Harman Kardon AVR 161 (serv.man4) EMC - CB Certificate ▷ View online
Page 41 of 50
Report No.: 232105
TRF No. IEC60065K
No.
Component
Fault
Duration
of the test
Other results
(include description)
(include description)
dT (K) / Component
dT (K)
Permitted
dT(K)
51
*), #)
*), #)
D910
(A to C)
(A to C)
SC
10 min
Normal operated.
The operating mode changed to
LOW mode after 2 min 50 s.
FI stabilised at 0.83 A.
NCD. No hazard.
The operating mode changed to
LOW mode after 2 min 50 s.
FI stabilised at 0.83 A.
NCD. No hazard.
N/A N/A
52
*), #)
*), #)
IC91
(pin 6 to 3)
(pin 6 to 3)
SC
1 s
F901 fuse opened immediately.
IC91, D928, R990, D901 and D902
damaged. No hazard.
IC91, D928, R990, D901 and D902
damaged. No hazard.
N/A N/A
53
*), #)
*), #)
D903
(A to C)
(A to C)
SC
10 min
Unit shut down after 20 s.
FI stabilised at 0.06 A.
NCD. No hazard.
FI stabilised at 0.06 A.
NCD. No hazard.
N/A N/A
54
*), #)
*), #)
IC92
(pin 4 to 2)
(pin 4 to 2)
SC
1 s
F901 fuse opened.
IC92 and D916 damaged.
No hazard.
IC92 and D916 damaged.
No hazard.
N/A N/A
55
*), #)
*), #)
Surround
L channel
output
L channel
output
SC
10 min
Unit shut down immediately.
FI stabilised at 0.05 A.
NCD. No hazard.
FI stabilised at 0.05 A.
NCD. No hazard.
N/A N/A
56
*), #)
*), #)
USB output
(with No
input signal)
(with No
input signal)
SC
10 min
Only USB output off immediately.
FI stabilised at 0.67 A.
NCD. No hazard.
FI stabilised at 0.67 A.
NCD. No hazard.
N/A N/A
57
*), #)
*), #)
Abnormal
operation
operation
Maximum
non-
clipped
output
signal
non-
clipped
output
signal
6 min
30 s
30 s
The operating mode changed to
LOW mode immediately.
Unit shut down after 6 min 30 s by
operation TS92 thermal protector.
FI stabilised at 0.05 A.
Dielectric strength test. No hazard.
LOW mode immediately.
Unit shut down after 6 min 30 s by
operation TS92 thermal protector.
FI stabilised at 0.05 A.
Dielectric strength test. No hazard.
N/A N/A
58
*), #)
*), #)
USB output 5V/3.1A
Over
loaded
loaded
4 h
Normal operated.
The operating mode changed to
LOW mode after 2 min 50 s.
FI stabilised at 0.80 A.
NCD. No hazard.
The operating mode changed to
LOW mode after 2 min 50 s.
FI stabilised at 0.80 A.
NCD. No hazard.
See #) in the next page
for measured temp.
for measured temp.
59
*), #)
*), #)
Top cover
opening
opening
Blocked
4 h
Normal operated.
The operating mode changed to
LOW mode after 2 min 50 s.
FI stabilised at 0.80 A.
Dielectric strength test. No hazard.
The operating mode changed to
LOW mode after 2 min 50 s.
FI stabilised at 0.80 A.
Dielectric strength test. No hazard.
See ##) in the next
page for measured
temp.
page for measured
temp.
60
*), #)
*), #)
Abnormal
operation
operation
Half load 4 h
Normal operated.
The operating mode changed to
LOW mode after 2 min 50 s.
FI stabilised at 1.31 A.
Dielectric strength test. No hazard.
The operating mode changed to
LOW mode after 2 min 50 s.
FI stabilised at 1.31 A.
Dielectric strength test. No hazard.
See ###) in the next
page for measured
temp.
page for measured
temp.
*) Tested voltage 264V
**) Tested voltage 198V
Apparatus mode:
#) HIGH mode
##) LOW mode
Note- SC: Short-circuit, NCD: No component damage, FI: Fault Input Current
Page 42 of 50
Report No.: 232105
TRF No. IEC60065K
Temperature Rise dT of Part
dT (K)
Limit max dT
(K)
Test Condition No.
#)
Input test No. 18
##)
Input test No. 18
###)
Input test No. 18
-
Line filter, LF92 coil
23.6
33.5
26.8
125 **)
Line filter, LF91 coil
24.5
34.5
27.8
125 **)
Line filter, LF93 coil
23.0
32.5
25.3
125 **)
PWB near DB91
26.7
34.0
29.6
110
Diode, DB91 body
29.7
36.3
32.9
-
PWB near Q901
29.5
38.9
32.8
110
FET, Q901 body
31.7
43.7
34.3
-
Q901 heat-sink
31.0
41.5
32.0
-
Capacitor, C930 body
27.2
39.6
28.7
105 °C
AC connector, CN90 body
20.7
28.7
22.6
-
Transformer, TF93 coil
38.1
57.4
42.2
140 **)
Transformer, TF93 core
35.5
50.3
38.6
150
Transformer, TF92 coil
53.5
49.5
40.5
140 **)
Transformer, TF92 core
50.2
53.9
42.3
150
Transformer, TF91 coil
32.7
38.7
30.7
140 **)
Transformer, TF91 core
32.2
39.4
31.4
150
PWB near IC1400
43.8
57.4
49.7
110
PWB near D952
47.7
52.7
49.1
110
Capacitor, C936 body
28.8
40.2
31.7
105 °C
IC97 heat-sink
40.6
47.6
37.8
-
Capacitor, C915 body
21.9
30.7
24.9
85 °C
PWB near Q657
35.9
45.5
42.4
110
FET, Q657 body
46.5
56.5
54.9
-
Mains heat-sink
42.1
52.4
49.1
-
Appliance inlet body
9.0
15.3
10.1
65
Standby button surface
3.2
5.3
3.8
65
Front cover
6.4
8.8
7.1
65
Top enclosure above TF93
(metallic)
(metallic)
16.2
33.3
17.1
65
Top enclosure above Main heat-
sink (metallic)
sink (metallic)
27.3
39.6
30.4
65
Ambient
27.3 °C
24.9 °C
25.3 °C
-
*) Temperature rise limits for tropical climate is 10K less.
