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Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor 

 components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only  an antistatic solder removal device. Some solder removal devices not classified as 

 can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
CAUTION:

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).

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The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.  

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86 

°F) more than that

of the normal solder.

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

• (Definition: The letter of 

 is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86 

°F).

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)

* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of 

 is printed either foil side or components side on the PCB using the lead free solder.

(See right figure)

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1. Remove the Side (L) P.C.B.. (Refer to Disassembly Procedures.)

2. Unsolder the Lithium Battery 

 and then replace the new one. (See Figure B1.)

3. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type.

Fig. B1

The lithium battery is a critical component. (Type No.: ML-621S/F9D)
It must never be subjected to excessive heat or discharge.
It must therefore only be fitted in equipment designed specifically for its use.
Replacement batteries must be of the same type and manufacture.
They must be fitted in the same manner and location as the original battery, with the correct polarity contacts observed.
Do not attempt to re-charge the old battery or re-use it for any other purpose.
It should be disposed of in waste products destined for burial rather than incineration.

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This service manual contains technical information which will allow service personnel's to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.
If the circuit is changed or modified, this information will be followed by supplement service manual to be filed with original service
manual.
Note 1:

These movie camera uses AC Adaptor VSK0644.

1) This service manual does not contain the following information, because of the impossibility of sevicing at component level.

1. Schematic Diagram, Block Diagram and P.C.B. layout of Main P.C.B./Sub P.C.B.
2. Parts List for individual parts of Main P.C.B./Sub P.C.B.

2) The following category are recycle module part. Please send them to Central Repair Center.

*Main P.C.B. 

(VEP03G87K: NV-GS500EG/E/EB/EP, VEP03G87L: NV-GS500EE/GC/GN/SG, VEP03G87M: NV-GS508GK,

VEP03G87Q: NV-GS500GT, VEP03G87R: NV-GS500PL, VEP03G87U: NV-GS500GCT)

*Sub P.C.B.

(VEP23646B: NV-GS500EG/E/EB/EP/EE/GC/GN/SG/GCT, GS508GK, VEP23646C: NV-GS500PL/GT)

When a part replacement is required for repairing each Main P.C.B. and/or Sub P.C.B., replace the assembly parts.
(Main P.C.B. and/or Sub P.C.B.)
The following circuits are contained in Main P.C.B.

1. Main Connection Circuit
2. AVIO Circuit
3. Video Circuit
4. Power Circuit
5. Control Circuit

The following circuit is contained in Sub P.C.B..

1. Sub Connection Circuit
2. Camera Circuit
3. Lens Drive Circuit

Remove the Front P.C.B.. (Refer to Disassembly Procedures.)

When the Main P.C.B. is replaced, the fixed and average data must be changed by Tatsujin kit according to the Movie Camera’s suf-
fix.
Then, confirm and/or adjust the VTR and Camera section one by one.