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Korea Model

Panel System

Display resolution

Antenna

Television System

Channel Coverage

Power Requirements

Plasma Display panel

KDE-W50A10

75-ohm external terminal for VHF/UHF

NTSC

ATSC (8VSB terrestrial)

QAM on cable

Terrestrial (analog)

Cable TV (analog)

Terrestrial (digital)

Cable TV (digital)

220V, 60 Hz

1365 pixels (horizontal) 

 × 768 pixels (vertical)

American TV Standard

ATSC compliant 8VSB

ITU-T J.83 Annex B compliant 64/256 QAM

2-69

1-125

2-69

1-135

KDE-W50A10 (K)     2

Inputs/Outputs

HDMI IN

Video (IN)

S Video (IN)

Audio (IN)

Component Video Input

CONTROL S (IN)

CONTROL S (OUT)

Digital Audio Optical Output
(PCM/Dolby Digital)

Variable/Fixed Audio (OUT)

Sub woofer (OUT)

Screen Size (measured diagonally)

Speaker Output

CENTER SPEAKER IN

Dimensions (W 

× H × D)

Mass

Power Consumption

Supplied Accessories

Video

Audio

3 total (1 on left side panel)

3 total (1 on left side panel)

5 total (1 on left side panel)

2 (Y, P

B

, P

R

)

1

1

1

1

1

KDE-W50A10

25 W 

× 2 + 50 W woofer

Max. 180 W (6 

Ω), 1 kHz, Sensitivity 30 Vp-p

KDE-W50A10

KDE-W50A10

In Use

In Standby

Remote Control (1)

AA (R6) Batteries (2)

AC power cord (1)

AC plug holder (1)

75-ohm coaxial RF cable (1)

AC cord clamp (1)

Cleaning Cloth (1)

Operating Instructions (1)

Quick Setup Guide (1)

Warranty Card (1)

1080i, 720p, 480p, 480i

Two channel linear PCM 32, 44.1 and 48 kHz,
16, 20 and 24 bits

1 Vp-p, 75 ohms unbalanced, sync negative

Y: 1 Vp-p, 75 ohms unbalanced, sync negative
C: 0.286 Vp-p (Burst signal), 75 ohms

500 mVrms (100% modulation)
Impedance: 47 kilohms

Y: 1.0 Vp-p, 75 ohms unbalanced, sync negative;
P

B

: 0.7 Vp-p, 75 ohms

P

R

: 0.7 Vp-p, 75 ohms

Mini jack

Mini jack

Optical rectangular (1)

More than 408 mVrms at the maximum volume
setting (Variable)
More than 408 mVrms (Fixed)
Impedance (output): 2 kilohms

Phono jack

50 inches

1336

789

89 mm

54.0 kg

KDE-W50A10: 430 W

0.5 W

RM-KA002

Design and specifications are subject to change without notice.

KDE-W50A10 (K)     3

After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
1. Check the area of your repair for unsoldered or poorly-sol-

dered connections. Check the entire board surface for solder
splashes and bridges.

2. Check the interboard wiring to ensure that no wires are

“pinched” or contact high-wattage resistors.

3. Check that all control knobs, shields, covers, ground straps,

and mounting hardware have been replaced. Be absolutely cer-
tain that you have replaced all the insulators.

4. Look for unauthorized replacement parts, particularly transis-

tors, that were installed during a previous repair. Point them
out to the customer and recommend their replacement.

5. Look for parts which, though functioning, show obvious signs

of deterioration. Point them out to the customer and recom-
mend their replacement.

6. Check the line cords for cracks and abrasion. Recommend the

replacement of any such line cord to the customer.

7. Check the antenna terminals, metal trim, “metallized” knobs,

screws, and all other exposed metal parts for AC Leakage.
Check leakage as described right.

The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA

WT-540A. Follow the manufacturers’ instructions to use these
instruments.

