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- 5 -

IC Remove/Replacement
Some  chassis  circuit  boards  have  slotted  holes  (oblong)  through
which  the  IC  leads  are  inserted  and  then  bent  flat  against  the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards  using  the  familiar  round  hole,  use  the  standard  technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying  up  on  the  lead  with  the  soldering  iron  tip  as  the  solder
melts.

2.  Draw  away  the  melted  solder  with  an  anti-static  suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully  bend  each  IC  lead  against  the  circuit  foil  pad  and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect  the  replacement  transistor  leads  to  the  corresponding

leads  extending  from  the  circuit  board  and  crimp  the  "U"  with
long  nose  pliers  to  insure  metal  to  metal  contact  then  solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove  defective  diode  by  clipping  its  leads  as  close  as

possible to diode body.

2.  Bend  the  two  remaining  leads  perpendicular  y  to  the  circuit

board.

3.  Observing  diode  polarity,  wrap  each  lead  of  the  new  diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect  (on  the  circuit  board  copper  side)  the  solder  joints  of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely  crimp  the  leads  of  replacement  component  around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain  original  spacing  between  the  replaced
component  and  adjacent  components  and  the  circuit  board  to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive  heat  applied  to  the  copper  foil  of  any  printed  circuit
board  will  weaken  the  adhesive  that  bonds  the  foil  to  the  circuit
board  causing  the  foil  to  separate  from  or  "lift-off"  the  board.  The
following  guidelines  and  procedures  should  be  followed  whenever
this condition is encountered.

At IC Connections
To  repair  a  defective  copper  pattern  at  IC  connections  use  the
following  procedure  to  install  a  jumper  wire  on  the  copper  pattern
side  of  the  circuit  board.  (Use  this  technique  only  on  IC
connections).

1.  Carefully  remove  the  damaged  copper  pattern  with  a  sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully  scratch  away  the  solder  resist  and  acrylic  coating  (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route  the  jumper  wire  along  the  path  of  the  out-away  copper

pattern and let it overlap the previously scraped end of the good
copper  pattern.  Solder  the  overlapped  area  and  clip  off  any
excess jumper wire.

At Other Connections
Use  the  following  technique  to  repair  the  defective  copper  pattern
at  connections  other  than  IC  Pins.  This  technique  involves  the
installation  of  a  jumper  wire  on  the  component  side  of  the  circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace  along  the  copper  pattern  from  both  sides  of  the  pattern

break  and  locate  the  nearest  component  that  is  directly
connected to the affected copper pattern.

3.  Connect  insulated  20-gauge  jumper  wire  from  the  lead  of  the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

This  spec  sheet  is  applied  to  the  LCD  TV  used  LP7BB
chassis

Each part is tested as below without special appointment.

(1) Temperature : 25 ± 5°C(77 ± 9°F), CST : 40 ± 5°C
(2) Relative Humidity : 65% ± 10%
(3) Power Voltage : Standard  input  voltage  (100-240V~,

50/60Hz)

*Standard Voltage of each products is marked by models

(4) Specification  and  performance  of  each  parts  are  followed

each  drawing  and  specification  by  part  number  in
accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

(1) Performance : LGE TV test method followed
(2) Demanded other specification

Safety

: CE, IEC Specification

EMC

: CE, IEC

NOTE : Specifications and others are subject to change without notice for improvement.

No

Item

Specification

Remark

1. 

Video input applicable system

NTSC-M, PAL M/N

2. 

Receivable Broadcasting System

1) NTSC

2) PAL M

3) PAL N

3. 

RF Input Channel

BAND

NTSC

VHF

2 ~ 13

UHF

14 ~ 69

CATV 

1 ~ 125

4. 

Input Voltage

100-240V~ / 50Hz, 60Hz 

5.

Market

Central & South America

6.

Operating Environment

1) Temp  : 0 ~ 40 deg

2) Humidity : 10 ~ 90 %RH

7. 

Storage Environment

1) Temp  : -20 ~ 50 deg

2) Humidity : 10 ~ 90 %RH

8.

Power Consumption

Power on

≤ 260(42”)

(Green)

≤ 220(32”)

9.

Stand by

Cool

≤ 1W(32”, 42”)

Warm

≤ 40W(32”, 42”)

When recordign the manual recording

10.

Frequency range

H : 31 ~ 61 khz

PC Input

V : 56 ~ 75 Hz

11.

Video Input (2EA)

NTSC, PAL M/N

12.

S-Video Input (1EA)

NTSC, PAL M/N

Side only

13.

Component Input (2EA)

Y/Cb/Cr, Y/Pb/Pr

14.

RGB Input (1EA)

RGB-PC

15.

HDMI Input (2EA)

HDMI-PC

HDMI-DTV

16.

