Sony NW-E303 Service Manual ▷ View online
17
17
NW-E303
NW-E303
4-3. PRINTED WIRING BOARD – MAIN BOARD (SIDE B) –
:Uses unleaded solder.
• Semiconductor
Location
Ref. No.
Location
IC301
D-3
IC400
D-10
IC450
D-7
IC461
D-5
IC508
F-8
IC509
E-4
Q501
B-8
Q502
B-7
Q506
F-9
Q507
F-8
IC301
IC450
IC508
IC400
IC461
IC509
C315
C316
R720
R453
R424
C705
R419
S710
CN301
1
11
12
22
23
33
34
44
1
2
3
4
4
1
5
4
3
1
MAIN BOARD (SIDE B)
B
HEADPHONE
BOARD
CN351
(Page 22)
E
E
(RESET)
1-868-355-
(12)
12
CSP
(Chip Size Package)
(Chip Size Package)
∗
CSP
(Chip Size Package)
(Chip Size Package)
∗
S
E
1
2
A
B
C
D
E
F
G
3
4
5
6
7
8
9
10
11
12
R465
R466
18
18
NW-E303
NW-E303
4-4. SCHEMATIC DIAGRAM – MAIN BOARD (1/4) –
• See page 14 for Waveforms. • See page 26 for IC Pin Function Description.
20
20
20
20
21
21
19
21
21
21
21
21
21
20
A
C
SWITCH
FLEXIBLE
BOARD
(Page 23)
HOLD
C701
C703
C705
C417
C406
C
40
2
C
403
C408
C410
C411
C
41
4
C
4
18
C419
C421
C
4
04
C
405
NAND_XCE1
VDR401
VDR406
X400
VDR704
VDR400
R
40
4
R
4
05
R
4
06
R
4
07
R408
R409
R
41
0
R
41
1
R
4
12
R414
R401
R471
R
4
72
R
47
3
R
4
74
R
70
7
R467
R310
R312
R733
R735
R453
R419
R424
R416
R422
R430
R431
R427
R723
R725
R705
R721
R714
R715
R716
R717
R713
R720
R421
TP407
TP401
TP403
TP702
TP704
TP705
S709
TP700
TP701
TP706
TP703
TP404
TP405
TP418
TP409
TP173
TP408
TP411
R420
TP406
TP413
TP414
TP400
TP415
TP416
TP417
R
41
8
TP402
R423
R711
C
415
C416
X401
C407
C422
TP504
R
718
CN701
R402
CN400
C400
R722
TP412
R724
R709
C420
C423
R732
IC400
0.01
0.01
0.01
0.1
0.1
4
.7
4
.7
1
4.7
1
0
.1
0.1
0.1
0.1
0
.1
0.1
22.4548MHz
2
20
0
2
2
22
2.2k
22
100
1M
22
0
10k
0
0
22
0
2
20
0
4.7k
2.2M
100k
100k
0
0
470k
10k
10k
10k
10k
220
220
220
470k
470k
470k
10k
22k
10k
10k
10k
470
0
100k
PD4
DGND
RXD0
XPLAY
XHOLD
GROUP
ADK1
ADK2
WAKE1
WAKE2
TXD1
RXD1
XMS
XBOOT
EL_PWR
MSINS
MSDI0
10k
RST
D+
D-
GND
MSPWR
MSSCLK
MABS
2
20
TXD0
470k
10k
1
0p
10p
15MHz
0.1
0.1
VBUS
22k
8P
2.2M
8P
0.1
470k
DEBUG
10k
10k
0.001
0.001
0
CXR704060-252GA
21
21
20
21
21
19
19
NW-E303
NW-E303
4-5. SCHEMATIC DIAGRAM – MAIN BOARD (2/4) –
*
18
21
IC450
C462
R461
C805
C807
C808
C809
C810
C811
C812
R809
R810
R814
R813
C806
R806
R805
R802
D801
L801
R811
R450
R451
R452
R454
C450
CN801
R455
R807
R804
R803
C801
IC461
R464
R466 0
R465 0
NAND_XCE1
Q801
R808
S99-50082
R415
100k
100k
1
35V
4.7
1
1
35V
100p
1
35V
1
35V
100k
470k
220k
1M
1
0
0
2.2
MA21D3800LS0
0
0
100k
100k
0
0.1
0
0.1
39P
0
220k
10k
470k
R812
0
10
MCH3443-TL-E
47k
K05SONY03
10µH
20
20
NW-E303
NW-E303
4-6. SCHEMATIC DIAGRAM – MAIN BOARD (3/4), USB BOARD, HEADPHONE BOARD –
• See page 24, 25 for IC Block Diagrams. • See page 14 for Waveform.
18
18
18
21
18
21
18
18
21
21
A
(USB)
(HEADPHONE)
C302
C318
C319
C317
C316
C315
C101
C201
C314
C309
FB301
R301
R201
R206
R202
R102
R101
R106
R205
R105
TP301
TP1
IC1
IC2
IC301
C
2
1
C
2
0
C
19
C
1
7
C
16
TP6
TP5
C13
R13
C12
R12
C11
R6
R
4
C
5
R1
C3
C1
R2
TP2
C25
C24
C22
R16
R14
R15
C26
R3
C28
C30
R17
R20
C2
IC401
C425
R426
R429
R428
C311
C310
R103
C105
C205
R204
R104
C204
C104
C206
C106
R302
R319
J351
TP251
TP151
FB151
FB251
D351
VDR251
VDR151
TP351
TP111
TP211
FB302
TP302
TP304
C151
C251
C152
C252
R151
R251
R303
C
2
9
C102
R203
C202
CN351
X402
L3
C27
C14
C4
D1
D2
L1
L2
C111
C211
C313
C303
C351
CN602
VDR601
ET601
CN601
R602
R603
CN301
1
2.2
2.2
1
0.47
0.47
100p
100p
0.47
10
0H
0
22k
47k
10k
10k
22k
47k
2.2k
2.2k
AT
TEA5767HN
XC6219B272MR
TB2173FTG
0
.0
47
0
.047
0
.0
47
0
.0
47
0
.0
47
TU_R
TU_L
0.022
100k
0.022
47k
0.01
10k
1
0
0
.0
2
2
100k
0.01
0.047
10k
RF_GND
47p
22p
0.1
10
22k
100k
100p
47
1
100
6.3V
10
0
0.1
RV5C348A-E2
0.1
10k
47k
10k
0.47
1
4.7
1
1
22k
22k
100p
100p
1
1
0
R304
0
0
HP-R
HP-L
MA3S13700LS0
SGND_AP
HP-L
HP-R
HP-COM
ANT
220 4V
220 4V
0.022
0.022
4.7k
R152 470
R252
470
4.7k
0
1
0.22
4.7
0.22
4P
32.768KHz
150nH
0.0047
0.001
0.022
BB202 BB202
33nH
33nH
0.1
0.1
1
0.001
0.01
6P
6P
0
0
4P
TP354
ANT
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