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2009J05-1

© 

2009.10

•  When the operation of the subwoofer or satellite speaker 

is confi rmed, it is necessary to connect both these set.

 Confi rm the subwoofer and satellite speaker are pre-

pared beforehand when you repair.

Satellite speaker
Speaker system

Full range, magnetically shielded

Speaker units

6.5 cm, cone type

Enclosure type

Bass reflex

Impedance

4 

Ω

Cord length

1.5 m

Subwoofer
Speaker system

Woofer

Speaker units

16 cm, cone type

Enclosure type

Bass reflex

Impedance

2 

Ω

Rated output

75 W + 75 W (10% T.H.D., 1 kHz, 
4 

Ω) (Satellite speaker)

150 W (10% T.H.D., 100 Hz, 2 

Ω) 

(Subwoofer)

Input

RCA jack × 1 (INPUT 1)

Voltage: 1 V
impedance: 10 kilohms

Stereo mini jack × 1 (INPUT 2)

Voltage: 500 mV
impedance: 4.7 kilohms

Output

Stereo mini jack × 1 (

i (headphones))

Dimensions (w/h/d)

Approx. 94 × 196 × 135 mm
(3 

3

/

4

 × 7 

3

/

4

 × 5 

3

/

5

 in) 

(Satellite speaker)
Approx. 221 × 403 × 411 mm
(8 

3

/

4

 × 15 

7

/

8

 × 16 

1

/

4

 in) 

(Subwoofer)

Mass

Approx. 0.7 kg (1 lb 9 oz) 
(Satellite speaker)
Approx. 8.5 kg (18 lb 12 oz) 
(Subwoofer)

Power consumption

65 W

Power consumption (during standby mode)

0.5 W

Design and specifications are subject to 
change without notice.

Power requirements

European, Oceanian, China, Argentina and 

AC 220 - 240 V, 50 Hz
North American, Mexican, Brazil, Colombia 
and Venezuela model: AC 120 V, 60 Hz

South East Asia model: 

Taiwan model: AC 110 V, 60 Hz

  .............................................   3

2-1.   Disassembly Flow ...........................................................   4
2-2.   Front Panel Block ...........................................................   4
2-3.   Rear Panel Block ............................................................   5
2-4.   MAIN Board ...................................................................   6
2-5.   Rear Chassis Block .........................................................   6
2-6.   AMP Board .....................................................................   7
2-7.   POWER Board ................................................................   7

TEST  MODE 

 ............................................................  

7

4-1.  Block Diagram - AUDIO Section - .................................   8
4-2.  Block Diagram - AMP Section - .....................................   9
4-3. Block 

Diagram 

 

- PANEL/POWER SUPPLY Section - ............................   10

4-4.  Printed Wiring Board - AUDIO Section (1/2) - ..............   12
4-5.  Printed Wiring Boards - AUDIO Section (2/2) - ............   13
4-6.  Schematic Diagram - AMP Board (1/3) - .......................   14
4-7.  Schematic Diagram - AMP Board (2/3) - .......................   15
4-8.  Schematic Diagram - AMP Board (3/3) - .......................   16
4-9.  Schematic Diagram - AUDIO/PANEL Section - ............   17
4-10.  Printed Wiring Boards - MAIN/PANEL Section - ..........   18
4-11.  Schematic Diagram - MAIN Board - ..............................   19
4-12.  Printed Wiring Board - POWER Board - ........................   20
4-13.  Schematic Diagram - POWER Board - ..........................   21

5-1.  Rear Chassis Section (Subwoofer) .................................   28
5-2.  Front Panel Section (Subwoofer) ....................................   29
5-3.  AMP Board Section (Subwoofer) ...................................   30
5-4.  Cabinet Section (Subwoofer) ..........................................   31
5-5.  Satellite Speaker Section ................................................   32

  ..............................   33

Accessories are given in the last of the electrical parts list.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

CAUTION
These servicing instructions are for use by qualifi ed service per-
sonnel only.
To reduce the risk of electric shock, do not perform any servicing 
other than that contained in the operating instructions unless you 
are qualifi ed to do so.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

Note: Refer to supplement-1 for the AMP, INPUT, JACK, MAIN 

and TERMINAL boards of printed wiring board, schematic 
diagram and electrical parts list of Canadian, Australian, 
Singapore, Taiwan and Argentina models.

LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  0  SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COMPOSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

ADVANCE  PREPARATION  WHEN  CONFIRMING  OP-
ERATION
When the operation of the subwoofer or satellite speaker is con-
fi rmed, it is necessary to connect both these set.
Confi rm the subwoofer and satellite speaker are prepared before-
hand when you repair.

NOTE  OF  REPLACING  THE  IC001  ON  THE  MAIN  
BOARD
IC001 on the MAIN board cannot exchange with single. When this 
part on the MAIN board is damaged, exchange the entire mounted 
board.

JIG
When disassembling the set, use the following jig (for speaker re-
moval).
Part No. J-2501-238-A  JIG FOR SPEAKER REMOVAL

NOTE  OF  REPLACING  THE  IC501  AND  IC551  ON  
THE  AMP  BOARD  AND  THE  COMPLETE  AMP  BOARD
When IC501 and IC551 on the AMP board and the complete AMP 
board are replaced, it is necessary to spread the compound (OIL 
COMPOUND G777) (Part No. J-2501-335-A) between the AMP 
board and the heat sink.
If the compound is not spread, there is a possibility that IC is dam-
aged.
Spread the compound referring to the fi gure below.

NOTE  OF  CONFIRMING  THE  OPERATION
When confi rming the operation the AMP board removed from the 
set, please reduce as much as possible and confi rm the volume 
level of subwoofer.
There is a possibility that IC is damaged when a big volume level 
is put out with the heat sink not fi xed to the AMP board.

US and Canadian models

4-137-747-0[]

AEP model

4-137-747-1[]

UK model

4-137-747-2[]

Chinese model

4-137-747-3[]

Taiwan model

4-137-747-4[]

Brazilian, Colombian and 
Venezuelan models

4-137-747-5[]

Singapore model

4-137-747-6[]

Mexican model

4-137-747-7[]

Argentina model

4-137-747-8[]

Australian model

4-137-747-9[]

•  This set can be disassembled in the order shown below.
•  Subwoofer only is described in this set

Note: Follow the disassembly procedure in the numerical order given.

5 front panel block

1  two screws (BVTP3 u 8)

1  two screws (BVTP3 u 10)

2 two bosses

2 two bosses

3  flat type wire (31 core) (CN802)

4 connector