NAS-S55HDE, NAS-SC55PKE, SS-S55HDE — Sony Audio Service Manual (repair manual)

Model
NAS-S55HDE NAS-SC55PKE SS-S55HDE
Pages
106
Size
10 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
nas-s55hde-nas-sc55pke-ss-s55hde.pdf
Date

View Sony NAS-S55HDE / NAS-SC55PKE / SS-S55HDE Service Manual online

SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
NAS-S55HDE/SS-S55HDE
SPECIFICATIONS
NAS-S55HDE
HDD NETWORK AUDIO SYSTEM
SS-S55HDE
SPEAKER SYSTEM
9-889-036-02
2009I00-1
© 
2009.09
AEP Model
UK Model
Ver. 1.1  2009.09
•  SS-S55HDE is the speaker system of 
NAS-S55HDE.
•  AEP model is the HDD network audio 
system of NAS-SC55PKE.
•  UK model is the HDD network audio 
system of NAS-SC55PKE and single 
sales model.
CD
Section
Model Name Using Similar Drive
NAS-50HDE
CD-ROM Drive Name
CD-5010A-020
HD 
Section
Model Name Using Similar Drive
NEW
Hard Disk Drive Name
HDD/SG-NIGHTHAWK-S (80GB)
Trademarks, etc.
Independent JPEG Group.
• ATRAC and 
 are trademarks of Sony 
Corporation.
• “WALKMAN”, 
 and 
 are 
registered trademarks of Sony Corporation.
• “GIGA JUKE” and its logo are trademarks of Sony 
Corporation.
• US and foreign patents licensed from Dolby Laboratories.
• MPEG Layer-3 audio coding technology and patents 
Corporation in the United States and/or other countries.
technology outside of this product is prohibited without 
subsidiary.

