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              - 5 -                                                         

 

   

IC Remove/Replacement 
Some chassis circuit boards have slotted holes (oblong) through 
which the IC leads are inserted and then bent flat against the 
circuit foil. When holes are the slotted type, the following 
technique should be used to remove and replace the IC. When 
working with boards using the familiar round hole, use the 
standard technique as outlined in paragraphs 5 and 6 above. 

 

Removal 
1. Desolder and straighten each IC lead in one operation by gently 

prying up on the lead with the soldering iron tip as the solder 
melts. 

2. Draw away the melted solder with an anti-static suction-type 

solder removal device (or with solder braid) before removing 
the IC. 

Replacement 
1. Carefully insert the replacement IC in the circuit board. 
2. Carefully bend each IC lead against the circuit foil pad and 

solder it. 

3. Clean the soldered areas with a small wire-bristle brush. 

(It is not necessary to reapply acrylic coating to the areas). 
 

"Small-Signal" Discrete Transistor 
Removal/Replacement 
1. Remove the defective transistor by clipping its leads as close as 

possible to the component body. 

2. Bend into a "U" shape the end of each of three leads remaining 

on the circuit board. 

3. Bend into a "U" shape the replacement transistor leads. 
4. Connect the replacement transistor leads to the corresponding 

leads extending from the circuit board and crimp the "U" with 
long nose pliers to insure metal to metal contact then solder 
each connection. 

 
Power Output, Transistor Device 
Removal/Replacement 
1. Heat and remove all solder from around the transistor leads. 
2. Remove the heat sink mounting screw (if so equipped). 
3. Carefully remove the transistor from the heat sink of the circuit 

board. 

4. Insert new transistor in the circuit board. 
5. Solder each transistor lead, and clip off excess lead. 
6. Replace heat sink. 
 
Diode Removal/Replacement 
1. Remove defective diode by clipping its leads as close as possible 

to diode body. 

2. Bend the two remaining leads perpendicular y to the circuit 

board. 

3. Observing diode polarity, wrap each lead of the new diode 

around the corresponding lead on the circuit board. 

4. Securely crimp each connection and solder it. 
5. Inspect (on the circuit board copper side) the solder joints of 

the two "original" leads. If they are not shiny, reheat them and if 
necessary, apply additional solder. 

Fuse and Conventional Resistor 
Removal/Replacement 
1. Clip each fuse or resistor lead at top of the circuit board hollow 

stake. 

2. Securely crimp the leads of replacement component around 

notch at stake top. 

3. Solder the connections. 

CAUTION:  Maintain original spacing between the replaced 
component and adjacent components and the circuit board to 
prevent excessive component temperatures.

 

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit 
board will weaken the adhesive that bonds the foil to the circuit 
board causing the foil to separate from or "lift-off" the board. The 
following guidelines and procedures should be followed whenever 
this condition is encountered. 

 
 

At IC Connections 
To repair a defective copper pattern at IC connections use the 
following procedure to install a jumper wire on the copper pattern 
side of the circuit board.   (Use this technique only on IC 
connections). 
 
 
1. Carefully remove the damaged copper pattern with a sharp 

knife. (Remove only as much copper as absolutely necessary). 

2. carefully scratch away the solder resist and acrylic coating (if 

used) from the end of the remaining copper pattern. 

3. Bend a small "U" in one end of a small gauge jumper wire and 

carefully crimp it around the IC pin. Solder the IC connection. 

4. Route the jumper wire along the path of the out-away copper 

pattern and let it overlap the previously scraped end of the 
good copper pattern. Solder the overlapped area and clip off 
any excess jumper wire. 

 
 

At Other Connections 
Use the following technique to repair the defective copper pattern 
at connections other than IC Pins. This technique involves the 
installation of a jumper wire on the component side of the circuit 
board. 
 
 
1. Remove the defective copper pattern with a sharp knife. 

Remove at least 1/4 inch of copper, to ensure that a hazardous 
condition will not exist if the jumper wire opens. 

