Sony XVM-R75 Service Manual ▷ View online
9
XVM-R75
2-4. MOTOR (M1), MICRO SW BOARD
2-5. DISPLAY BOARD
1
K 2x3
4
P 2.6x3.5
6
P 2x2.5
7
MICRO SW board
5
motor
(M1)
3
metal cover
2
K 2x3
B
B
1
K 2x5
2
K 2x5
3
K 2x5
8
P 2x5
9
P 2x5
0
P 2x5
qa
DISPLAY board
6
connector
(B3)
7
connector
(B2)
4
K 2x5
5
bottom cover
gear block assy
10
XVM-R75
• Waveforms (MAIN Board)
1
U16
3
(VIN2)
0.5V/DIV 20µsec/DIV
H
1.0Vp-p
SECTION 3
DIAGRAMS
2
U16
7
(VOUT)
1V/DIV 20µsec/DIV
3
U505
qg
(OSC2/CLKOUT)
1V/DIV 0.2µsec/DIV
4MHz
H
2.0Vp-p
2.0Vp-p
• Waveforms (DISPLAY Board)
1
Q38
C
2V/DIV 1µsec/DIV
2.25µsec
2
Q35
C
10V/DIV 5µsec/DIV
3
Q36
C
10V/DIV 5µsec/DIV
19.5µsec
qa
U600
wf
(B_OUT)
2V/DIV 20µsec/DIV
2H
qs
U600
eh
(SYN_S)
0.2V/DIV 20µsec/DIV
H
qd
U601
9
(C)
5V/DIV 20µsec/DIV
H
5.6Vp-p
19.5µsec
20Vp-p
20Vp-p
4.0Vp-p
0.7Vp-p
7.0Vp-p
4
U17
qh
(NON-INV INPUT)
1V/DIV 5µsec/DIV
19.5µsec
5
U1
qf
(X)
0.5V/DIV 20µsec/DIV
6
U600
3
(V_IN)
0.2V/DIV 20µsec/DIV
H
qf
U705
ta
(VIH)
1V/DIV 2msec/DIV
V
qg
U705
th
(HOOUT1)
1V/DIV 20µsec/DIV
H
qh
U705
tk
(VSYNC)
1V/DIV 2msec/DIV
V
3.4Vp-p
H
0.7Vp-p
0.4Vp-p
3.2Vp-p
3.2Vp-p
3.2Vp-p
7
U600
5
(C_IN)
0.5V/DIV 20µsec/DIV
H
8
U600
qh
(VCO_IN)
0.2V/DIV 0.2µsec/DIV
9
U600
ql
(R_OUT)
2V/DIV 20µsec/DIV
2H
qj
U705
ya
(BLK)
1V/DIV 20µsec/DIV
H
qk
U705
yd
(POL2)
1V/DIV 20µsec/DIV
2H
ql
Q301
C
10V/DIV 2µsec/DIV
5µsec
1.0Vp-p
3.58MHz
0.4Vp-p
4.0Vp-p
3.2Vp-p
3.2Vp-p
28Vp-p
0
U600
wa
(G_OUT)
2V/DIV 20µsec/DIV
2H
4.0Vp-p
11
11
XVM-R75
3-1. CIRCUIT BOARDS LOCATION
MICRO SW board
DISPLAY board
POWER SW board
OPEN SW board
E-PHONE board
MAIN board
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
f
: internal component.
•
C
: panel designation.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
(Side A)
parts face are indicated.
Note:
The components identi-
fied by mark
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
•
A
: B+ Line.
•
B
: B– Line.
•
H
: adjustment for repair.
• B13 of XVM-R75 is connected to Connection Box with a
monitor cable.
Power voltage is dc 14.4 V from ACC cord of the Connec-
tion Box and fed with regulated dc power supply.
Power voltage is dc 14.4 V from ACC cord of the Connec-
tion Box and fed with regulated dc power supply.
• B13 of XVM-R75 is connected to Connection Box with a
monitor cable.
Voltage and waveforms are measured at input the color
bar signal from INPUT 1 VIDEO (B11) jack of the Con-
nection Box.
Voltage and waveforms are measured at input the color
bar signal from INPUT 1 VIDEO (B11) jack of the Con-
nection Box.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
g
: VIDEO
F
: AUDIO
• Abbreviation
CND : Canadian model.
for printed wiring boards:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
12
12
XVM-R75
3-2. PRINTED WIRING BOARD — MAIN SECTION (1/2) — • Refer to page 11 for Circuit Boards Location and Common Note on Printed Wiring Boards.
MAIN BOARD (COMPONENT SIDE)
9-885-025-
13
1
A
B
C
D
E
F
G
H
I
J
2
3
4
5
6
7
8
9
10
11
12
13
14
D2
B-7
D3
D-6
D14
F-10
Q1
H-6
Q2
G-9
Q3
D-7
Q4
G-4
Q5
H-8
Q6
H-8
Q7
C-8
Q8
H-9
Q9
E-9
Q10
F-9
Q11
F-9
Q12
E-12
Q13
E10
Q14
C-8
Q15
D-5
Q16
H-10
Q17
G-10
Q18
B-4
Q19
C-3
Q20
C-4
Q21
C-5
Q22
D-9
Q23
D-10
Q505
G-5
U1
C-8
U5
H-9
U6
G-9
U7
F-8
U8
G-8
U11
B-7
U12
F-4
U16
C-10
U18
B-8
U19
B-8
U20
B-4
U21
C-5
U501
G-4
U505
G-6
ZD1
G-10
ZD2
G-4
ZD3
H-10
ZD4
H-10
ZD5
I-10
ZD6
H-10
ZD7
E-5
ZD8
C-7
IR10
I-12
Q10
I-13
• Semiconductor
Location
Ref. No.
Location
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