DOWNLOAD Panasonic KX-HDV130RU / RUB Service Manual ↓ Size: 5.87 MB | Pages: 62 in PDF or view online for FREE

5

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

• PbF solder has a melting point that is 50 

F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 

F ± 20 F (370 C ± 10 C).

• Exercise care while using higher temperature soldering irons.: 

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 

F (600 C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

6

7

AFE

RMII

DSPG DVF97

GPIO

SDRAM

256M bit

Serial Flash

256Mbit

RJ45 

To LAN

PoE

10/100BASE -T

Ethernet I/F

TXD[ 1:0]

CRS

TX_CLK (50M)

RXD[ 1:0]

PHY_nRST

MDC

MDIO

TX_EN

Audio

LED 

HOOK SW

HOOK_DET

HDV130

Block Diagram

Key matrix

(32Key)

MPMC

+6.5V
DC IN

802.3af

PoE IC

+48V

Power supply

KEY
(GPIO)

6 x 6 matrix

RSTN

+8V

GPIO

Fast

L2 Switch

with PHY

RJ45

To PC

10/100BASE -T

P_1

P_0

PULSE

Trans

PULSE

Trans

+3.3V

Handset

HSSPOUT

HSMICIN

+6V

MIC

Speaker

MIP/MIN

SPP/SPN

DC/DC

+3.3V

+3.3V

UART(1)

MICBIAS

LED&KEY

Xtal

25

MHz

QSPI IF

MICBIAS

+3.3V

For TEST

Internal +1.8V
Internal +1.2V

+3.3V

+1.8V

DCIN0

Detect

Voltage

Static

HEADSET_MIN

HEADSET_SPOUT

Headset

RJ9

For DEBUG

RJ9

25M

CLK_OUT

+6V

LCD

LCD_CS

LCD_RST

LCD

SPI(2)

LCD_RS

LCD_SCL

LCD_DO

+3.3V

CN

GPIO

Backlight 

BKLT1

PWM0

UART( 2)

x2piece

8

LCD data are output from pin 

139

 of IC302 to LCD module.

LCD contrast is set by electronic control in LCD module.
+3.3V of the power supply voltage is pressurized about four/three times in the LCD module and used as LCD driving voltage
(approx. 10V).
The driving voltage is observed at pin12(VLCDIN) of CN2.

The lighting of the backlight is controlled by Q301.
The PWM (Pulse Width Modulation) signal is output from IC302 (pin 

102

) pin and the brightness is changed according to its duty

ratio.

Reset Signal is output from IC301 and input into IC302-pin 16.

1

2

4

3

5

1

2

4

3

5

To Pin 138 (SPICS) of IC302 

To Pin 145 (GPIO23) of IC302 

6

To Pin 102 (PWM0) of IC302 

To Pin 57 (SPICK) of IC302 

To Pin 58 (SPIDI) of IC302 

To Pin 139 (SPIDO) of IC302 

6

C130 

C131

R116

C134

CN2

1

CS0

2

RST

3

CD

4

SCL

5

SI

6

VDD

7

VSS

8

VB0+

9

VB0-

10

VB1-

11

VB1+

12

VLCDIN

DGND

R135

DGND

3.3V

DGND

C132

C129

DGND

R142

R141

R140

R139

L106

R137   

L108

L110

L111

C136

DGND

DGND

C137

To LCD

Q301

4.7k

47k

DGND

BL_A

DGND

Q302

5

3

4

2

6

1

BL_K

R329

R330

LED_VDD

BLB_KBLB_A

D311

R305

DGND

C326

C327

VDD3.3V

DGND

IC301

1

VSS

2

VDD

3

CD

4

OUT

DC_POWER

PWR_RST

IC302

RSTN

16

DGND

C328