LG 55LEX8-SA (CHASSIS:LJ03S) Service Manual ▷ View online
5.4 EYE-Q function check
1) Turn on TV
2) Press EYE key of Adj. R/C
3) Cover the Eye Q II sensor on the front of the using your
3) Cover the Eye Q II sensor on the front of the using your
hand and wait for 6 seconds
4) Confirm that R/G/B value is lower than 10 of the “Raw Data
(Sensor data, Back lignt )” . If after 6 seconds, R/G/B value
is not lower than 10, replace Eye Q II sensor
is not lower than 10, replace Eye Q II sensor
5) Remove your hand from the Eye Q II sensor and wait for 6
seconds
6) Confirm that “ok” pop up.
If change is not seen, replace Eye Q II sensor
5.5 HDCP (High-Bandwidth Digital
Contents Protection) Setting
• No Need.
5.6 Test of RS-232C control.
Press In-Start button of Service Remocon then set the
“4.Baud Rate” to 115200. Then check RS-232C control and
“4.Baud Rate” to 115200. Then check RS-232C control and
5.7 Selection of Country option.
page.)
• Press “In-Start” button of Service Remocon, then enter the
“Option” Menu with “PIP CH-“ Button
• Select one of these three (USA, CANADA, MEXICO)
defends on its market using “Vol. +/-“button.
“Option” Menu with “PIP CH-“ Button
• Select one of these three (USA, CANADA, MEXICO)
defends on its market using “Vol. +/-“button.
* Caution : Don’t push The INSTOP KEY after completing
the function inspection.
6. GND and ESD Testing
6.1 Prepare GND and ESD Testing.
A
Check the connection between set and power cord
6.2 Operate GND and ESD auto-test.
A
Fully connected (Between set and power cord) set enter the
Auto-test sequence.
Auto-test sequence.
A
Connect D-Jack AV jack test equipment.
A
Turn on Auto-controller(GWS103-4)
A
Start Auto GND test.
A
If its result is NG, then notice with buzzer.
A
If its result is OK, then automatically it turns to ESD Test.
A
Operate ESD test
A
If its result is NG, then notice with buzzer.
A
If its result is OK, then process next steps. Notice it with
Good lamp and STOPER Down.Check Items.
Good lamp and STOPER Down.Check Items.
A
Test Voltage
• GND: 1.5KV/min at 100mA
• Signal: 3KV/min at 100mA
• Signal: 3KV/min at 100mA
A
Test time: just 1 second.
A
Test point
• GND test: Test between Power cord GND and Signal
cable metal GND.
• ESD test: Test between Power cord GND and Live and
neutral.
A
Leakage current: Set to 0.5mA(rms)
7. Preset Ch information.
In case of POWER ONLY, System color is operated multi
system
In case of IN STOP, System color is operated default system
(PAN-M)
system
In case of IN STOP, System color is operated default system
(PAN-M)
- 17 -
8. Default Service option.
8.1 ADC-Set.
A
R-Gain adjustment Value (default 128)
A
G-Gain adjustment Value (default 128)
A
B-Gain adjustment Value (default 128)
A
R-Offset adjustment Value (default 128)
A
G-Offset adjustment Value (default 128)
A
B-Offset adjustment Value (default 128)
8.2 White balance. Value.
9.
USB DOWNLOAD (*.epk file
download)
download)
9.1 Put the USB Stick to the USB socket
9.2 Press Menu key, and move OPTION
9.3 Press “FAV” Press 7 times.
9.4 Select download file (epk file)
9.5 After download is finished, remove the
USB stick.
9.6 Press “IN-START” key of ADJ remote
control, check the S/W version.
