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US and foreign patents licensed from Dolby
Laboratories.

Model Name Using Similar Mechanism

MEX-1GP

CD Mechanism Type

MG-611WA-186//Q

Optical Pick-up Name

KSS1000E

– Continued on next page –

2007D05-1
© 2007.04

US Model

Canadian Model

AEP Model

UK Model

E Model

The Bluetooth word mark and logos are owned 
by the Bluetooth SIG, Inc. and any use of such 
marks by Sony Corporation is under license. 
Other trademarks and trade names are those of 
their respective owners.

SonicStage and its logo are trademarks of Sony 
Corporation.
“ATRAC” and 

 are trademarks of 

Sony Corporation.

R

Manufactured under license 
from BBE Sound, Inc. 
The BBE MP process 

improves digitally compressed sound, such as 
MP3, by restoring and enhancing the higher 
harmonics lost through compression. BBE MP 
works by generating even-order harmonics from 
the source material, effectively recovering 
warmth, detail and nuance.

The “SAT Radio Ready” 
logo indicates that this 
product will control a 
satellite radio tuner module 

(sold separately). Please see your nearest 
authorized Sony dealer for details on the 
satellite radio tuner module.
“SAT Radio,” “SAT Radio Ready,” the SAT 
Radio and SAT Radio Ready logos and all 
related marks are trademarks of Sirius Satellite 
Radio Inc. and XM Satellite Radio Inc.

Microsoft, Windows Media, 
and the Windows logo are 
trademarks or registered 
trademarks of Microsoft 

Corporation in the United States and/or other 
countries.

Signal-to-noise ratio: 120 dB
Frequency response: 10 

− 20,000 Hz

Wow and flutter: Below measurable limit

Tuning range: 87.5 

− 107.9 MHz

Antenna terminal: External antenna connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),

0.3 % (mono)

Separation: 35 dB at 1 kHz
Frequency response: 30 

− 15,000 Hz

Tuning range: 530 

− 1,710 kHz

Antenna terminal: External antenna connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 

µV

POWER OUTPUT AND TOTAL HARMONIC 
DISTORTION
23.2 watts per channel minimum continuous 
average power into 4 ohms, 4 channels driven 
from 20 Hz to 20 kHz with no more than 5% total 
harmonic distortion.

CEA2006 Standard
Power Output: 17 Watts RMS 

× 4 at 

4 Ohms < 1% THD+N 
SN Ratio: 82 dBA 
(reference: 1 Watt into 4 Ohms)

Tuning range: 87.5 

− 108 MHz

Aerial terminal: External aerial connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),

0.3 % (mono)

Separation: 35 dB at 1 kHz
Frequency response: 30 

− 15,000 Hz

Tuning range: 

MW: 531 

− 1,602 kHz

LW: 153 

− 279 kHz

Aerial terminal: External aerial connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: MW: 30 

µV, LW: 40 µV

87.5 

− 108.0 MHz (at 50 kHz step)

87.5 

− 107.9 MHz (at 200 kHz step)

FM tuning interval: 50 kHz/200 kHz switchable
Aerial terminal: External aerial connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),

0.3 % (mono)

Separation: 35 dB at 1 kHz
Frequency response: 30 

− 15,000 Hz

Tuning range: 

531 

− 1,602 kHz (at 9 kHz step)

530 

− 1,710 kHz (at 10 kHz step)

AM tuning interval: 9 kHz/10 kHz switchable
Aerial terminal: External aerial connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 

µV

2

Outputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 ñ 8 ohms
Maximum power output: 52 W 

× 4 (at 4 ohms)

Outputs: 

Audio outputs terminal (front/rear)
Subwoofer output terminal (mono)
Power antenna relay control terminal
Power amplifier control terminal

Inputs: 

Telephone ATT control terminal
Illumination control terminal
BUS control input terminal
BUS audio input/AUX IN terminal
Remote controller input terminal
Antenna input terminal

Tone controls: 

Low: 

±10 dB at 60 Hz or 100 Hz (XPLOD)

Mid: 

±10 dB at 500 Hz or 1 kHz (XPLOD)

High: 

±10 dB at 10 kHz or 12.5 kHz (XPLOD)

Power requirements: 12 V DC car battery 

(negative ground)

Dimensions: Approx. 178 

× 50 × 183 mm 

(7

1

/

8

 

× 2 × 7

1

/

4

 in) (w/h/d)

Mounting dimensions: Approx. 182 

× 53 × 162 mm 

(7

1

/

4

 

× 2

1

/

8

 

× 6

1

/

2

 in) (w/h/d)

Mass: Approx. 1.2 kg (2 lb 11 oz)
Supplied accessories: 

Card remote commander:

Parts for installation and connections (1 set)

Your dealer may not handle some of the above listed 
accessories. Please ask the dealer for detailed 
information.

