Sony CDX-S22 / CDX-S22S Service Manual ▷ View online
17
17
CDX-S22/S22S
CDX-S22/S22S
3-3. BLOCK DIAGRAM — KEY SECTION —
3-4. CIRCUIT BOARDS LOCATION
KEY ACK
ENEABLE
Q664
82
83
41
28
29
27
40
52
76
LCD
DRIVE
KEYIN0
CLK
CE
LED_SO
LCD_CKO
LCD_CE
KEYIN1
KEYACK
XKEYON
3 AREASEL0
NOSE_SW
OSCIN
OSCOUT
X501
18.432MHz
63
64
62
1
COM1
I
COM4
LCD901
LIQUID
CRYSTAL
DISPLAY
PANEL
LED932
LCD
BACK LIGHT
D503
S502
FREQUENCY
SELECT
10K
9K
BU+3.3V
E,Chinese,Mexican MODEL
4
I
50
•
55
54
I
51
S1
I
S48
CL
DI
CE
DISP+B
LSW904,906,910,911
LED901-903,905,907-909,913-921,941,942,951,952
LED912 (AEP,UK)
(KEY ILLUMINATE)
(
)
KEY MATRIX
LSW904,906,910,911
S901-903,905,907-909,913-921
S912 (AEP,UK)
SYSTEM CONTROL
IC501 (3/3)
79
80
XIN
XCOUT
X502
32.768kHz
LED
DRIVER
Q921
7
DIMMER
2 OUT
REMOTE CONTROL
SIGNAL RECIVER
64
SIRCS
IR
IC971 (AEP,UK)
IC971 (EXCEPT AEP,UK)
IC971 (EXCEPT AEP,UK)
IC901 (AEP,UK)
IC901 (EXCEPT AEP,UK)
IC901 (EXCEPT AEP,UK)
MAIN board
KEY board
SENSOR board
SERVO board
tuner unit
(TU1)
(TU1)
18
18
CDX-S22/S22S
CDX-S22/S22S
For schematic diagrams.
Note:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
a
: Through hole.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• CD mechanism section (1/2), (2/2)
no mark : CD PLAY
• Main (1/2), (2/2) and Key sections
no mark : FM
no mark : CD PLAY
• Main (1/2), (2/2) and Key sections
no mark : FM
(
) : AM or MW
<
> : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD
F
: FM
f
: AM or MW
• Abbreviation
MX
: Mexican model.
CH
: Chinese model.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
Q
C
These are omitted.
E
B
E
These are omitted.
C
B
C
These are omitted.
B
E
• Abbreviation
MX
: Mexican model.
CH
: Chinese model.
• Waveforms
1
IC2
5
(FEI)
Approx.
1Vp-p
1Vp-p
0 V
0.6 Vp-p
16.9344 MHz
Approx. 100 mVp-p
50 mV/DIV, 5 msec/DIV
0.5 V/DIV, 0.5
µ
sec/DIV
2
IC2
6
(TEI)
200 mV/DIV, 5 msec/DIV
6
IC2
oh
(FPI2),
0.5 V/DIV, 0.5
µ
sec/DIV
Approx. 400 mVp-p
3
IC2
wd
(XI)
0.2 V/DIV, 0.2
µ
sec/DIV
7
IC3
ia
(X1)
0.5 V/DIV, 0.2
µ
sec/DIV
1.1 Vp-p
12 MHz
4
IC2
ia
(RFI)
0.5 V/DIV, 0.5
µ
sec/DIV
5
IC2
of
(FNI2),
og
(FNI1)
1.5 Vp-p
oj
(FPI1)
1.5 Vp-p
0 V
— SERVO Board —
(CD PLAY)
— MAIN Board —
2 Vp-p
32.768 kHz
1
IC501
i;
(XOUT)
2.3 Vp-p
18.432 MHz
2
IC501
id
(OSCOUT)
0.5 V/DIV, 0.1
µ
sec/DIV
1.8 Vp-p