2. Trace along the copper pattern from both sides of the pattern 

break and locate the nearest component that is directly 
connected to the affected copper pattern. 

3. Connect insulated 20-gauge jumper wire from the lead of the 

nearest component on one side of the pattern break to the lead 
of the nearest component on the other side. 
Carefully crimp and solder the connections. 
CAUTION: Be sure the insulated jumper wire is dressed so the 
it does not touch components or sharp edges.

 

 

              - 6 -                                                         

 

   

 

 

 

NOTE : Specifications and others are subject to change without notice for improvement.   

 

 

This spec sheet is applied to the 32"/37”/42"/47 LED TV used LD01B                                          1) Performance : LGE TV test method 
followed. 
chassis.   

 

 

 

 

     

                2) Demanded other specification 

- Safety : CE, IEC specification 

 

- EMC : CE, IEC   

Each part is tested as below without special appointment. 

 

 

1) Temperature :   25±5°C(77±9°F), CST : 40±5°C  
2) Relative Humidity : 65±10%   
3) Power Voltage : Standard input voltage (100~240V@ 50/60Hz)   

• Standard Voltage of each products is marked by models   

4) Specification and performance of each parts are followed   

each drawing and specification by part number in 

          accordance with BOM .   

5) The receiver must be operated for about 5 minutes prior to   

the adjustment.   

 
 
 

 

No Item 

Specification 

Remark 

1 

Display Screen Device

 

32”/42” wide Color Display Module

 EEFL 

LCD 

2 

Aspect Ratio

 16:9 

 

3 

LCD Module 

32” / 42” TFT LCD FHD 

LGD 

4 

Storage Environment

 

Temp. : -20 ~ 60 deg

 

 

Humidity : 10 ~ 90 % 

5 

Input Voltage

 

AC100 ~ 240V, 50/60Hz

 

 

6 

Power Consumption

 

Power ON 

 

32” 

108W

 LGD 

42” 

158W

 LGD 

7 

Module Size

 

32” 

760.0(H) x 450.0(V) x 32.5(D

) LGD 

42” 

983.0(H) x 576.0(V) x 35.5(D)

 LGD 

8 

Pixel Pitch

 

 

32” 

0.36375(H) x 0.36375(V)

 LGD 

42” 

0.48450(H) x 0.48450(V)

 LGD 

9 

Back Light

 

 

32” EEFL 

LGD 

42” EEFL 

LGD 

10 

Display Colors

 

1.06 Billion Color, 16.7M(others) 

 

11 

Coating

 3H, 

AG 

 

 

 

 

 

 

 
 

 

 

              - 7 -                                                         

 

   

 

 

* 32” LAMP LCD Module (LGD FHD 100Hz) 

for more details, refer to the module spec. 

1. Viewing 

Angle(CR>10) 

Right/Left (Up/Down)

178    

Degree 

2. Luminance 

Luminance (cd/m

2

) 400 

500  

 

Variation  

- 

1.3 

MAX 

/ 

MIN 

3. Contrast 

Ratio 

CR 

1000  1500 

 

 

4.  CIE Color Coordinates 

RED 

Rx 

Typ 

-0.03 

0.642 

Typ 

+0.03   

Ry 0.334 

Green 

Gx 0.292 
Gy 0.607 

Blue 

Bx 0.146 
By 0.056 

White 

Wx 0.279 
Wy 0.292 

1) Standard Test Condition (The unit has been ‘ON’)   

2) Stable for approximately 30 minutes in a dark environment at 25±2℃ 

3) The values specified are at approximate distance 50Cm from the LCD surface 

4) Ta= 25±2°C, VLCD=12.0V, fV=60Hz, Dclk=74.25MHz I

BL

=136mA

RMS

, Iout duty = 100% 

* 42” LAMP LCD Module (LGD FHD 100Hz) 

for more details, refer to the module spec. 

