DOWNLOAD Panasonic KX-FLC413RU Service Manual ↓ Size: 8.86 MB | Pages: 127 in PDF or view online for FREE

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• To extend the life of the drum unit, the unit should never be turned OFF immediately after printing. Leave the power turned ON

for a minimum of 30 minutes after printing.

• In the printing process, heat is used to fuse toner onto the page. As a result, it is normal for the machine to produce an odor dur-

ing and shortly after printing. Be sure to use this unit in an area with proper ventilation.

• Do not cover slots or openings on the unit. Inspect the air circulation vents regularly and remove any dust build-up with a vacuum

cleaner.

• If the inside of the unit is dirty, clean it with a soft and dry cloth (especially the lower glass).
• When replacing the toner cartridge or drum unit, do not allow dust, water, or liquids to come in contact with the drum. This may

affect print quality.

• Store unused paper in the original packaging, in a cool and dry place. Not doing so may affect print quality.
• Do not place the unit in an area where the paper tray may be obstructed (i.e., by a wall,etc.).

• Keep the air circulation vents away from walls etc.more than 50 mm (1 31 / ") to let the unit cool down.

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In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.

We will use PbF solder  when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

• PbF solder has a melting point that is 50

° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-

ture control and adjust it to 700

° ± 20° F, (370° ± 10°C).

• Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder

splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F, (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

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1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with an ohmmeter between the jumpered AC plug and each exposed metal cabinet part

(screw heads, control shafts, bottom frame, etc.).
Note: Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of a shock hazard.

There is a danger of explosion if the battery is incorrectly replaced. Replace only with the same or equivalent type recom-
mended by the manufacturer. Dispose used batteries according to the manufacturerís instructions:
The lithium battery is a critical component (type No. CR-2032/V9A). Please observe for the proper polarity and exact location
when replacing and soldering the replacement battery.

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* Transmission speed depends upon the contents of the pages, resolution, telephone line conditions and capability of the other 
party's machine.
** Transmission speed is based upon the ITU-T No. 1 Test Chart. (Refer to ITU-T No.1 Test Chart (P.259).) If the capability of the 
other party's machine is inferior to your unit, the transmission time may be longer.
*** If an error occurs during fax reception, such as a paper jam or if the recording paper runs out, the fax and subsequent faxes will
be retained in memory.
**** Recording time may be reduced by the calling party's background noise.
Note:

• Design and specifications are subject to change without notice.

• The pictures and illustrations in these instructions may vary slightly from the actual product.

Public Switched Telephone Network

Max. 216 mm in width
Max. 600 mm in length

208 mm

202mm

Approx.   8 s/page (ECM-MMR)**

Horizontal: 
8 pels/mm
Vertical: 
3.85 lines/mm -STANDARD
7.7 lines/mm -FINE/PHOTO/MIXED(PHOTO WITH TEXT)
15.4 lines/mm -SUPER FINE

64-level

Contact Image Sensor (CIS)

Laser printer

Modified Huffman (MH), Modified READ (MR), Modified, Modified READ (MMR)

14,400/12,000/9,600/7,200/4,800/2,400 bps; Automatic Fallback

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°C—32.5°C, 20—70% RH (Relative Humidity)

×W×D):

218 mm 

× 360 mm × 357 mm

Approx. 7.5 kg

Standby: Approx. 4 W
Transmission: Approx. 12W
Reception: Approx. 240 W
Copy: Approx. 240 W
Maximum: Approx. 950W (When the fuser lamp turns on)

220-240 V AC, 50/60Hz

Approx. 150 pages of memory transmission.
Approx. 40 pages of memory reception.
(Based on ITU-T No. 1 Test Chart in standard resolution.)

Approx. 15 minutes of recording time

Approx. 80 pages (Based on the ITU-T No. 1 Test Chart in fine resolution.)

Laser output: Max. 5 mW
Wave length: 760 nm—800 nm
Emission duration: Continuous

10 ppm (page per minute)

600 

× 600 dpi