 MHz

Tuning range

US, Canadian, 
Latin American models:

(at 10 kHz step)
AEP, UK, Russian models:

530 – 1,710 kHz 

MW: 531 – 1,602 kHz 

Asian model:
531 – 1,602 kHz 

LW: 153 – 279 kHz 

(at 9 kHz step)

Antenna terminal

External antenna connector

Intermediate frequency

10.7 MHz/450 kHz

LW: 40 

µV

Sensitivity

AM (MW): 30 

µV, 

•

E model and Chinese model are the multi disc player in XMM-R5WL.

2

Outputs

Speaker outputs (sure seal 
connectors)

Speaker impedance

 4 – 8 ohms

Maximum power output

52 W 

× 4 (at 4 ohms)

(AEP, UK, Russian models)

10 dBm 

UK, Russian models)

Transmission frequencies 2,414, 2,432, 2,450, 

2,468 MHz

Modulation method

FM modulation

RF output power

–1.2 dBm (Except AEP, 

Outputs

Front audio/video output 
terminals
Rear audio output terminal
Subwoofer output terminal 
(mono)
Optical digital output 
terminal
Power antenna relay control 
terminal
Power amplifier control 
terminal

Inputs

Telephone ATT control 
terminal
Illumination control 
terminal
BUS control input terminal
BUS audio input/AUX IN 
terminal
Parking break control 
terminal
Remote controller input 
terminal
Antenna input terminal

Tone controls

Bass: 

±8 dB at 100 Hz

Treble: 

±8 dB at 10 kHz

Loudness

+8 dB at 100 Hz
+2 dB at 10 kHz

Power requirements

12 V DC car battery 
(negative ground)

Dimensions

Approx. 178 

× 50 × 182 mm 

(7 

1

/

8

 × 2 × 

1

/

4

 in) (w/h/d)

Mounting dimensions

Approx. 182 

× 53 × 161 mm 

(7 

1

/

4

 × 2 

1

/

8

 

× 6 

3

/

8 

in) 

(w/h/d)

Mass

Approx. 1.3 kg (2 lb 14 oz)

Supplied accessories

Card remote commander 

RM-X704
(US, Canadian models)

RM-X702 (E, Chinese model)
RM-X703 
(AEP, UK, Russian models)

Parts for installation and 
connections (1 set)
Front panel case (1)

Note
This unit cannot be connected to a digital preamplifier 
or an equalizer which is Sony BUS system compatible.

Design and specifications are subject to change 
without notice.

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of the soldering iron around 270 ˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

The use of optical instruments with this
product will increase eye hazard.

This label is located on the drive unit's internal
chassis

This label is located on the bottom of the
chassis.

-

This label is located on the drive unit’s internal
chassis.

0

 0

0

3

...............................................

4

...................................................................

7

3-1.

Disassembly Flow ........................................................... 12

3-2.

Sub Panel Complete Assy ................................................ 12

3-3.

DVD Mechanism Deck (MG-612-187) ........................... 12

3-4.

MAIN Board, DC Fan (25 

×

 25) (M901) ........................ 13

3-5.

Chassis (T) Sub Assy ....................................................... 13

3-6.

Roller Arm Assy .............................................................. 14

3-7.

Chassis (OP-DVD) Complete Assy ................................. 14

3-8.

Chassis (OP-DVD) Sub Assy .......................................... 15

3-9.

LE Motor Assy (Loading) (M3) ...................................... 15

3-10. SERVO Board .................................................................. 16
3-11. Front Back Panel (LCD) .................................................. 16
3-12. BASE Board .................................................................... 17
3-13. Display Section ................................................................ 17
3-14. Bracket (Display) ............................................................ 18
3-15. Spring (S) ........................................................................ 18

......................... 19

5-1.

Block Diagram – SERVO Section – ................................ 20

5-2.

Block Diagram – AUDIO Section – ................................ 21

5-3.

