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Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called Electrostat-
ically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semicon-
ductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by
electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin-

ium foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize body motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).

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The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86

°F) more than that

of the normal solder.

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86

°F).

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)

* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)

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This service manual contains technical information which will allow service perssonnel’s to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.

If the circuit is changed or modified, this information will be followed by supplement service manual to be filed with original service
manual.

This model uses Switching Mode Power Supply (SMPS) Module for powering the receiver unit. It is replaceable as an assembly
unit. (Part No : N0AE3GJ00004) Do not attempt to repair or its component on board.

1. This Model uses Digital Transmitter Unit & Digital Receiver Module (Rx) P.C.B. for the wireless transmission of signals.
2. After replacement of either Digital Transmitter Unit or Digital Receiver Module (Rx) P.C.B., ID setting is required. 

Refer to section 6.1 Service Mode Table 1 for the procedures for ID setting.

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Q

Active subwoofer : 25 W

Digital transmitter : 1.2 W

Active subwoofer : Approx. 0.4 W

Power supply:
For EB, EE, EG, GN only

AC 220 V to 240 V, 50 Hz

For GS, PH only

AC 110 V to 240 V, 50/60 Hz

Dimensions (W x H x D):
Active subwoofer :

250 mm x 323 mm x 356 mm

Digital transmitter :

43.5 mm x 37.3 mm x 8.2 mm

Mass:
Active subwoofer :

Approx. 6.7 kg

Digital transmitter :

Approx. 0.0095 kg

0°C to +40°C

20% to 80% RH (no condensation)

Q

RMS Output Power
Subwoofer ch:

120 W per channel (8 

Ω), 100 Hz, 10% THD

Total RMS Dolby Digital mode power:

240 W

PMPO Output Power:

2100 W

For GS/PH only

Q

ACTIVE SUBWOOFER
Type:

1 way 1 speaker system (Kelton type)

Woofer:

16 cm Cone type

Passive radiator:

25 cm

Output sound pressure:

78 dB/W(1m)

Frequency range:

35 Hz to 180 Hz (-16dB)
40 Hz to 160 Hz (-10dB)

Note:
1. Specifications are subject to change without notice.
2. Total harmonic distortion is measured by the digital spectrum analyzer.