LG 22LK230-MA (CHASSIS:LP92R) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This spec. sheet is applied to LCD TV used LP92R chassis.
2. Specification
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF), CST: 40 ºC ± 5 ºC
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
: Standard input voltage(AC 100-240 V~, 50 / 60 Hz)
* Standard Voltage of each products is marked by models.
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
- EMC : CE, IEC
4. Model specification
No.
Item
Specification
Measurement
Remark
1
Market
Non-EU
2
Broadcasting system
PAL/SECAM B/G/D/K, PAL I/II, NTSC-M
3
Available
BAND
PAL
NTSC
China(DK)
Channel
VHF/UHF
E2~C69
2~78
C1~C62
Cable
S21~47
1~71
S1~S41
4.
Receiving system
Upper Heterodyne
5.
Video Input
PAL, SECAM, NTSC
Rear (1EA)
6.
AV Audio Output
RF/AV/HDMI Audio Output
Rear (1EA)
7.
RGB Input
S/W Upgrade Only
Rear (1EA)
8.
HDMI Input
HDMI-DTV, Only PCM MODE
Rear (1EA)
9.
Audio Input (1EA)
AV (1EA)
L/R Input
5. HDMI Input(DTV)(HDMI DVI - Spec out)
No.
Specification
Proposed
Remarks
Resolution
H-freq(kHz)
V-freq(Hz)
Pixel Clock(MHz)
1
720*480
15.73
59.94
13.500
SDTV, DVD 480I(525I)
Spec. out but display.
2
720*480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
3
720*576
15.625
50.00
13.500
SDTV, DVD 576I(625I) 50Hz
4
720*480
31.47
59.94
27
SDTV 480P
5
720*480
31.5
60.00
27.027
SDTV 480P
6
720*576
31.25
50.00
27
SDTV 576P
7
1280*720
44.96
59.94
74.176
HDTV 720P
8
1280*720
45
60.00
74.25
HDTV 720P
9
1280*720
37.5
50.00
74.25
HDTV 720P
- 7 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP92R
chassis.
chassis.
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-220
V~, 50 / 60 Hz.
(5) The standard signal level is approved in 65 ± 1 dB µV.
(6) The receiver must be operated for over 5 minutes prior to
(6) The receiver must be operated for over 5 minutes prior to
the adjustment when module is in the circumstance of
above 15 ºC.
above 15 ºC.
G
In case of keeping module is in the circumstance of 0 °C,
it should be placed in the circumstance of above 15 °C
for 2 hours.
it should be placed in the circumstance of above 15 °C
for 2 hours.
G
In case of keeping module is in the circumstance of
below -20 °C, it should be placed in the circumstance of
above 15 °C for 3 hours.
below -20 °C, it should be placed in the circumstance of
above 15 °C for 3 hours.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC604, Mstar ISP Utility)
1) Using D/L Jig
(2) Input Tool-Option
(3) Check SW Version.
(3) Check SW Version.
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Preset CH information
(5) Factoring Option Data input
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Preset CH information
(5) Factoring Option Data input
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1 Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(JK302) jack or
P301(4P) Wafer.
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened.
2) Click the “Connect” button and confirm “Dialog Box”.
3) Click the “Config” button and Change speed.
I2C Speed setting : 350 Khz ~ 400 Khz
1
Filexxx.bin
4) Read and write bin file.
Click “(1)Read” tab, and then load download file
(XXXX.bin) by clicking “Read”.
(XXXX.bin) by clicking “Read”.
5) Click “(2)Auto” tab and set as below.
6) Click “(3)Run”.
7) After downloading, you can see the “4)Pass” message.
6) Click “(3)Run”.
7) After downloading, you can see the “4)Pass” message.
* If TV is Turn On, Check the updated SW Version and
Tool Option.
4.2. Input tool option.
Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on
module maker, inch and market.
module maker, inch and market.
(2) Equipment : Adjustment remote control
(3) Adjustment method
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START key on the Adjustment remote control.)
(If not changed the option, the input menu can differ the
model spec.)
model spec.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value.
(EBTxxxxxxxx) for Option value.
[Caution]
- Don’t Press “IN-STOP” key after completing the function
- Don’t Press “IN-STOP” key after completing the function
inspection.
- Don’t connect HDMI cable when downloading the EDID.
If the cables are connected, Downloading of EDID could
be failed.
be failed.
4.3. EDID Data
- EDID D/L method: The EDID data is automatically saved.
* 22LK230
* 22LK230
4.5. Check SW Version
(1) Method
1) Push In-star key on Adjustment remote control.
2) SW Version check
2) SW Version check
Check “Main : Vx.xx” - LK230
- 8 -
1
Filexxx.bin
1
Filexxx.bin
** HDMI : 256Bytes
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