DOWNLOAD Panasonic DMC-FT3EB / DMC-FT3EE / DMC-FT3EF / DMC-FT3EG / DMC-FT3EP / DMC-FT3GC / DMC-FT3GN / DMC-FT3SG / DMC-TS3P / DMC-TS3PC / DMC-TS3PU / DMC-TS3GH / DMC-TS3GD / DMC-TS3GT Service Manual ↓ Size: 6.61 MB | Pages: 75 in PDF or view online for FREE

9

This service manual contains technical information, which will allow service personnel's to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.
If the circuit is changed or modified, the information will be followed by service manual to be controlled with original service manual.

*1 This means that the camera can be used underwater for specified time in specified pressure in accordance with the handling
method established by Panasonic.
*2 "MIL-STD 810F Method 516.5-Shock" is the test method standard of the U.S. Defense Department, which specifies perform-
ing drop tests from a height of 122 cm (4.0 feet), at 26 orientations (8 corners, 12 ridges, 6 faces) using 5 sets of devices, and
passing the 26 orientation drops within 5 devices. (If failure occurs during the test, a new set is used to pass the drop orientation
test within a total of 5 devices) 
Panasonic’s test method is based on the above "MIL-STD 810F Method 516.5-Shock". However, the drop height was changed
from 122 cm (4.0 feet) to 200 cm (6.6 feet) dropping onto 3 cm (0.10 feet) thick plyboard. This drop test was passed. 
(Disregarding appearance change such as loss of paint or distortion of the part where drop impact is applied.)

• Due to the above characteristics of the products, perform the air-leak test (inspection) using Air -leak tester (Part No.:RFKZ0528)

before/after servicing including assembly and/or assembly process.
Note:

The purpose of the air-leak test before servicing is that whether the malfunction occurred due to air-leak or not.

• When servicing, refer to the "7.Troubleshooting" section for details.

• The integrity of the waterproof packing may decrease about 1 year, with use and age.

(We recommend end users to replace the waterproof packing (waterproof seal) at least once each year described in the operat-
ing instructions.)

• As for replacement procedure, refer to the 7.1.2. Periodical maintenance (Packing replacement) flow for details.

• Since the lens unit for this model is assembled with high accuracy manufacturing technologies, it is not allowed to disassemble/

assemble the lens unit, in terms of performance retention.
When servicing, it has to be handled the "Lens with CCD unit" as the smallest part size.
Confirm the replacement part list and exploded views for details.

Waterproof/Dustproof Performance
This camera's waterproof/dustproof rating complies with the "IPX8" and "IP6X" ratings. Provided the care and maintenance guidelines
described in this document are strictly followed, this camera can operate underwater, to a depth not exceeding 12 m (40 feet) for a time
not exceeding 60 minutes. (*1)
Anti-shock Performance
This camera also complies with "MIL-STD 810F Method 516.5-Shock". The camera has cleared a drop test from a height of 2 m (6.6
feet) onto 3 cm (0.10 feet) thick plywood. In most cases this camera should not sustain any damage if dropped from a height not exceed-
ing 2 m (6.6 feet). (*2)

10

When IC9301 is defects and necessary to be replaced, replace with whole TOP FPC UNIT as a unit.

1. The service manual does not contain the following information, because of the impossibility of servicing at component level

without concerned equipment/facilities.

a. Schematic diagram, Block Diagram and P.C.B. layout of MAIN P.C.B. 
b. Parts list for individual parts for MAIN P.C.B.

When a part replacement is required for repairing MAIN P.C.B., replace as an assembled parts. (MAIN P.C.B.)

11

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 

°C (86 °F) more than that of the

normal solder.
Definition of P.C.B. Lead Free Solder being used

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

• (Definition: The letter of 

 is printed on the P.C.B. using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the P.C.B. cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86 

°F).

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01KS-----------(0.3mm 100g Reel)
RFKZ06D01KS-----------(0.6mm 100g Reel)
RFKZ10D01KS-----------(1.0mm 100g Reel)

* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of 

 is printed either foil side or components side on the P.C.B. using the lead free solder.

(See right figure)

12

There are eight kinds of DMC-FT3/TS3, regardless of the colours. 

• a) DMC-FT3 (Japan domestic model.)/SG 
• b) DMC-TS3P/PC 
• c) DMC-FT3EB/EF/EG/EP 
• d) DMC-FT3EE 
• e) DMC-TS3GT 
• f ) DMC-FT3GN
• g) DMC-TS3GD 
• h) DMC-FT3GC, DMC-TS3GH/PU 

What is the difference is that the "INITIAL SETTINGS" data which is stored in Flash ROM mounted on Main P.C.B. 

To define the model suffix to be serviced, refer to the nameplate which is putted on the bottom side of the Unit.

After replacing the MAIN P.C.B., be sure to achieve adjustment. 
The Maintenance software (DIAS) is available at "software download" on the "Support Information from NWBG/VDBG-AVC"
web-site in "TSN system".