8.664 MHz
3
IC51
9
(XTI)
0.5 V/DIV, 0.2
µ
sec/DIV
0.2 V/DIV, 20
µ
sec/DIV
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
19
19
CDX-S22/S22S
CDX-S22/S22S
1
A
B
C
D
E
F
G
H
2
3
4
5
6
7
8
9
10
11
12
13
14
16
1
1-689-230-
TP67
TP68
TP70
TP69
TP47
TP48
TP45
TP46
IC6
R6
R43
R35
C16
C70
C14
C29
C30
C68
C133
C132
R16
R14
R15
C17
C72
R20
R5
R26
R147
Q3
R8
R133
R132
Q21
SW1
C66
C67
C48
C10
R27
R81
C46
R33
R44
R23
R22
R10
R17
R7
R58
R9
R62
R61
IC3
R2
R60
C7
R87
R86
R85
R144
R82
R141
R79
R25
R78
R77
R97
R98
R34
FB3
R55
FB2
C56
R24
Q2
IC1
C13
C80
C69
FB4
C18
R12
C71
C55
C54
C31
C24
C15
R30
TP4
TP3
TP5
TP64
TP11
M901
SW4
M902
M903
TP10
TP1
TP6
TP7
TP8
TP9
TP75
TP76
TP77
TP78
TP79
TP80
TP81
TP82
TP83
TP85
TP90
TP89
TP88
TP91
TP92
TP95
TP97
TP99
TP2
IC2
TP86
TP87
TP84
TP98
TP14
TP15
TP65
SW3
SW2
TP61
TP62
TP51
TP71
TP72
TP74
TP63
TP28
TP22
TP21
TP96
TP42
TP43
TP44
TP29
TP34
TP35
TP30
TP12
TP24
TP25
TP31
TP13
TP38
TP41
TP49
TP50
TP53
TP32
TP33
TP36
TP37
TP39
TP52
BP60
TP23
TP26
TP27
BP10
R37
R36
R31
R32
R65
C40
C50
C23
R64
C60
R39
R63
X2
R54
C47
R53
R38
C43
R42
R52
C36
R28
CN2
R96
R41
C20
R84
R40
R83
R80
R75
R74
R69
R70
R73
R72
R71
R67
R68
C22
R57
C26
R21
C39
C62
C58
R13
CN1
R11
C11
C12
C53
C52
C49
C45
C44
C42
C41
C33
C32
C25
C19
R1
R18
R19
R29
C51
X1
1-866-806-
1-866-806-
3-5. PRINTED WIRING BOARDS — CD MECHANISM SECTION —
• Refer to page 17 for Circuit Boards Location.
: Uses unleaded solder.
(Page 22)
IC1
G-2
(IC2)
B-11
IC3
E-2
IC6
D-2
Q2
C-1
Q3
C-2
Q21
B-4
• Semiconductor
Location
Ref. No.
Location
( ): SIDE B
20
20
CDX-S22/S22S
CDX-S22/S22S
3-6. SCHEMATIC DIAGRAM — CD MECHANISM SECTION (1/2) —
• Refer to page 18 for Waveforms.
R14
R15
IC6
R132
R133
C10
TP21
TP22
TP28
TP29
TP30
TP42
TP45
TP46
C39
R41
R40
R39
R38
R27
R25
R26
R24
R23
R22
TP33
TP32
TP37
TP36
R58
TP39
TP38
TP47
TP48
TP41
TP
35
TP34
R42
TP50
TP49
TP23
TP24
TP25
TP26
TP27
TP52
TP31
R18
C14
TP51
R57
R55
TP53
IC2
C12
C17
C56
C24
C55
C51
C53
C47
C49
C46
C22
C20
R
28
FB2
FB3
C31
C30
R36
R30
C42
C41
C72
C60
C58
R29 R19
C132
C80
C133
C26
C25
C32
C33
R33
R31
R32
R34
C36
TP43
TP44
C29
C23
C40
R37
Q2
Q3
C15
R43
C44
R44
C45
R53
R52
R54
C18
C48
C52
C19
R13
R12
C16
R16
R11
C11
FB4
CN1
X2
Q21
R35
R20
C50
C54
C43
C13
(Page 21)
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