by MORISAWA & COMPANY LTD.
COMPANY LTD., and the copyright of the font also 
belongs to MORISAWA & COMPANY LTD.
• Built with Linter Database.
Copyright © 2006-2007, Brycen Corp., Ltd.
Copyright © 1990-2003, Relex, Inc., All rights reserved.
• Music recognition technology and related data are provided 
by Gracenote®. Gracenote is the industry standard in music 
recognition technology and related content delivery. For 
more information, please visit www.gracenote.com.
CD and music-related data from Gracenote, Inc., copyright 
practice one or more of the following U.S. Patents: 
#5,987,525; #6,061,680; #6,154,773, #6,161,132, #6,230,192, 
#6,230,207, #6,240,459, #6,330,593, and other patents issued 
or pending. Some services supplied under license from 
Open Globe, Inc. for U.S. Patent: #6,304,523. 
Gracenote and CDDB are registered trademarks of 
“Powered by Gracenote” logo are trademarks of Gracenote.
DIN power output (rated):
40 + 40 W (6 
Ω
 at 1 kHz, DIN)
Continuous RMS power output (reference):
50 + 50 W (6 
Ω
 at 1 kHz, 10 % THD) 
Music Power output (reference):
50 + 50 W (6 
Ω
 at 1 kHz, 10 % THD)
CD player section 
System:
Compact disc and digital audio system
Laser Diode Properties:
Emission duration: continuous
Laser Output*
1
: Less than 44.6 μw
*
1
distance of 200 mm from the objective lens 
surface on the Optical Pick-up Block with 
7 mm aperture.
Frequency response:
20 Hz - 20 kHz (±0.5 dB)
Total harmonic distortion:
Less than 0.1 %
HDD Jukebox section
Capacity:
80 GB*
1
*
1
A portion of the memory is used for system 
management functions. Actual available 
memory is approx. 68 GB (73,014,444,032 bytes).
Recording format:
MP3
Linear PCM
at a 
Importing format*
1
:
MP3 (“.mp3”, “.oma”)
Linear PCM (“.wav”, “.oma”)
WMA (“.wma”, “.oma”)
ATRAC (“.oma”)
*
1
WMA Professional, WMA Lossless, WMA 
Voice, and 
Management).
WMA formats: 
– Continued on next page –
NAS-S55HDE/SS-S55HDE
2
218.640 MHz
11B
220.352 MHz
11C
222.064 MHz
11D
223.936 MHz
12A
225.648 MHz
12B
227.360 MHz
12C
229.072 MHz
12D
230.784 MHz
13A
232.496 MHz
13B
234.208 MHz
13C
235.776 MHz
13D
237.488 MHz
13E
239.200 MHz
13F
Inputs/Outputs
MONITOR OUT (phono jack):
1 Vp-p, 75 
Ω
unbalanced (NTSC)
AUDIO IN (top: stereo mini jack) / AUDIO
IN (rear: phono jacks):
Voltage 0.8 V (standard),
impedance 10 k
Ω
 (top) / 1.5 V 
(low sensitivity), impedance 10 k 
Ω
(rear)
NETWORK port:
10BASE-T/100BASE-TX
USB port:
USB type A, Hi-Speed USB for
connecting USB devices such as
“WALKMAN”
DMPORT
Output voltage: DC 5 V
mA
PHONES jack (stereo mini jack):
Accepts headphones of 8 
Ω
or
more
Speaker
Speaker system:
Speaker units:
Woofer: 120 mm, cone type
Nominal impedance:
6
Ω
Dimensions (w/h/d)
Approx. 140 × 283 × 245 mm 
(including a grille)
Mass
Approx. 2.8 kg net per speaker
Wireless adaptor
Interface:
IEEE802.11 b/g-compliant
2.4 GHz radio frequency band
General
Power requirements:
230 V AC, 50/60 Hz
Power consumption:
65 W (0.5 W or lower at the
standard (power save) mode)
Dimensions (w/h/d) (including 
projecting parts and controls):
UK model:
With the display window lowered:
approx. 285 × 143 × 317.4 mm
With the display window raised:
approx. 285 × 193 × 317.4 mm
Models except the UK model
With the display window lowered:
approx. 285 × 143 × 311 mm
With the display window raised:
approx. 285 × 193 × 311 mm
Mass (Approx.):
5.0 kg
Operating temperature:
+5
o
C (+41 
o
F) to +35 
o
C (+95 
o
F)
Operating humidity:
25 % to 80 %
Supplied accessories:
subject to change without notice.
Maximum recording time (measured
with ATRAC 48 kbps):
About 3,400 h
Maximum number of tracks:
40,000
FM tuner section
Tuner:
FM stereo tuner
Frequency range:
87.5 - 108.0 MHz (50 kHz step)
Antenna:
FM wire antenna
Antenna terminals:
75
Ω 
unbalanced
Intermediate frequency:
10.7 MHz
AM tuner section
Tuner:
AM tuner
Frequency range:
531 - 1,602 kHz (with the interval
set at 9 kHz)
Antenna:
AM loop antenna
Antenna terminals:
External antenna terminal
Intermediate frequency:
450 kHz
DAB tuner section (UK 
model only)
Tuner:
DAB stereo tuner
Antenna:
DAB wire antenna
Antenna terminals:
75
Ω
 unbalanced
Frequency range:
Band-III: 174.928 (5A) – 239.200 
(13F) MHz
DAB frequency table (Band-III):
Frequency
Label
174.928 MHz
5A
176.640 MHz
5B
178.352 MHz
5C
180.064 MHz
5D
181.936 MHz
6A
183.648 MHz
6B
185.360 MHz
6C
187.072 MHz
6D
204.640 MHz
9B
206.352 MHz
9C
208.064 MHz
9D
209.936 MHz
10A
211.648 MHz
10B
213.360 MHz
10C
215.072 MHz
10D
216.928 MHz
11A
Wireless adaptor (1)
USB extension cable (1)
Speaker codes (2)
Speaker pads (8)
AM loop antenna (1)
FM wire antenna (1) 
DAB wire antenna (1) (for the 
UK model only)
Remote control (1)
R 6  (size AA) batteries (2)
Operating Instructions (this manual)
GNU General Public License/GNU 
Lesser General Public License (1)
License agreement for SONY 
software (1)
Frequency
Label
188.928 MHz
7A
190.640 MHz
7B
192.352 MHz
7C
194.064 MHz
7D
195.936 MHz
8A
197.648 MHz
8B
199.360 MHz
8C
201.072 MHz
8D
202.928 MHz
9A
SAFETY-RELATED COMPONET WARNING!
COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 
0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
Notes on chip component replacement
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
This appliance is 
classified as a CLASS 1
LASER product. This
marking is located on the 
rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures other than 
those specifi ed herein may result in hazardous radiation exposure.
About the self-diagnosis function
A service number consisting of
E 00 11) appears in the display
when the self-diagnosis
function activates to prevent
abnormal operation. When this
service number appears, consult the local
authorized service facility and report this service
number to the service personnel.
NAS-S55HDE/SS-S55HDE
3
1. 
SERVICING  NOTES
  .............................................   4
2. GENERAL
  ..................................................................   9
3. DISASSEMBLY
3-1. Disassembly 
Flow 
...........................................................  12
3-2.  Panel (Side L/R) Assy .....................................................   13
3-3.  Cover (Base) Assy, Panel (Top) Block ...........................   13
3-4.  PANEL (TOP) Board, LCD Block ..................................   14
3-5. Module 
(LCD) 
................................................................  14
3-6.  Panel (Front) Block .........................................................   15
3-7.  Knob (VOL), PANEL (TOP) Board ...............................   15
3-8. Chassis 
(Top) 
..................................................................  16
3-9. MOTHER 
Board 
.............................................................  16
3-10. SP/DM Board ..................................................................   17
3-11. MAIN Board ...................................................................  17
3-12.  Hard Disc Drive ..............................................................   18
3-13.  Fan. DC (M101), Chassis (MID) ....................................   18
3-14. CD Block ........................................................................   19
3-15.  Note the CD-ROM Drive and 
 
