Panasonic SU-HTB570EB / SU-HTB570EG / SB-HTB570EG / SB-HWA570EB / SB-HWA570EG / SC-HTB570EB / SC-HTB570EG / SC-HTB570EGS Service Manual ▷ View online
9
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices.
trostatically Sensitive (ES) Devices.
The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge
(ESD).
(ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
ficient to damage an ES device).
10
2.2.
Service caution based on Legal restrictions (Lead Free Solder, (PbF))
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86
°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees
C (662±86
°F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
(See right figure)
11
3 Service Navigation
3.1.
Service Information
This service manual contains technical information which will allow service personnel’s to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.
Please place orders using the parts list and not the drawing reference numbers.
If the circuit is changed or modified, this information will be followed by supplement service manual to be filed with original service
manual.
manual.
• Flash IC :
The following components are supplied as an assembled part.
• Flash IC, IC2001 (RFKWEHTB370M).
12
4 Specifications
Q Amplifier Section
RMS Output Power : Dolby Digital Mode
Front ch (L, R ch)
RMS Output Power : Dolby Digital Mode
Front ch (L, R ch)
60 W per channel (6
Ω), 1 kHz,
10% THD
Subwoofer ch
120 W per channel (8
Ω), 100 Hz,
10% THD
Total RMS Dolby Digital mode
power
power
240 W
Q Wireless section
Wireless module
Frequency Range
Wireless module
Frequency Range
2.40335 GHz to 2.47735 GHz
Number of channels
38
Q Terminal Section
HDAVI Control
HDAVI Control
This unit supports “HDAVI Control
5” function.
HDMI AV input (BD/DVD)
1
Input connector
Type A (19 pin)
HDMI AV output (TV (ARC))
1
Output connector
Type A (19 pin)
Digital audio input
Optical digital input (TV, AUX)
Optical digital input (TV, AUX)
2
Sampling frequency
32 kHz, 44.1 kHz, 48 kHz
88.2 kHz, 96 kHz (only LPCM)
Audio format
LPCM, Dolby Digital, DTS Digital
Surround
IR Blaster
Terminal Type
Terminal Type
3.5 mm jack
USB Port
For service use only.
Q Speaker Section
Front speakers
3 way, 3 speaker system (Bass reflex type)
Speaker unit(s)
Front speakers
3 way, 3 speaker system (Bass reflex type)
Speaker unit(s)
Impedance 6
Ω
Woofer
5.7 cm cone type
Tweeter
2.5 cm semi-dome type
Super tweeter
Piezo type
Output sound pressure
78 dB/W (1 m)
Frequency range
90 Hz to 32 kHz (-16 dB)
100 Hz to 23 kHz (-10 dB)
Active subwoofer
1 way, 1 speaker system (Bass reflex type)
Woofer
1 way, 1 speaker system (Bass reflex type)
Woofer
16 cm cone type
Output sound pressure
80 dB/W (1 m)
Frequency range
30 Hz to 180 Hz (-16 dB)
35 Hz to 160 Hz (-10 dB)
35 Hz to 160 Hz (-10 dB)
Q General
Power consumption
Power consumption
Main Unit: 27 W
Active subwoofer: 19 W
In standby condition
Main Unit (When the other connected devices are turned off):
Main Unit (When the other connected devices are turned off):
Approx. 0.3 W
Active subwoofer (Power switch release):
Approx. 0.25 W
Power supply
AC 220 V to 240 V, 50 Hz
Dimensions (W x H x D)
Main Unit
Main Unit
310 mm x 45 mm x 188 mm
Active subwoofer
180 mm x 408 mm x 306 mm
Mass (Weight)
Main Unit
Main Unit
Approx. 1.15 kg
Active subwoofer
4.76 kg
Operating temperature range
0
°C to +40°C
Operating humidity range
20% to 80 % RH
(no condensation)
Q Speaker General
- For wall mounting layout
Horizontal placement
Dimensions (W x H x D)
- For wall mounting layout
Horizontal placement
Dimensions (W x H x D)
1060 mm x 68 mm x 41 mm
Mass (Weight)
1.49 kg
Vertical placement
Dimensions (W x H x D)
Dimensions (W x H x D)
68 mm x 541 mm x 41 mm
Mass (Weight)
0.78 kg
- For table top layout
Horizontal placement using the leg stands (High)
Dimensions (W x H x D)
Horizontal placement using the leg stands (High)
Dimensions (W x H x D)
1060 mm x 96 mm x 68 mm
Mass (Weight)
1.57 kg
Horizontal placement using the leg stands (Low)
Dimensions (W x H x D)
Dimensions (W x H x D)
1060 mm x 87 mm x 68 mm
Mass (Weight)
1.57 kg
Horizontal placement using the support legs and the speaker feet
Dimensions (W x H x D)
Dimensions (W x H x D)
1060 mm x 71 mm x 60 mm
Mass (Weight)
1.53 kg
Vertical placement using the bases
Dimensions (W x H x D)
Dimensions (W x H x D)
148 mm x 552 mm x 148 mm
Mass (Weight)
0.89 kg
Center Speaker
Q Bluetooth Section
Bluetooth system specification
Bluetooth system specification
Version 3.0
Wireless equipment classifica-
tion
tion
Class 2
Supported profiles
A2DP
Frequency band
2402 MHz to 2480 MHz
(Adaptive Frequency Hopping)
Operating distance
10 m Line of Sight
• Specifications are subject to change without notice. Weight and
dimensions are approximate.
• Total harmonic distortion is measured by the digital spectrum ana-
lyzer.
Q System: SC-HTB570EBS
MAIN UNIT : SU-HTB570EBS
FRONT SPEAKERS : SB-HTB570EGS
ACTIVE SUBWOOFER : SB-HWA570EBS
Q System: SC-HTB570EGS
MAIN UNIT : SU-HTB570EGS
FRONT SPEAKERS : SB-HTB570EGS
ACTIVE SUBWOOFER : SB-HWA570EGS
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