DOWNLOAD LG 42LX6500-SD (CHASSIS:LJ03R) Service Manual ↓ Size: 7.52 MB | Pages: 68 in PDF or view online for FREE

- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

NOTE : Specifications and others are subject to change without notice for improvement.

This specification is applied to the LCD TV used LJ03R chassis.

Each part is tested as below without special appointment.

1) Temperature

: 25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST : 40 ºC ± 5 ºC

2) Relative Humidity :  65 % ± 10 %
3) Power Voltage

: Standard input voltage (AC 100-240 V~ 50 / 60 Hz)
* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with

BOM.

5) The receiver must be operated for about 20 minutes prior to the adjustment.

1) Performance: LGE TV test method followed 
2) Demanded other specification 

- Safety: CE, IEC specification
- EMC:CE, IEC 

No

Item

Specification

Remark

1

Receivable System

1) SBTVD / NTSC / PAL-M / PAL-N

2

Available Channel

VHF : 02 ~ 13

UHF : 14 ~ 69

DTV : 07 ~ 69

CATV : 01 ~ 135

3

Input Voltage

1) AC 100 ~ 240V 50/60Hz

4

Market

Central and South AMERICA

5

Screen Size

42 inch Wide (1920 x 1080)

LX6500

47 inch Wide (1920 x 1080)

LX6500, LX9500

55 inch Wide (1920 x 1080)

LX6500, LX9500

6

Aspect Ratio

16:9

7

Tuning System

FS

8

LCD Module

LC420EUS-SCA1

42LX6500-SD

LC470EUS-SCA1

47LX6500-SD 

LC550EUC-SCA1   

55LX6500-SD 

LC470MUT-SCA1

47LX9500-SA

LC550MUT-SCA1

55LX9500-SA

9

Operating Environment

Temp  : 0 ~ 40 deg

Humidity : ~ 80 %

10

Storage Environment

Temp  : -20 ~ 60 deg

Humidity : -85 %

1) LJ03R 

- 7 -

No

Item

Min

Typ

Max

Unit

Remark

1

Max Luminance

Module

360

450

Edge LED CAS spec

(Center 1-point / 

2D

350

430

cd/m

2

42/47/55LX6500-SD

Full White Pattern)

2D

350

430

cd/m

2

47LX9500-SA

2D

294

368

cd/m

2

55LX9500-SA

3D

48

61

cd/m

2

47LX9500-SA

3D

40

51

cd/m

2

55LX9500-SA

3D

48

61

cd/m

2

42/47LX6500-SD

3D

38

51

cd/m

2

55LX6500-SD

2

Color coordinate

RED

X

Typ.

0.642

Typ.

42LX6500-SD

Y

-0.03

0.335

+0.03

GREEN

X

0.308

Y

0.602

BLUE

X

0.156

Y

0.061

WHITE

X

0.279

Y

0.292

RED

X

Typ.

0.642

Typ.

47LX6500-SD

Y

-0.03

0.333

+0.03

GREEN

X

0.307

Y

0.605

BLUE

X

0.149

Y

0.058

WHITE

X

0.272

Y

0.292

RED

X

Typ.

0.644

Typ.

55LX6500-SD

Y

-0.03

0.333

+0.03

GREEN

X

0.308

Y

0.605

BLUE

X

0.149

Y

0.059

WHITE

X

0.279

Y

0.292

- 8 -

No

Item

Min

Typ

Max

Unit

Remark

RED

X

Typ.

0.651

Typ.

47LX9500-SA

Y

-0.03

0.334

+0.03

GREEN

X

0.312

Y

0.598

BLUE

X

0.150

Y

0.068

WHITE

X

0.280

Y

0.290

RED

X

Typ.

0.640

Typ.

55LX9500-SA

Y

-0.03

0.330

+0.03

GREEN

X

0.300

Y

0.600

BLUE

X

0.150

Y

0.050

WHITE

X

0.280

Y

0.290

3

3D  Grosstalk

10

12

%

47/55LX9500-SA

14

18

42/47/55LX6500-SD

4

Contrast ratio

1000

1300

42/47/55LX6500-SD

1000

1400

47/55LX9500-SA

5

Dynamic CR

6,000,000 7,000,000

6

Color Temperature

Cool

0.267

0.269

0.271

<Test Condition>

0.271

0.273

0.275

85% Full white pattern

Medium

0.283

0.285

0.287

The W/B Tolerance is ±0.015 for

0.291

0.293

0.295

Adjustment

Warm

0.311

0.313

0.315

0.327

0.329

0.331

7

Color Distortion, DG

10.0

%

8

Color Distortion, DP

10.0

deg

9

Color S/N, AM/FM

43.0

dB

10

Color Killer Sensitivity

-80

dBm