**) Minus (-) 10 K applied for thermo-couple method for windings.
Page 43 of 50
Report No.: 232105
TRF No. IEC60065K
13
TABLES: clearances and creepage distances
P
Rated supply voltage:
240V
Pollution degree ... :
2
Material Group ... :
IIIb
2 N force on internal parts applied:
Yes
P
30 N force on outside of conductive enclosure applied:
Yes
P
Location
Working Voltage
Clearance (mm)
Creepage (mm)
Comm.
V rms
V peak
Min
Actual
Min
Actual
Across primary directly connected to the mains (B)
Live to Neutral
240
340
2.0
4.0
2.5
4.0
1), 2)
Live to Neutral
240
340
2.0
3.1
2.5
3.1
1), 3)
Across mains fuse F901 (B)
240
340
2.0
8.0
2.5
8.0
1)
Optocoupler input to output (R)
PC91 pri. pins to sec. pins
200 *)
350 *)
4.0
6.7
5.0
> 6.7
1), 4)
PC92 pri. pins to sec. pins
200 *)
350 *)
4.0
6.7
5.0
6.7
1)
PC93 pri. pins to sec. pins
190 *)
330 *)
4.0
6.7
5.0
> 6.7
1), 4)
PC94 pri. pins to sec. pins
200 *)
350 *)
4.0
6.7
5.0
> 6.7
1), 4)
PC95 pri. pins to sec. pins
160 *)
350 *)
4.0
8.0
5.0
8.0
1)
PC96 pri. pins to sec. pins
200 *)
350 *)
4.0
6.7
5.0
> 6.7
1), 4)
Primary to Secondary (R)
CY94 pri. pin to sec. pin
205
355
4.0
6.5
5.0
6.5
1)
CY94 pri. pin to TF91 sec. pins
210
400
4.0
6.0
5.0
6.0
1)
CY93 pri. pin to sec. pin
200
355
4.0
6.3
5.0
6.3
1)
PC92 pin to TF91 pin 5
200
350
4.0
6.0
5.0
6.0
1)
CY95 to Sec. GND
240
340
4.0
7.0
5.0
7.0
1)
R976 to Sec. GND
240
340
4.0
7.0
5.0
7.0
1)
Primary to accessible conductive parts (R)
Pri. solder pin to metal chassis
Pri. solder pin to metal chassis
240
340
4.0
6.8
5.0
> 6.8
5)
TH91 trace to metal chassis
240
340
4.0
9.0
5.0
9.0
6)
*)
Measured highest working voltage for optocupler between primary and secondary.
Comments: 1) Measured on PCB
2) Before mains fuse
3)
3)
After rated 6.3A mains fuse and before bridge diode (Part of directly connected to the mains).
4) > 1 mm widths slot provided between insulations.
5)
5)
Measured between pri. solder pins and metal chassis (bottom).
6) Measured between TH91 primary trace and metal chassis (back cover inside)
Page 44 of 50
Report No.: 232105
TRF No. IEC60065K
Circuits conductively connected to the mains (use Tables 8, 9 and 11): see note below.
Notes:
1. Secondary circuits of Class II apparatus which have connector terminals that could be earthed (e.g.
antenna signal input), are subjected to the requirements for circuits conductively connected to the mains in
Tables 8 and 9.
2. Floating secondary circuits of Class I apparatus which have connector terminals that could be earthed
(e.g. antenna signal input), are subjected to the requirements for circuits conductively connected to the
mains in Tables 8 and 9 unless the floating secondary circuit is separated from the primary circuits by an
earthed metal screen (e.g. in the power transformer), or the floating secondary circuit is connected to earth
via a component such as a capacitor.
3. For insufficient clearances and creepage distances from secondary to secondary circuits and from
secondary circuits to earth, see Cl. 4.3.1, 4.3.2 and 11.2.
4. If the minimum creepage distance in Table 11 is less than the minimum required clearance in Tables 8, 9
or 10 as required, then the value for clearance is used as the minimum creepage distance .
"Min" = minimum required.
Notes:
1. Secondary circuits of Class II apparatus which have connector terminals that could be earthed (e.g.
antenna signal input), are subjected to the requirements for circuits conductively connected to the mains in
Tables 8 and 9.
2. Floating secondary circuits of Class I apparatus which have connector terminals that could be earthed
(e.g. antenna signal input), are subjected to the requirements for circuits conductively connected to the
mains in Tables 8 and 9 unless the floating secondary circuit is separated from the primary circuits by an
earthed metal screen (e.g. in the power transformer), or the floating secondary circuit is connected to earth
via a component such as a capacitor.
3. For insufficient clearances and creepage distances from secondary to secondary circuits and from
secondary circuits to earth, see Cl. 4.3.1, 4.3.2 and 11.2.
4. If the minimum creepage distance in Table 11 is less than the minimum required clearance in Tables 8, 9
or 10 as required, then the value for clearance is used as the minimum creepage distance .
"Min" = minimum required.
"Actual = Actual dimensions measured.
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