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Model
NAS-C5E
Pages
48
Size
3.44 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
nas-c5e.pdf
Date
PREV: Sony NAS-S55HDE / NAS-SC55PKE / SS-S55HDE Service Manual

Sony NAS-C5E Service Manual ▷ View online

NAS-C5E
NAS-C5E
9
9
3-3.   CABINET (FRONT)  BLOCK
3-4.   LCD  BOARD,  LIQUID  CRYSTAL  ELEMENT (LCD1),  HEADPHONE  BOARD,  CABINET (FRONT)  
SUB  ASSY
Note:
 This illustration is seeing the cabinet (front) block from rear side.
 cabinet (front) block
 three wood screws
 (R3.1 
× 10)
 screw
 (BVTP3 
× 8)
 harness
 connector
 (CN1801)
 plate (front ground)
 wire (flat type) (15 core)
 (CN101)
 three screws
 (BVTP3 
× 8)
 LCD board
 four screws
 (BVTP3 
× 6)
 connector (CN102)
 flexible cable
 (CN104)
 liquid crystal element
 (LCD1)
 two flowting screws
  (PTPWH M2.6)
 HEADPHONE board
RB
 cabinet (front) sub assy
 rubber (sensor)
3-5.   MAIN  BOARD  BLOCK
3-6.   MAIN  BOARD
 connector
 (CN1701)
 connector
 (CN1702)
 connector
 connector
 (CN7001)
 wireless LAN 
 module
 cover (module)
RB
 MAIN board block
 four wood screws
 (R3.1 
× 10)
 screw
 (BVTP3 
× 8)
 screw 
 (BVTP3 
× 8)
 screw (BVTP3 × 8)
 screw (BVTP3 × 8)
 screw (BVTP3 × 8)
 plate (front ground)
 holder (jack)
 MAIN board
 wire (flat type) (15 core)
 (CN4501)
 wire (flat type)
  (9 core) (CN4502)
 holder (main PWB)
NAS-C5E
NAS-C5E
10
10
SECTION  4
DIAGRAMS
4-1.  BLOCK  DIAGRAM  - MAIN, AUDIO Section -
ANT1
FILM
ANTENNA
WLAN1
WIRELESS LAN
MODULE
LOW-PASS
FILTER
IC1506
HEADPHONE
AMP
IC1801
PROTECT
DETECT
Q1701
PROTECT
DETECT
Q1704
OVER LOAD
DETECT
Q1707, 1708
MUTING
CONTROL
Q1801
BUFFER
IC7001
SP2
(L-CH)
OVER LOAD
DETECT
Q1705, 1706
MUTING
Q1803, 1805
MUTING
Q1802, 1804
D0 – D15
DMA_D0 –
DMA_D15
D0 – D15
D0 – D15
WLAN_RST_CN
EBA1, EBA20 – EBA22
A0 – A10
A1, A20 – A22
A9A
A9
DMA_A0 –
DMA_A10
50 XWAIT_CF
XWAIT_CF
45
CF_XOE
46
CF_XWE
48
XIOR_CF
49
XIOW_CF
47
XCS0_CF
3
XCS1_CF
XRD
XWE
XIOR_CF
XIOW_CF
XCS_CF
SIRCS_DATA
38 XRST
XREG
XPD
WLAN_INT
LRCKI
HCLK
XBCKI
SIRCS_INT
EBCS1
EBCS2
EBCS3
EBWAIT
XDREQ_BE
EBDREQ0
DATAI
64
LRCK
11
63
4
39
42
43
XOUT
XBCK
XINT_SIRCS
XEBCS1
XEBCS2
XEBCS3
14
XEBWAIT_SYNC
2
44
36
37
1
XDREQ_BE
XEBDREQ
XEBRD
XEBWE
DATA
D0 – D15
A0 – A8, A9A, A10 – A22
WIRELESS LAN INTERFACE
IC6002
FS256
SO3
SCK3
XBCK
LRCK
XCS_DAC
XSP_MUTE
HP_DET
XSP_PD
PROTECT
DADT
16 SCK
13
14
1
3
15
2
MD
MC
BCK
LRCK
ML
DATA
FS256
XBCK
LRCK
7
8
VOUTL
VOUTR
R-CH
5
MUTE
SHUTDOWN
LINP
21
LOUTN
19
20
22
LOUTP
LOUTP
LOUTN
R-CH
46
44
45
FAUL
T
J9201
PHONES
J9202
AUDIO IN
SYSTEM CONTROLLER, DSP
IC4001 (1/2)
D/A CONVERTER
IC1501
POWER AMP
IC1701
R-CH
XMUTE
A
SIRCS
EBD0 – EBD15
EBA0 – EBA22
WLAN_RST
WLAN_INT
WLAN_XPD
D0 – D15
A1 – A8, 
A9A,
A10 – A22
A0 – A21
DQ0 – DQ15
26
XCE
11
28
XWE
XOE
EBCS0
EBRD
EBWE
12 XRESET
B
XRST_I0
FLASH MEMORY
IC5001
A/D CONVERTER
IC3301
261
181
260
259
202
342
343
344
208
292
340
264
248
249
271
274
273
268
198
191
201
255
220
206
267
254
347
348
341
2
1
AINL
AINR
FS256
XBCK
LRCK
XPD_ADC
ADDT
13
PDN
9
SDTO
272
263
10
LRCK
11
12
MCLK
SCLK
: AUDIO
SIGNAL PATH
: WIERLESS LAN
R-ch is omitted due to same as L-ch.
SP1
(R-CH)
NAS-C5E
NAS-C5E
11
11
4-2.  BLOCK  DIAGRAM  - PANEL, POWER SUPPLY Section -
REMOTE CONTROL
RECEIVER
IC9201
D9001
LED DRIVE
Q9001, 9003
LED DRIVE
Q9002, 9004
USB DETECT
Q4001
USB DETECT
Q4002
BUFFER
IC4003
CN4001
(USB)
LCD1
LIQUID CRYSTAL
DISPLAY
−
+
DC IN 12V
+3.3V
REGULATOR
IC2915
RESET SIGNAL
GENERATOR
IC2914
+4V
REGULATOR
IC2903
+3.3V
REGULATOR
IC2916
+3.3V
REGULATOR
IC2912
+1.5V
REGULATOR
IC2911
+2.2V
REGULATOR
IC2910
+2.6V
REGULATOR
IC2909
+5V
REGULATOR
IC2908
+3.3V
REGULATOR
IC2906
+5.7V
REGULATOR
IC2902
RESET SIGNAL
GENERATOR
IC2913
I
/ 
(GRN)
(RED)
S9002 – 9016
SYSTEM CONTROLLER, DSP
IC4001 (2/2)
LCD CONTROLLER
IC101
LCD
BACK LIGHT
CONTROL
Q109
REAL TIME CLOCK
IC4002
J2401
168
167
PWR_STBY_LED_G
PWR_STBY_LED_A
115 – 117 SET_KEY_3 –
SET_KEY_1
221 VBUS_DET
1
2
3
283 UDM
287 DTL
282 UDP
VBUS
DATA–
DATA+
205 WAKE_INT
A
SIRCS
LCD_SCK
SI4(LCD-SO)
SO4(LCD-SI)
LCD-CS
XLCD_RST
250
251
252
253
266
24 P12/XSCLK
25
26
17
9
P11/SOUT
P10/SIN
K01
XRESET
61
R32/XCE2
35
55
56
R00/A0
P07/D7 – P00/D0
R24/XRD
R25/XWR
34 – 27
XCS
A0
XRD
XWR
XRE_SET
LCD_BL–
D7 – D0
SCK0
BL_PWM
SI0
CS_RTC
RTC_INT
211
178
180
226
204
12 CE
1
2
9
SIO
SCLK
/INTR
SO0 179
290 UOSCI
291 UOSCO
X4002
48MHz
276 OSCI
277 OSCO
X4003
22.5792MHz
THP4001
119 TEMP_MON
F2401
D4028
B
XRST_I0
VDC_MON 121
AU_PWR_ON 177
XRST 135
USBHOLD2 236
XRST_IO 269
VSP
DDC_5.7V
AU_5V, HP_5V
AU_33V
DRAMVDD
VDD_26V
VDD_1.5V
USB_33V
EVR_33V
SYS_33V
3
2
OSC4
OSC3
X101
8MHz
8
7
OSCIN
OSCOUT
X4004
32.768kHz
: USB
SIGNAL PATH
LED DRIVE
Q9005, 9007
217 PARTY_LED_A
D9001
PARTY
F2402
NAS-C5E
NAS-C5E
12
12
For Schematic Diagrams.
Note:
•  All capacitors are in μF unless otherwise noted. (p: pF) 50 
WV or less are not indicated except for electrolytics and 
tantalums.
•  All resistors are in Ω and 1/4 W or less unless otherwise 
specifi ed.
•      f  : internal component.
•  C : panel designation.
THIS  NOTE  IS  COMMON  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
•  X : Parts extracted from the component side.
•  Y : parts extracted from the conductor side.
•      f  : internal component.
• 
 : Pattern from the side which enables seeing.
  (The other layers' patterns are not indicated.)
•  Indication of transistor.
 