- 18 -
- 19 -
300
200
LV
1
LV
2
400
800
302
301
240
200R
200L
820
840
830
850
851
700
121R
121L
550
120
570
580
860
561
861
562
862
900
910
920
720
540
530
A5
A13
A2
A23
A30
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2009.06.18
BCM3556 & NAND FLASH
BCM (EUROBBTV)
NAND_DATA[7]
CI_A[0]
CI_A[3]
CI_A[2]
NAND_DATA[6]
NAND_DATA[6]
NAND_DATA[2]
CI_A[12]
NAND_DATA[0]
NAND_DATA[4]
NAND_DATA[3]
NAND_DATA[3]
NAND_DATA[1]
NAND_DATA[2]
CI_A[8]
CI_A[5]
NAND_DATA[7]
CI_A[6]
NAND_DATA[5]
NAND_DATA[7]
NAND_DATA[0]
NAND_DATA[5]
NAND_DATA[1]
NAND_DATA[0]
CI_A[9]
CI_A[11]
NAND_DATA[6]
CI_A[13]
CI_A[7]
NAND_DATA[5]
CI_A[4]
NAND_DATA[2]
NAND_DATA[4]
NAND_DATA[4]
CI_A[10]
NAND_DATA[0-7]
CI_A[1]
NAND_DATA[1]
NAND_DATA[3]
R132
22
R127
22
R117
33
R1037
2.7K
OPT
R1003
2.7K
NAND_WEb
PWM_DIM
DSUB_DET
NAND_DATA[0-7]
R1007
2.7K
OPT
R102
22
SC_RE2
NAND_CEb
R1012
100
MODEL_OPT_5
R1022
1K
MODEL_OPT_1
C115
0.1uF
R169
2.7K
C114
0.1uF
NAND_REb
R133
22
SCL3_3.3V
R1023
1K
OPT
R1001
2.7K
MODEL_OPT_0
R193
4.7K
FRC_RESET
NAND_ALE
CI_OUTCLK
MODEL_OPT_1
C116
4700pF
SDA1_3.3V
MODEL_OPT_2
R140
22
R194
4.7K
R1008
2.7K
OPT
RGB_DDC_SCL
R1040
2.7K
OPT
NAND_ALE
R1039
2.7K
EBI_WE
/CI_IREQ
C103
0.1uF
CI_MOD_RESET
MODEL_OPT_0
R109
100
NAND_CLE
+3.3V_NORMAL
R1000
2.7K
MODEL_OPT_5
NAND_CEb
TUNER_RESET
R122
22
ERROR_OUT
R1024
100
NAND_CLE
NAND_REb
R130
22
NAND_WEb
+3.3V_NORMAL
R1002
2.7K
OPT
REAR_AV_DET
+3.3V_NORMAL
R1033
22
R157
2.7K
OPT
CI_A[0-13]
IF_AGC_SEL
EPHY_LINK
MODEL_OPT_4
R1045
4.7K
NAND_RBb
R1006
2.7K
OPT
R136
4.7K
R1018
1K
R1005
2.7K
R1011
1K
OPT
FE_TS_VAL_ERR
+3.3V_NORMAL
SDA3_3.3V
R1019
100
/CI_CD2
R1013
1K
+3.3V_NORMAL
R1015
1K
OPT
R156
2.7K
+3.3V_NORMAL
NAND_DATA[0-7]
R108
100
R158
2.7K
OPT
NAND_CLE
R1021
1K
OPT
R110
100
SC_RE1
MODEL_OPT_2
R111
22
R1034
2.7K
+3.3V_NORMAL
R1004
2.7K
OPT
SCL1_3.3V
MODEL_OPT_3
CI_5V_CTL
R134
2.7K
R191
2.7K
SCL0_3.3V
R1020
1K
OPT
+3.3V_NORMAL
EBI_CS
R1009
1K
OPT
RGB_DDC_SDA
+3.3V_NORMAL
EBI_CS
R1046
22
/CI_WAIT
NAND_DATA[0-7]
EBI_RW
R1035
2.7K
R1044
0
BCM_RX
EPHY_ACTIVITY
Q101
KRC103S
KRC103S
E
B
C
R1017
1K
R1038
2.7K
R129
22
MODEL_OPT_4
R1014
1K
NAND_ALE
SDA0_3.3V
BCM_TX
FLASH_WP
LNA2_CTL/BOSTER_CTL
R1036
2.7K
OPT
+3.3V_NORMAL
MODEL_OPT_3
R1010
1K
OPT
R107
100
/CI_CD1
R116
22
NAND_RBb
R1027
10K
SYS_RESETb
+3.3V_NORMAL
SOC_RESET
COMP1_DET
SDA2_3.3V
SCL2_3.3V
AUD_MASTER_CLK
SCART1_DET
L/R_SYNC
R1030
0
R1025
4.7K
C136
10uF
10V
SDA3_3.3V
SCL3_3.3V
R1026
22
R1028
22
DTV_ATV_SELECT
POWER_DET
R1047
0
OPT
HDMI_HPD_3
HDMI_HPD_2
HDMI_HPD_1
R114
1K
R1029
1K
R199
1K
R106
1K
5V_HDMI_1
5V_HDMI_2
5V_HDMI_3
R1048
100
R1050
100
R161
100 NON_LEX8
R1049
22
R1051
22
R170
1.2K
R187
1.2K
R180
1.2K
R183
1.2K
R184
1.2K
R171
1.2K
IC101
NAND04GW3B2DN6E
NAND FLASH
26
NC_17
27
NC_18
28
NC_19
29
I/O0
30