1. Viewing 

Angle(CR>10) 

Right/Left (Up/Down)

178    

Degree 

2. Luminance 

Luminance (cd/m

2

) 400 

500  

 

Variation  

- 

1.3 

MAX 

/ 

MIN 

3. Contrast 

Ratio 

CR 

1100  1500 

 

 

4.  CIE Color Coordinates 

RED 

Rx 

Typ 

-0.03 

0.636 

Typ 

+0.03 

42LD570-ZA
42LD575-ZA

42LD540-ZA

42LD541-

ZA/DE 

Ry 0.335 

Green 

Gx 0.291 
Gy 0.603 

Blue 

Bx 0.146 
By 0.061 

White 

Wx 0.279 
Wy 0.292 

1) Standard Test Condition (The unit has been ‘ON’)   

2) Stable for approximately 30 minutes in a dark environment at 25±2℃ 
3) The values specified are at approximate distance 50Cm from the LCD surface 

4) Ta= 25±2°C, VLCD=12.0V, fV=60Hz, Dclk=74.25MHz I

BL

=136mA

RMS

, Iout duty = 100% 

              - 9 -                                                         

 

   

 

No 

Resolution 

H-freq(kHz)

V-freq.(kHz) 

Pixel clock(MHz)

Proposed 

Remark 

1 

640*480 31.649 59.94  25.175 

SDTV 

480p 

60Hz 

 

2 

640*480 31.469 60 

25.20 

SDTV 

480p 

60Hz 

 

3 

720*480 

31.47 

59.94 

27.00 

SDTV 480p 60Hz 

 

4 

720*480 

31.50 

60 

27.027 

SDTV 480p 60Hz 

 

5 

720*576 

31.25 

50.00 

27.00 

SDTV 576p 50Hz 

 

6 1280*720  37.50 

50.00 

74.176 

HDTV 

720p 

50Hz 

 

7 1280*720  44.96 

59.94 

74.176 

HDTV 

720p 

60Hz 

 

8 1280*720  45.00 

60 

74.250 

HDTV 

720p 

60Hz 

 

9 1920*1080 28.125  50.00 

74.250 

HDTV 

1080i 

50Hz 

 

10 1920*1080  33.72 

59.94 

74.176 

HDTV 

1080i 

60Hz 

 

11 1920*1080  33.75 

60 

74.250 

HDTV 

1080i 

60Hz 

 

12 1920*1080  27.00 

24.00 

74.25 

HDTV 

1080p 

24Hz 

 

13 1920*1080  33.750 

30 

74.25 

HDTV 

1080p 

30Hz 

 

14 1920*1080  56.25 

50.00 

148.50 

HDTV 

1080p 

50Hz 

 

15 1920*1080  67.433 

59.94 

148.352 

HDTV 

1080p 

60Hz 

 

16 1920*1080  67.50 

60 

148.50 

HDTV 

1080p 

60Hz 

 

 

 
 

 

 

 

 

 

No 

Resolution 

H-freq(kHz)

V-freq.(Hz) 

Pixel clock(MHz)

Proposed 

Remark 

1. 720*400 

31.468  70.08 

28.32 

 

HDCP 

2. 640*480 

31.469  59.94 

25.17 

VESA 

HDCP 

3. 800*600 

37.879 

60.31 

40.00 

VESA 

HDCP 

4. 1024*768  48.363  60.00 

65.00 

VESA(XGA) 

HDCP 

5. 1280*768  47.78 

59.87 

80.125 

VESA(WXGA) 

HDCP 

6 1360*768  47.72 

59.80 

84.625 

VESA(WXGA) 

HDCP 

7 

1280*1024 

63.98 60.02 108. 

SXGA 

HDCP 

8 

1400*1050 

65.317 59.979 121.75 

SXGA 

HDCP 

9. 

1920*1080 

66.587 59.934 138.5 

WUXGA 

HDCP