Note
This unit cannot be connected to a digital preamplifier 
or an equalizer which is Sony BUS system compatible.

Design and specifications are subject to change 
without notice.

MPEG Layer-3 audio coding technology and 
patents licensed from Fraunhofer IIS and Thomson.

Bluetooth Standard version 2.0

Bluetooth Standard Power Class 2 (Max. +4 dBm)

Line of sight approx. 10 m (32.8 ft)*

1

2.4 GHz band (2.4000 

− 2.4835 GHz)

Modulation method: FHSS
Compatible Bluetooth Profiles*

2

A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HFP (Handsfree Profile)
OPP (Object Push Profile)

*1

The actual range will vary depending on factors 
such as obstacles between devices, magnetic 
fields around a microwave oven, static electricity, 
reception sensitivity, antenna's perfomance, 
operating system, software application, etc.

*2

Bluetooth standard profiles indicate the purpose of 
Bluetooth communication between devices.

RM-X301 (US, Canadian)
RM-X302 (AEP, UK)
RM-X303 (E)

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

This label is located on the bottom of the

• AEP, UK, E model

chassis.

• Keep the temperature of the soldering iron around 270 ˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION – CLASS 1M INVISIBLE LASER RADIATION
WHEN OPEN.
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS.

 0

0

0

3

...............................................

4

...................................................................

6

3-1.

Disassembly Flow ........................................................... 16

3-2.

Front Back Panel Assy .................................................... 16

3-3.

KEY Board ...................................................................... 17

3-4.

Sub Panel Assy ................................................................ 17

3-5.

CD Mechanism Block (MG-611WA-186//Q) ................. 18

3-6.

MAIN Board .................................................................... 18

3-7.

ANTENNA Board, IT Board .......................................... 19

3-8.

Chassis (T) Sub Assy ....................................................... 19

3-9.

Roller Arm Assy .............................................................. 20

3-10. Chassis (OP) Assy ........................................................... 20
3-11. Optical Pick-up (KSS1000E) .......................................... 21
3-12. SL Motor Assy (Sled) (M902) ......................................... 21
3-13. LE Motor Assy (B) (Loading) (M903) ............................ 22
3-14. SERVO Board .................................................................. 22

.............................................................. 23

5-1.

Block Diagram – CD SERVO Section – ......................... 24

5-2.

Block Diagram – BLUETOOTH Section – ..................... 25

5-3.

Block Diagram – AUDIO Section – ................................ 26

5-4.

Block Diagram – DISPLAY/MAIN Section – ................ 27

5-5.

Block Diagram – POWER SUPPLY Section – ............... 28

5-6.

Schematic Diagram – SERVO Section (1/2) – ................ 30

5-7.

Schematic Diagram – SERVO Section (2/2) – ................ 31

5-8.

Printed Wiring Boards – SERVO Section – .................... 32

5-9.

Printed Wiring Board – IT Board – ................................. 33

5-10. Schematic Diagram – IT Board (1/2) – ........................... 34
5-11. Schematic Diagram – IT Board (2/2) – ........................... 35
5-12. Printed Wiring Board

– MAIN Board (Component Side) – ............................... 36

5-13. Printed Wiring Board

– MAIN Board (Conductor Side) – ................................. 37

5-14. Schematic Diagram – MAIN Board (1/3) – .................... 38
5-15. Schematic Diagram – MAIN Board (2/3) – .................... 39
5-16. Schematic Diagram – MAIN Board (3/3) – .................... 40
5-17. Printed Wiring Board – SUB Board – ............................. 42
5-18. Schematic Diagram – SUB Board – ................................ 43
5-19. Schematic Diagram – KEY Board (1/2) – ....................... 44
5-20. Schematic Diagram – KEY Board (2/2) – ....................... 45
5-21. Printed Wiring Board – KEY Board – ............................. 46

6-1.

General Section ............................................................... 67

6-2.

Front Panel Section ......................................................... 68

6-3.

CD Mechanism Deck Section-1 (MG-611WA-186//Q) .. 69

6-4.

CD Mechanism Deck Section-2 (MG-611WA-186//Q) .. 70

6-5.

CD Mechanism Deck Section-3 (MG-611WA-186//Q) .. 71

6-6.

CD Mechanism Deck Section-4 (MG-611WA-186//Q) .. 72

................................ 73

4

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical pick-
up block.

When repairing or servicing this set, connect the jig (extension cable)
as shown below.

• Connect the MAIN board (CNP501) and the SERVO board

(CN2) with the extension cable (Part No. J-2502-076-1).

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

•

Unleaded solder melts at a temperature about 40 ˚C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

SERVO board
(CN2)

MAIN board
(CNP501)

extension cable
(J-2502-076-1)

optical pick-up

semi-fixed resistor