I/O1
31
I/O2
32
I/O3
33
NC_20
34
NC_21
35
NC_22
36
VSS_2
37
VDD_2
38
NC_23
39
NC_24
40
NC_25
41
I/O4
42
I/O5
43
I/O6
44
I/O7
45
NC_26
46
NC_27
47
NC_28
48
NC_29
17
AL
3
NC_3
6
NC_6
16
CL
15
NC_10
14
NC_9
13
VSS_1
12
VDD_1
11
NC_8
10
NC_7
9
E
8
R
7
RB
4
NC_4
5
NC_5
25
NC_16
24
NC_15
23
NC_14
2
NC_2
22
NC_13
21
NC_12
1
NC_1
20
NC_11
19
WP
18
W
R160
100
LG5111_RESET
R192
0
DC
DD
M_REMOTE_RX
M_REMOTE_TX
R103
0
M_RFModule_RESET
+12V
C178
0.1uF
50V
0.1uF
50V
C179
0.1uF
50V
0.1uF
50V
R1041
12K
C173
22uF
16V
22uF
16V
C180
100pF
50V
100pF
50V
R105
56
R115
1.8K
R1052
4.7K
4.7K
+3.3V_NORMAL
MODEL_OPT_6
/CI_SEL
MODEL_OPT_6
R118
1K
OPT
R119
1K
MDS62110206
GAS6
6.5T_GAS
MDS62110206
GAS2
6.5T_GAS
MDS62110206
GAS7
6.5T_GAS
MDS62110206
GAS5
6.5T_GAS
MDS62110206
GAS1
6.5T_GAS
MDS62110206
GAS4
6.5T_GAS
MDS62110206
GAS3
6.5T_GAS
R1042
22
R1053
2.7K
+3.3V_NORMAL
USB_PWRFLT3
IC102
M24M01-HRMN6TP
3
E2
2
E1
4
VSS
1
NC
5
SDA
6
SCL
7
WP
8
VCC
IC100
LGE3556CP (C0 3D PIP)
GPIO_00
N26
GPIO_01
L26
GPIO_02
N25
GPIO_03
L25
GPIO_04
K27
GPIO_05
K28
GPIO_06
K24
GPIO_07
K26
GPIO_08
K25
GPIO_09
AA27
GPIO_10
AA28
GPIO_11
AA26
GPIO_12
L1
GPIO_13
L3
GPIO_14
L2
GPIO_15
Y25
GPIO_16
Y26
GPIO_17
M27
GPIO_18
AA25
GPIO_19
R25
GPIO_20
N28
GPIO_21
N27
GPIO_22
AH18
GPIO_23
P23
GPIO_24
M23
GPIO_25
AD19
GPIO_26
AE19
GPIO_27
M4
GPIO_28
M5
GPIO_29
L23
GPIO_30
Y28
GPIO_31
Y27
GPIO_32
G2
GPIO_33
G3
GPIO_34
G5
GPIO_35
G6
GPIO_36
G4
GPIO_37
L24
GPIO_38
P25
GPIO_39
L5
GPIO_40
K4
GPIO_41
K1
GPIO_42
L27
GPIO_43
M26
GPIO_44
N23
GPIO_45
R28
GPIO_46
R27
GPIO_47
R26
GPIO_48
P28
GPIO_49
P27
GPIO_50
K6
GPIO_51
K5
GPIO_52
P26
GPIO_53
M3
GPIO_54
M2
GPIO_55
M1
GPIO_56
L4
GPIO_57
L6
SGPIO_00
W27
SGPIO_01
W28
SGPIO_02
W26
SGPIO_03
W25
SGPIO_04
J2
SGPIO_05
J1
SGPIO_06
K3
SGPIO_07
K2
EBI_ADDR3
J23
EBI_ADDR4
J24
EBI_ADDR2
H25
EBI_ADDR1
H24
EBI_ADDR0
H23
EBI_ADDR5
J25
EBI_ADDR6
F26
EBI_ADDR8
H28
EBI_ADDR9
J26
EBI_ADDR13
H27
EBI_ADDR12
G26
EBI_ADDR11
J27
EBI_ADDR10
J28
EBI_ADDR7
F27
EBI_TAB
G24
EBI_WE1B
H26
EBI_CLK_IN
G27
EBI_CLK_OUT
G28
EBI_RWB
K23
EBI_CS0B
G25
NAND_DATA0
U24
NAND_DATA1
T26
NAND_DATA2
T27
NAND_DATA3
U26
NAND_DATA4
U27
NAND_DATA5
V26
NAND_DATA6
V27
NAND_DATA7
V28
NAND_CS0B
T24
NAND_ALE
R23
NAND_REB
T23
NAND_CLE
T25
NAND_WEB
R24
NAND_RBB
U25
SF_MISO
W24
SF_MOSI
U23
SF_SCK
V23
SF_CSB
V24
R177
1.8K
R176
1.8K
R1054
0
R1055
0
R1056
0
R1057
0
R1058
0
R1059
0
/RESET_FPGA
R1060
2.7K
+3.3V_NORMAL
SIDE_AV_DET
SIDE_COMP_DET
RF_SWITCH_CTL
DEMOD_RESET
CI_OUTCLK
E_TDI
/CI_CD2
E_TDO
E_TCK
/CI_IREQ
CI_MOD_RESET
E_TMS
R1061
0
FPGA_DL
R1062
0
FPGA_DL
R1063
0
FPGA_DL
R1064
0
FPGA_DL
DP_RESET
R1065
0
FPGA_DL
SCART1_DET
1
Default Res. of all NAND pin is Pull-down
For CI
For CI
* I2C MAP
* NAND FLASH MEMORY 4Gbit (512M for BB)
MODEL OPTION
External Demod.