Block Diagram – MAIN Section – .................................. 22

5-4.

Printed Wiring Board 

−

 SERVO Section (1/2) 

− .............

24

5-5.

Printed Wiring Boards 

−

 SERVO Section (2/2) 

− ...........

25

5-6.

Schematic Diagram 

−

 SERVO Section (1/3) 

−................

26

6-7.

Schematic Diagram 

−

 SERVO Section (2/3) 

−................

27

6-8.

Schematic Diagram 

−

 SERVO Section (3/3) 

−................

28

6-9.

Schematic Diagram – MAIN Section (1/3) – .................. 29

5-10. Schematic Diagram – MAIN Section (2/3) – .................. 30
5-11. Schematic Diagram – MAIN Section (3/3) – .................. 31
5-12. Printed Wiring Board 

−

 MAIN Section (1/2) 

− ...............

32

5-13. Printed Wiring Boards 

−

 MAIN Section (2/2) 

− .............

33

5-14. Printed Wiring Board 

−

 BASE Board 

− ..........................

34

5-15. Schematic Diagram – BASE Board – ............................. 35
5-16. Printed Wiring Board 

−

 DISPLAY Board 

− ....................

36

5-17. Schematic Diagram – DISPLAY Board – ....................... 37
5-18. Printed Wiring Board 

−

 PRESET Board 

− ......................

38

5-19. Schematic Diagram – PRESET Board – ......................... 38
5-20. Printed Wiring Board 

−

 SUB Board 

− .............................

39

5-21. Schematic Diagram – SUB Board – ................................ 39

6-1.

General Section ............................................................... 58

6-2.

Front Panel Section ......................................................... 59

6-3.

DVD Mechanism Deck Section-1 (MG-612-187) .......... 60

6-4.

DVD Mechanism Deck Section-2 (MG-612-187) .......... 61

6-3.

DVD Mechanism Deck Section-3 (MG-612-187) .......... 62

................................ 63

4

Label indication

Signal format

Region

Part No.

Destination

system

code

NTSC

1

2-631-964-01 US, Canadian models

PAL

2

2-631-969-01 AEP, UK models

PAL

5

2-638-206-01 Russian model

PAL

3

2-634-525-01 E: PAL model

NTSC

4

2-634-528-01 E: NTSC model

PAL

6

2-639-072-01 Chinese model

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

•

Unleaded solder melts at a temperature about 40 ˚C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

When connecting or disconnecting the flexible board of the optical
pick-up to or from the CN2 of the SERVO board, follow the
procedure given below.

When soldering the short lands, solder within 5 seconds at the
temperature of soldering iron below 300

°

C.

1. Solder the lands 3 and 2 to short.
2. Solder the lands 1 and 2 to short.
3. Disconnect the flexible board. (Unsolder the shorted lands)

1. Make sure that the lands 1, 2, and 3 of the flexible board to be

connected are soldered to short. 

(*1)

2. Connect the flexible board to the CN2 of the SERVO board.
3. Unsolder the lands 1 and 2. 

(*2)

4. Unsolder the lands 3 and 2. 

(*2)

5. Make sure that the respective lands are open surely.

*1)

If the lands concerned are not soldered to short, first solder the lands
3 and 2, and then lands 1 and 2 to short in this order.

*2)

When unsoldering the lands, move the soldering iron in bottom to
top direction in Figure 1 so that the solder runs away into the land 4
(solder reservoir) for easy unsoldering.

This set detects whether the front panel is opened or closed by using
the S961 of the BASE board. If the BASE board is disconnected,
the S961 is turned off (panel closed status) and the disc is not ejected.
To  perform the disc ejecting operation with the BASE board
disconnected, turn on the S961.

If the mounted MAIN board was replaced, be sure refer to Technical
News published separately.

Part Number

Region Code

4

2

1

Flexible board of
the optical pick-up

SERVO board CN2

3