2. A battery-operated AC milliammeter. The Data Precision 245

digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a

VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOMs that are suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able.  (See Fig. A)

Fig. A. Using an AC voltmeter to check AC leakage.

Ω

µ

!

KDE-W50A10 (K)     4

1-1.

SERVICE POSITION ........................................ 1-1

1-1-1. PANELS AND CAP REMOVAL ................. 1-1

1-1-2. WOOFER BLOCK REMOVAL ................... 1-1

1-1-3. REAR COVER ASSY REMOVAL .............. 1-1

1-2.

STAND, WOOFER BLOCK ASSY REMOVAL

............................................................................ 1-2

1-3.

REAR COVER REMOVAL .............................. 1-2

1-4.

POD-HOST CERT, D-CABLE READY

REMOVAL ........................................................ 1-3

1-5.

QM AND QT BOARDS REMOVAL ............... 1-3

1-6.

DE3, DIC3, J1NU, J2NU AND M1U

BOARDS REMOVAL ....................................... 1-4

1-7.

A1U, A2NU AND P BOARDS REMOVAL .... 1-4

1-8.

G1 AND G2N BOARDS REMOVAL .............. 1-5

1-9.

F AND K BOARDS REMOVAL ...................... 1-5

1-10. H1U BOARD REMOVAL ................................ 1-6

1-11. H2 AND QH BOARDS REMOVAL ................ 1-6

1-12. PLASMA DISPLAY PANEL

ASSY REMOVAL ............................................. 1-7

1-13. H3 AND H4 BOARDS REMOVAL ................. 1-8

1-14. H5 BOARD REMOVAL ................................... 1-8

2-1.

SERVICE MODE ............................................... 2-1

2-2.

SERVICE MODE LIST ..................................... 2-1

3-1.

BLOCK DIAGRAMS ........................................ 3-1

(1)

A1U AND H2 BOARDS ............................... 3-1

(2)

A2NU (1/2) AND J1NU BOARDS ............... 3-2

(3)

A2NU (2/2), H4 AND J2NU BOARDS ........ 3-3

(4)

DE3 BOARD ................................................. 3-4

(5)

DIC3 BOARD ................................................ 3-5

(6)

F AND G1 BOARDS ..................................... 3-6

(7)

G2N BOARD ................................................. 3-7

(8)

K BOARD ...................................................... 3-8

(9)

H1U, H3, H5 AND M1U BOARDS ............. 3-9

(10) P BOARD ....................................................... 3-10

(11) QH AND QM BOARDS ............................... 3-11

(12) QT BOARD ................................................... 3-12

3-2.

FRAME DIAGRAMS ........................................ 3-13

3-3.

CIRCUIT BOARDS LOCATION ..................... 3-14

3-4.

SCHEMATIC  DIAGRAMS  AND

PRINTED  WIRING  BOARDS ........................ 3-14

(1)

Schematic Diagrams of A1U Board .............. 3-15

(2)

Schematic Diagrams of A2NU Board ........... 3-19

(3)

Schematic Diagram of F Board ..................... 3-22

(4)

Schematic Diagram of G1 Board .................. 3-23

(5)

Schematic Diagrams of G2N Board .............. 3-26

(6)

Schematic Diagram of H1U and H2 Boards

........................................................................ 3-29

(7)

Schematic Diagram of H3 and H4 Boards

........................................................................ 3-30

(8)

Schematic Diagram of H5 Board .................. 3-31

(9)

Schematic Diagram of QH Board .................. 3-32

3-5.

SEMICONDUCTORS ....................................... 3-33

4-1.

REAR COVER ASSY AND STAND ............... 4-2

4-2.

CHASSIS-1 ........................................................ 4-3

4-3.

CHASSIS-2 ........................................................ 4-4

4-4.

CHASSIS-3 ........................................................ 4-5

4-5.

CHASSIS-4 ........................................................ 4-6

4-6.

PACKING MATERIALS .................................. 4-7