Open Drain
* I2C_0 :
* I2C_1 :
* I2C_2 :
* I2C_3 :
BB Add.
For CI
Boot Strap
RESET
A8’h
NAND_IO[0] : Flash Select (1)
0 : Boot From Serial Flash
1 : Boot From NAND Flash
0 : Boot From Serial Flash
1 : Boot From NAND Flash
NAND_IO[1] : NAND Block 0 Write (DNS)
0 : Enable Block 0 Write
1 : Disable Block 0 Write
0 : Enable Block 0 Write
1 : Disable Block 0 Write
NAND_IO[3:2] : NAND ECC (1, DNS)
00 : No ECC
01 : 1 ECC Bit
10 : 4 ECC Bit
11 : 8 ECC Bit
00 : No ECC
01 : 1 ECC Bit
10 : 4 ECC Bit
11 : 8 ECC Bit
NAND_IO[4] : CPU Endian (0)
0 : Little Endian
1 : Big Endian
0 : Little Endian
1 : Big Endian
NAND_IO[6:5] : Xtal Bias Control (1, DNS)
00 : 1.2mA (Fundmental Recommand)
01 : 1.8mA
10 : 2.4mA (3rd over tune Recommand)
11 : 3.0mA
00 : 1.2mA (Fundmental Recommand)
01 : 1.8mA
10 : 2.4mA (3rd over tune Recommand)
11 : 3.0mA
NAND_IO[7] : MIPS Frequency (DNS)
0 : 405MHz
1 : 378MHz
0 : 405MHz
1 : 378MHz
NAND_ALE : I2C Level (DNS)
0 : 3.3V Switching
1 : 5V Switching
0 : 3.3V Switching
1 : 5V Switching
NAND_CLE
0 : Enable D2CDIFF AC (DNS)
1 : Disabe D2CDIFF AC
0 : Enable D2CDIFF AC (DNS)
1 : Disabe D2CDIFF AC
NVRAM
EXT IRQ
GPIO_00, GPIO_01, GPIO_02,
GPIO_11, GPIO_11, GPIO_39
GPIO_00, GPIO_01, GPIO_02,
GPIO_11, GPIO_11, GPIO_39
IR_INT : GPIO_23
IR1_IN : GPIO_25
IR2_IN : GPIO_29
IR_OUT : GPIO_26
IR1_IN : GPIO_25
IR2_IN : GPIO_29
IR_OUT : GPIO_26
PWM0 : GPIO_24
PWM1 : GPIO_09
PWM1 : GPIO_09
IR_IN
INTERRUPT PIN
INTERRUPT PIN
INTERRUPT PIN
IR_IN
BCM_AVC_DEBUG_TX1
BCM_AVC_DEBUG_RX1
SMD GASKET
FOR ESD 12V Pattern
URSA3 External
HIGH
LOW
HIGH
OLED
LOW
DDR-512M
MODEL_OPT_4
HIGH
MAIN_MINI_LVDS
HD
MAIN_LVDS
K1
NON_OLED
MODEL_OPT_3
MODEL_OPT_6
MODEL_OPT_4
L25
N28
MODEL_OPT_5
FRC
MODEL_OPT_0
MODEL_OPT_2
DDR-256M
HIGH
GIP
PIN NAME
PWIZ Pannel T-con
with LG FRC
with LG FRC
MODEL_OPT_1
AA26
HIGH
R26
LOW
NON_URSA3
LOW
K4
*MODEL_OPT_0 & MODEL_OPT_4
REFER TO THIS OPTION
REFER TO THIS OPTION
NON-GIP
PIN NO.
LOW
K27
NO FRC
NON_FRC
MODEL_OPT_0
FHD
URSA3
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