LG 22LU7000 (CHASSIS:LU7000) Service Manual ▷ View online
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the
5. Inspect (on the circuit board copper side) the solder joints of the
two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application Range.
3. Test method
This specification sheet is applied to the 19”/22”” LCD TV with
LU7000 chassis.
LU7000 chassis.
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
2. Specification
Safety : CE, IEC specification
Each part is tested as below without special appointment
EMC : CE, IEC
2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
(220~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 The receiver must be operated for about 5 minutes prior to
the adjustment.
4. General Specification
No Item
Specification
Remark
1
Display Screen Device
19”/22”" wide Color Display Module
2
Aspect Ratio
16:9
MAKER : 19” – LGD
22” – LGD
22” – LGD
3
Operating Environment
Temp. : 0 ~ 50 deg
Humidity :10 ~ 90%
Humidity :10 ~ 90%
LGE SPEC.
4
Storage Environment
Temp. : -20 ~ 50 deg
Humidity : 10 ~ 90 %
Humidity : 10 ~ 90 %
5
Input Voltage
AC220 ~ 240V, 50/60Hz
6
Power Consumption
Power ON
19”
38W
22”
48W
7
Module Size
19”
430.4(H) x 254.6(V) x 13.0(D
)
22”
501.0(H) x 297.0(V) x 17.3(D)
8
Pixel Pitch
19”
0.1(H) x 0.3(V)
22”
0.1165(H) x 0.3495(V)
9
Back Light
19” CCFL
22” CCFL
10
Display Colors
8-bit, 16.7M Color
11
Coating
3H,
AG
- 7 -
5. MODEL General Specification
No Item
Specification
Remark
1
Broadcasting system
1)
PAL/SECAM BG ( EU Only )
2)
PAL/SECAM DK ( EU Only )
3)
SECAM L/L’ ( EU Only )
4)
PAL I
5)
DVB T
2
Receiving system
Analog : Upper Heterodyne
Digital : DVB-T(COFDM)
Digital : DVB-T(COFDM)
3
SCART Jack (2EA)
PAL, SECAM
SCART1 Jack is Full SACRT and support
RF-OUT(TV-OUT)
SCART2 jack is Half SCART and support
MNT-OUT
RF-OUT(TV-OUT)
SCART2 jack is Half SCART and support
MNT-OUT
4
Video Input RCA(1EA)
PAL, SECAM, NTSC
Rear
5
Component Input (1EA)
Y/Cb/Cr
Y/Pb/Pr
Y/Pb/Pr
6
RGB Input
RGB-PC
Analog(D-SUB 15PIN)
7
HDMI Input (2EA)
HDMI1-DTV/DVI
HDMI2-DTV
HDMI2-DTV
PC(HDMI version 1.3)
Support HDCP
Support HDCP
8
Audio Input (3EA)
RGB/DVI Audio, Component, AV
L/R Input
9
SDPIF out (1EA)
In digital mode only
10 Headphone
out(1EA)
Side
11 USB(1EA)
JPEG,
MP3,
Side
12 PCMCIA(1EA)
CI(CAM
Interface)
Side
- 8 -
6. Chroma & Brightness
6.1 19"LCD Module
No
Item
Min
Typ
Max
Unit
Remark
1 Luminance,
white
Luminance
(white)
(white)
250 300 - cd/m²
PSM : Vivid, CSM : Cool,
White(100 IRE)
White(100 IRE)
Variation 75
%
2
View angle (R/L, U/D)
140/130
170/160
-
degree
3 Contrast
ratio
600
1000
-
4 Color
Coordinate
White
X
Typ.
-0.03
0.313
Typ.
+0.03
PSM : Vivid, CSM : Cool,
White(80 IRE)
White(80 IRE)
Y
0.329
Red
X
0.642
Y
0.334
Green
X
0.304
Y
0.608
Blue
X
0.146
Y
0.073
1) Standard Test Condition (The unit has been ‘ON’)
2) Stable for approximately 30 minutes in a dark environment at 25
3) The values specified are at approximate distance 50Cm from the LCD surface
4) Ta= 25°C, VLCD=5.0V, fV=60Hz, fclk=77.0MHz,IBL=7.5mA
2) Stable for approximately 30 minutes in a dark environment at 25
3) The values specified are at approximate distance 50Cm from the LCD surface
4) Ta= 25°C, VLCD=5.0V, fV=60Hz, fclk=77.0MHz,IBL=7.5mA
6.2 22"LCD Module
No
Item
Min
Typ
Max
Unit
Remark
1 Luminance,
white
Luminance
(white)
(white)
280 350 - cd/m²
PSM : Vivid, CSM : Cool,
White(100 IRE)
White(100 IRE)
Variation
1.3
2
View angle (R/L, U/D)
170/155
-
degree
3 Contrast
ratio
700
1000
-
4 Color
Coordinate
White
X
Typ.
-0.03
0.285
Typ.
+0.03
PSM : Vivid, CSM : Cool,
White(80 IRE)
White(80 IRE)
Y
0.293
Red
X
0.642
Y
0.333
Green
X
0.295
Y
0.608
Blue
X
0.147
Y
0.063
1) Standard Test Condition (The unit has been ‘ON’)
2) Stable for approximately 30 minutes in a dark environment at 25±2_
3) The values specified are at approximate distance 50Cm from the LCD surface
4) Ta= 25±2°C, VLCD=5.0V, fV=60Hz, Dclk=72.4MHz
2) Stable for approximately 30 minutes in a dark environment at 25±2_
3) The values specified are at approximate distance 50Cm from the LCD surface
4) Ta= 25±2°C, VLCD=5.0V, fV=60Hz, Dclk=72.4MHz
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