Audio Input (5EA)

PC Audio, Component (2EA), AV(2EA)

L/R Input

17.

Audio variable out (1EA)

18.

USB Input (1EA)

DivX, MP3, JPEG

19.

AV out (1EA)

- 7 -

No

Item

Specification

Remark

1 .

Panel

42" TFT WXGA LCD

32" TFT WXGA LCD

2.

LCD Module

Outline 

42"

983 x 576 x 47.3

(H)mm x (V)mm x (D)mm

Dimension

32"

760.0 x 450.0 x 48.0

Pixel Pitch

42"

0.227 x 0.681 x RGB

mm

32"

0.17025 x 0.51075 x RGB

Pixel Format

1366 x 768 Pixels RGB strip arrangement

Coating

Hard coating(3H), Anti-glare treatment 

of the front polarizer, 

Back Light

42"

18CCFL

32"

18CCFL

No

Item

Min

Typ

Max

Unit

Maker

Remark

1.

Luminance

400

500

LPL(0RT)

- 50cm from the surface

32",42"

- Full White Pattern

2.

View angle (R/L, U/D)

178/178

degree

LPL 32”, 42”

- CR > 10

3.

White 

White

X

-0.03

0.279/0.279/0.279

+0.03

coordinate

Y

0.292/0.292/0.292

Red

X

0.635/0.636/0.635

Y

0.339/0.343/0.344

Green

X

0.282/0.284/0.286

Y

0.606/0.615/0.614

Blue

X

0.145/0.144/0.146

Y

0.064/0.063/0.061

4.

Contrast ratio

CR

600

800

32"

LPL(0-RT)

800

1000

42"

LPL(0-RT)

5.

Luminance Variation

1.3

- 8 -

No

Resolution

H-freq(kHz)

V-freq.(kHz)

Pixel clock(MHz)

Remarks

1.

720*480

15.73

59.94

13.500

SDTV, DVD 480I(525I)

720*480

15.75

60.00

13.514

SDTV, DVD 480I(525I)

2.

720*576

15.625

50.00

13.500

SDTV, DVD 576I(625I)

3.

720*480

31.47

59.94

27.000

SDTV 480P

720*480

31.50

60.00

27.027

SDTV 480P

4.

720*576

31.25

50.00

27.000

SDTV 576P

5.

1280*720

44.96

59.94

74.176

HDTV 720P

1280*720

45.00

60.00

74.250

HDTV 720P

6.

1280*720

37.50

50.00

74.25

HDTV 720P 50Hz

7.

1920*1080

33.72

59.94

74.176

HDTV 1080I

1920*1080

33.75

60.00

74.250

HDTV 1080I

8.

1920*1080

28.125

50.00

74.250

HDTV 1080I 50Hz, 

9.

1920*1080

67.5

60.00

148.5

HDTV 1080P

10.

1920*1080

56.25

50

148.5

HDTV 1080P 50Hz

No

Resolution

H-freq(kHz)

V-freq.(kHz)

Pixel clock(MHz)

Remarks

1

720*400

31.469

70.08

28.32

DOS

2.

640*480

31.469

59.94

25.17

VESA(VGA)

3

640*480

37.500

75.00

31.50

VESA(VGA)

4

800*600

37.879

60.31

40.00

VESA(SVGA)

5

800*600

46.875

75.00

49.50

VESA(SVGA)

6

1024*768

48.363

60.00

65.00

VESA(XGA)

7

1024*768

56.476

70.06

78.75

VESA(XGA)

8

1024*768

60.023

75.02

79.50

VESA(XGA)

9

1280*768

47.776

59.87

80.125

WXGA(42XGA,50",60")

10

1360*768

47.712

60.01

85.50

WXGA(42XGA,50",60")

11

1366*768

47.700

60.00

84.62

WXGA(42XGA,50",60")

No

Resolution

H-freq(kHz)

V-freq.(kHz)

Pixel clock(MHz)

Remarks

1

720*400

31.469

70.08

28.32

DOS

2

640*480

31.469

59.94

25.17

VESA(VGA)

3

640*480

37.500

75.00

31.50

VESA(VGA)

4

800*600

37.879

60.31

40.00

VESA(SVGA)

5

800*600

46.875

75.00

49.50

VESA(SVGA)

6

1024*768

48.363

60.00

65.00

VESA(XGA)

7

1024*768

56.476

70.06

75.00

VESA(XGA)

8

1024*768

60.023

75.02

78.75

VESA(XGA)

9

1280*768

47.776

59.87

79.50

WXGA(42XGA,50",60")

10

1360*768

47.712

60.01

85.50

WXGA(42XGA,50",60")

11

1366*768

47.700

60.00

84.62

WXGA(42XGA,50",60")