C
B
These are omitted.
E
Q
Caution:
Parts face side:
(SIDE A)
Pattern face side: 
(SIDE B)
Parts on the parts face side seen from   
the pattern face are indicated.
Parts on the pattern face side seen from   
the parts face are indicated.
•  Lead layouts
surface
CSP (Chip Size Package) 
Lead layout of conventional IC 
Note: The components identifi ed by mark 0 or dotted 
line with mark 0 are critical for safety. 
 
Replace only with part number specifi ed.
Caution:
Parts face side:
(Conductor Side)
Pattern face side: 
(Component Side)
Parts on the parts face side seen from   
the pattern face are indicated.
Parts on the pattern face side seen from   
the parts face are indicated.
•  MAIN board is multi-layer printed board.
  However, the patterns of intermediate-layers have not 
been included in diagrams.
•  A : B+ Line.
•  Voltages and waveforms are dc with respect to ground 
under no-signal conditions.
  no mark : POWER ON
       
*
  : Impossible to measure
•  Voltages are taken with VOM (Input impedance 10 MΩ).
  Voltage variations may be noted due to normal production 
tolerances.
•  Waveforms are taken with a oscilloscope.
  Voltage variations may be noted due to normal production 
tolerances.
•  Circled numbers refer to waveforms.
•  Signal path.
  N  : WIRELESS LAN
  F 
: AUDIO
  O  : USB
•  The voltage and waveform of CSP (chip size package) 
cannot be measured, because its lead is different from 
that of conventional IC.
• Waveforms
– MAIN Board –
– LCD Board –
22.8 μs
3.6 Vp-p
IC3301 R (LRCK)
2 V/DIV, 10 μs/DIV
IC3301 RB (MCLK)
2 V/DIV, 50 ns/DIV
88.5 ns
4.3 Vp-p
IC3301 RT (SCLK)
2 V/DIV, 200 ns/DIV
352 ns
3.8 Vp-p
IC4002  (OSCOUT)
500 mV/DIV, 20 μs/DIV
30.4 μs
1 Vp-p
44.2 ns
3 Vp-p
X4003
1 V/DIV, 20 ns/DIV
RB
X101
500 mV/DIV, 50 ns/DIV
125 ns
1.2 Vp-p
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