Insulating (CD) Replacing ..............................................   19
3-16.  CD-ROM Drive (CD-5010A-020) ..................................   20
3-17.  Position of Frrite Core for Speaker Cord ........................   20
4. 
TEST  MODE 
 ............................................................   21
5. DIAGRAMS
5-1.  Block Diagram - MAIN Section - ...................................   23
5-2.  Block Diagram - PANEL, DSP Section -........................   24
5-3.  Block Diagram - AUDIO Section - .................................   25
5-4.  Block Diagram - POWER SUPPLEY Section - .............   26
5-5. Printed 
Wiring 
Board 
 
- MOTHER Board (Component Side) - ..........................   28
5-6. Printed 
Wiring 
Board 
 
- MOTHER Board (Conductor Side) - ...........................   29
5-7.  Schematic Diagram - MOTHER Board (1/10) - .............   30
5-8.  Schematic Diagram - MOTHER Board (2/10) - .............   31
5-9.  Schematic Diagram - MOTHER Board (3/10) - .............   32
5-10.  Schematic Diagram - MOTHER Board (4/10) - .............   33
5-11.  Schematic Diagram - MOTHER Board (5/10) - .............   34
5-12.  Schematic Diagram - MOTHER Board (6/10) - .............   35
5-13.  Schematic Diagram - MOTHER Board (7/10) - .............   36
5-14.  Schematic Diagram - MOTHER Board (8/10) - .............   37
5-15.  Schematic Diagram - MOTHER Board (9/10) - .............   38
5-16.  Schematic Diagram - MOTHER Board (10/10) - ...........   39
5-17. Printed Wiring Board 
 
- MAIN Board (Component Side) - ................................   40
5-18. Printed Wiring Board 
 
- MAIN Board (Conductor Side) - ..................................   41
5-19.  Schematic Diagram - MAIN Board (1/4) - .....................   42
5-20.  Schematic Diagram - MAIN Board (2/4) - .....................   43
5-21.  Schematic Diagram - MAIN Board (3/4) - .....................   44
5-22.  Schematic Diagram - MAIN Board (4/4) - .....................   45
5-23.  Printed Wiring Board - DAB PS Board (UK Model) - ...   46
5-24.  Schematic Diagram - DAB PS Board (UK Model) - ......   46
5-25.  Printed Wiring Board - SP/DM Board - ..........................   47
5-26.  Schematic Diagram - SP/DM Board - ............................   47
5-27.  Printed Wiring Board - PANEL (FRONT) Board - ........   48
5-28.  Schematic Diagram - PANEL (FRONT) Board - ...........   48
5-29.  Printed Wiring Board - PANEL (TOP) Board - ..............   49
5-30.  Schematic Diagram - PANEL (TOP) Board - .................   49
5-31.  Printed Wiring Board - LCD Board - ..............................   50
5-32.  Schematic Diagram - LCD Board - ................................   51
5-33. Printed Wiring Boards 
 
