DOWNLOAD LG 26LC2R / 32LC2R (CHASSIS:LP61C) Service Manual ↓ Size: 9.37 MB | Pages: 45 in PDF or view online for FREE

- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

This specification is applied to LP61C chassis.

Testing for standard of each part must be followed in below
condition.

(1) Temperature : 25°C±5°C(77±9°F), CST : 40±5
(2) Humidity : 65%±10%
(3) Power : Standard input voltage (AC 100-240V, 50/60Hz)

*Standard Voltage of each products is marked by models

(4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3.1 Performance : LGE TV test method followed
3.2 Demanded other specification

Safety : CE, IEC Specification
EMC : CE, IEC

NOTE : Specifications and others are subject to change without notice for improvement.

4.1 Module Specification
4.1.1  General Specification(26/32/37" LCD MODULE) 

No

Item

Specification

Remark

1.

Display Screen Device

26/32inch wide Color Display Module

LCD

2.

Aspect Ratio

16:9

3.

LCD Module

26/32 TFT WXGA LCD

MAKER : AUO/CMO/LPL

4.

Operating Environment

1) Temp.   : 0 ~ 40 deg

LGE SPEC

2) Humidity : 0 ~ 85%

5.

Storage Environment

3) Temp.   : -20 ~ 60 deg

4) Humidity : 0 ~ 85 %

6.

Input Voltage

AC100 ~ 240V, 50/60Hz

7.

Power Consumption

Power on (White)

Volume: 1/8 volume of sound distortion point 

≤

max 160W (32")

≤

max 130W (26")

St-By (Red) : 1.0 W

- 7 -

4.2 Model Specification 
4.2.1 NON-EU / CHINA (TJ/CJ)

No

Item

Specification

Remark

1.

Market

NON EU / CHINA

26/32LC2R-TJ

26/32/37LC2R-CJ

2.

Broadcasting system

PAL BG/DK, PAL I/II, NTSC-M

3.

Available Channel

BAND

PAL

NTSC

VHF/UHF

C1~C69

2~83

CATV

S1~S47

1~71

4.

Receiving system

Upper Heterodyne

5.

Video Input (2EA)

PAL, SECAM, NTSC

4 System :

PAL, SECAM, NTSC, PAL60

6.

Monitor Output (1EA)

PAL, SECAM, NTSC

4 System :

PAL, SECAM, NTSC, PAL60

7.

S-Video Input (1EA)

PAL, SECAM, NTSC

4 System :

S-video Priority

PAL, SECAM, NTSC, 

PAL60

8.

Component Input (2EA)

Y/Cb/Cr, Y/ Pb/Pr

9. 

RGB Input (1EA)

RGB-PC, RGB-DTV

10.

HDMI Input (1EA)

HDMI-DTV

EXCEPT 26/32/37LC2R - CJ 

(CJ : NO HDMI  -  Spec. Out)

11.

Audio Input (5 EA)

PC Audio, Component (2EA), AV (2EA)

L/R Input

12.

Wired Control (1EA)

13.

Variable Audio out(1EA)

5.1 LCD Module

No

Item

Min

Typ

Max

Unit

Maker

Remark

1

Luminance

350

500

cd/m

2

AUO 26", 32", 37"

-50cm from the surface

LPL 26", 32" 

- Full White Pattern

550

CMO 27", 32"

2

View angle (R/L, U/D)

176/176

degree AUO 26"

- CR >10

170/170

AUO 32"

176/176

AUO 37"

170/170

CMO 27"

176/176

CMO 32"

- CR > 20

178/178

LPL 26", 32"

- CR > 10

3

Color 

White

X

Typ.

0.280

Typ.

- CIE 1393

Coordinate

Y

-0.03

0.290

+0.03

AUO 26, 37" (32")

Red

X

0.640

Y

0.330

Green

X

0.290

(0.270)

Y

0.600

Blue

X

0.150

Y

0.060

- 8 -

No

Item

Min

Typ

Max

Unit

Maker

Remark

White

X

Typ.

0.285

Typ.

CMO 27"

-0.03

+0.03

(32")

Y

0.293

Red

X

0.646

(0.652)

Y

0.332

Green

X

0.269

(0.270)

Y

0.600

(0.589)

Blue

X

0.142

(0.141)

Y

0.072

(0.068)

White

X

Typ.

0.275

Typ.

LPL 26"

-0.03

(0.285)

+0.03

(32")

Y

0.279

(0.293)

Red

X

0.630

(0.640)

Y

0.338

(0.343)

Green

X

0.283

(0.280)

Y

0.607

(0.605)

Blue

X

0.147

(0.145)

Y

0.064

(0.065)

4

Contrast ratio

800 / 1200 

AUO 26"/ 32" / 37"

/ 1000

600 / 1000

CMO 27" / 32"

800 (1600)

LPL 26, 32" (with AI)

5

Color 

Normal

8300

9300

10300

- 85IRE Full White Pattern

Temperature

Warm

6200

7200

8200

Cool

10000

11000

12000