- AUDIO INPUT/OUTPUT Section -.............................   52
TABLE  OF  CONTENTS
5-34. Schematic Diagram 
 
- AUDIO INPUT/OUTPUT Section -.............................   52
6. 
EXPLODED  VIEWS
6-1.  Front Panel Section .........................................................   82
6-2.  Panel (Top) Section .........................................................   83
6-3. LCD 
Section 
...................................................................  84
6-4.  MAIN Board, MOTHER Board Section ........................   85
6-5. HDD 
Section 
...................................................................  86
6-6. CD-ROM 
Drive, 
Chassis 
Section 
...................................  87
6-7. Speaker 
Section 
(SS-S55HDE) 
.......................................  88
7. 
ELECTRICAL  PARTS  LIST
  ..............................   89
NAS-S55HDE/SS-S55HDE
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•   Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 
heated tip is applied for too long, so be careful!
•   Strong viscosity
 
Unleaded solder is more viscou-s (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•   Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
About the Hard Disk Drive
Because of its high storage density, the hard disk can read and
write data a very high speeds.
It is, however, easily damaged by mechanical vibration, shock, or
dust. Although the hard disk is equipped with safety mechanisms
to prevent the lost of data due to these factors, the following
precautions should be taken during the handling of the  unit.
• Do not subject the  unit to strong shocks or vibrations.
• Do not place the unit in a location subject to mechanical
vibration or at an unstable location.
• Do not move the unit while the power cord is connected to a 
wall outlet.
• Do not disconnect the power cord while the unit is recording or
playing a track.
• Do not use the unit in a place subject to extreme changes in 
temperature (a temperature gradient greater than 18°F (10°C)/
hour).
• Do not attempt to replace or upgrade the hard disk drive by
yourself, as this may cause the unit to malfunction.
Sony cannot provide compensation for any loss of data caused by a 
damaged hard disk drive.
On data back up
Audio data and system settings stored on the unit’s hard disk may
be lost during repairs done to the unit. Before taking the unit in for 
repairs, it is recommended that you record the settings on a piece
of paper and that you use the Back Up function to back up the data 
to a shared folder on your computer or a USB hard disk drive (see
“Backing up and restoring audio data” on page 104).
Data on the unit’s HDD is subject to damage during normal
operations. To prevent the loss of data, you should back up the data 
on a regular basis. Please note that we cannot take responsibility
for any data that may be lost or
repairs.
Cleaning the cabinet
detergent solution. Do not use any type of abrasive pad, scouring
powder, or solvent, such as thinner, benzine, or alcohol.
Note on the power cord
Before you unplug the power cord from the wall outlet, make sure
that the unit is in standby mode (the On/Standby indicator is lit up 
red or orange). If you unplug the power cord while the unit is
operating (the On/Standby indicator lit up green), data that was
recorded may be lost or the unit may malfunction.
slightly moistened with a mild
NOTE  THE  CN400  ON  THE  DAB  PS  BOARD  RE-
PLACING
CN400 on the DAB PS board cannot exchange with single. When 
CN400 on the DAB PS board is damaged, exchange the entire 
mounted board.
NOTE  THE  CN5002,  IC501,  IC1001,  IC1002,  IC2001,  
IC2101,  IC5001,  IC9101,  IC9201,  IC9301  AND  IC9401  
ON  THE  MOTHER  BOARD  REPLACING
CN5002, IC501, IC1001, IC1002, IC2001, IC2101, IC5001, 
IC9101, IC9201, IC9301 and IC9401 on the MOTHER board can-
not exchange with single. When CN5002, IC501, IC1001, IC1002, 
IC2001, IC2101, IC5001, IC9101, IC9201, IC9301 and IC9401 on 
the MOTHER board are damaged, exchange the entire mounted 
board.
Page of 106
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Here you can view online or download Sony NAS-S55HDE / NAS-SC55PKE / SS-S55HDE Service Manual in pdf. This Service Manual can help you recover, restore, fix, disassemble and repair Sony NAS-S55HDE / NAS-SC55PKE / SS-S55HDE Audio. Information contained in Sony NAS-S55HDE / NAS-SC55PKE / SS-S55HDE service manual (repair manual) typically includes:

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  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Parts list (bill of materials).