Sony MHC-VX333 (serv.man2) Service Manual ▷ View online
2
HCD-VX333
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
General
Power requirements
Thai model:
Thai model:
220 V AC, 50/60 Hz
Other models:
120 V, 220 V or
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
Power consumption
190 watts
Dimensions (w/h/d)
Approx. 280
× 325 × 421 mm
Mass
Approx. 10.5 kg
Supplied accessories:
AM loop antenna (1)
Remote Commander (1)
Batteries (2)
FM lead antenna (1)
Speaker pads (8)
Video cable (1)
Remote Commander (1)
Batteries (2)
FM lead antenna (1)
Speaker pads (8)
Video cable (1)
Design and specifications are subject to change
without notice.
without notice.
3
HCD-VX333
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
TABLE OF CONTENTS
MODEL IDENTIFICATION
— BACK PANEL —
MODEL
E, EA, IA, JE, SP, TW models
TH model
PARTS No.
4-234-091-3s
4-234-091-9s
• Abbreviation
MY
: Malaysia model.
SP
: Singapore model.
TH
: Thai model.
EA
: Saudi Arabia model.
PARTS No.
1. SERVICE NOTE
······························································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBLY
································································ 7
4. TEST MODE
···································································· 13
5. ELECTRICAL ADJUSTMENTS
······························· 17
6. DIAGRAMS
······································································ 19
6-1. Circuit Board Location ················································ 19
6-2. Block Diagrams Tuner/CD Section ···························· 21
6-2. Block Diagrams Tuner/CD Section ···························· 21
Main Section ······························································· 22
Video CD Section ························································ 23
Video CD Section ························································ 23
6-3. Printed Wiring Board –Main Board– ························· 24
6-4. Schematic Diagram –Main Board (1/4)– ··················· 25
6-5. Schematic Diagram –Main Board (2/4)– ··················· 26
6-6. Schematic Diagram –Main Board (3/4)– ··················· 27
6-7. Schematic Diagram –Main Board (4/4)– ··················· 28
6-8. Printed Wiring Board –BD Board– ···························· 29
6-9. Schematic Diagram –BD Board– ······························· 30
6-10. Printed Wiring Board –Power AMP Board– ·············· 31
6-11. Schematic Diagram –Power AMP Board– ················· 32
6-12. Printed Wiring Board –Panel Section– ······················· 33
6-13. Schematic Diagram –Panel Section– ························· 34
6-14. Printed Wiring Board –Key Board– ··························· 35
6-15. Schematic Diagram –Key Board– ······························ 36
6-16. Printed Wiring Board –Video CD Board– ·················· 37
6-17. Schematic Diagram –Video CD Board (1/2)– ············ 38
6-18. Schematic Diagram –Video CD Board (2/2)– ············ 39
6-19. Printed Wiring Board –Driver Section– ····················· 40
6-20. Schematic Diagram –Driver Section– ························ 41
6-21. Printed Wiring Board –Trans Section– ······················· 42
6-22. Schematic Diagram –Trans Section– ························· 43
6-23. IC Pin Function Description ········································ 44
6-24. IC Block Diagrams ······················································ 48
6-4. Schematic Diagram –Main Board (1/4)– ··················· 25
6-5. Schematic Diagram –Main Board (2/4)– ··················· 26
6-6. Schematic Diagram –Main Board (3/4)– ··················· 27
6-7. Schematic Diagram –Main Board (4/4)– ··················· 28
6-8. Printed Wiring Board –BD Board– ···························· 29
6-9. Schematic Diagram –BD Board– ······························· 30
6-10. Printed Wiring Board –Power AMP Board– ·············· 31
6-11. Schematic Diagram –Power AMP Board– ················· 32
6-12. Printed Wiring Board –Panel Section– ······················· 33
6-13. Schematic Diagram –Panel Section– ························· 34
6-14. Printed Wiring Board –Key Board– ··························· 35
6-15. Schematic Diagram –Key Board– ······························ 36
6-16. Printed Wiring Board –Video CD Board– ·················· 37
6-17. Schematic Diagram –Video CD Board (1/2)– ············ 38
6-18. Schematic Diagram –Video CD Board (2/2)– ············ 39
6-19. Printed Wiring Board –Driver Section– ····················· 40
6-20. Schematic Diagram –Driver Section– ························ 41
6-21. Printed Wiring Board –Trans Section– ······················· 42
6-22. Schematic Diagram –Trans Section– ························· 43
6-23. IC Pin Function Description ········································ 44
6-24. IC Block Diagrams ······················································ 48
7. EXPLODED VIEWS
7-1. Main Section ······························································· 52
7-2. Front Panel Section ····················································· 53
7-3. Main Board Section ····················································· 54
7-4. CD Mechanism Deck Section ····································· 55
7-2. Front Panel Section ····················································· 53
7-3. Main Board Section ····················································· 54
7-4. CD Mechanism Deck Section ····································· 55
8. ELECTRICAL PARTS LIST
······································· 56
JE
: Tourist model.
IA
: Indonesian model.
TW
: Taiwan model.
4
HCD-VX333
SECTION 1
SERVICE NOTE
1
Connector
13p (CN712)
2
Cut the seven melted-connection points
with a cutting plier.
4
Cut the six melted-connection points
with a cutting plier.
3
Panel board
5
Key board
Panel board
(eleven screw holes)
(eleven screw holes)
Key board
(eight screw holes)
(eight screw holes)
Screw hole
In order to re-install the panel board and the key board,
fix them by using the screws (+BVTP 2.6
fix them by using the screws (+BVTP 2.6
×
8 ) respectively.
Screw in to the respective screw holes.
Do not tighten the screws excessively.
Do not tighten the screws excessively.
* The panel board and the key board only are connected to the front panel
by means of hot-melting the plastics.
by means of hot-melting the plastics.
Note for installing the panel board and the key board
REMOVING THE PANEL BOARD AND THE KEY BOARD
Hot melt
5
HCD-VX333
This section is extracted
from instruction manual.
from instruction manual.
SECTION 2
GENERAL
Main unit
ql
w;
qj
qh
qk
qg
qd
qf
wa
ws
wd
wf
wg
wh
wj
wk
eg
eh
ej
ef
ed
es
e; wl
1 2 3 4
7
6
5
9 0
qa
qs
8
ea
AUDIO jacks eg (30)
CD qd (10 – 13, 22, 23)
CD SYNC wg (22, 23)
Deck A ea (20, 21)
Deck B wa (20 – 24)
DIRECTION 8 (21 – 23, 27)
DISC 1 – 3 ws (10, 11, 13)
DISC SKIP EX-CHANGE ed
CD qd (10 – 13, 22, 23)
CD SYNC wg (22, 23)
Deck A ea (20, 21)
Deck B wa (20 – 24)
DIRECTION 8 (21 – 23, 27)
DISC 1 – 3 ws (10, 11, 13)
DISC SKIP EX-CHANGE ed
(10, 11, 13)
Disc tray 9 (10)
DISPLAY 8 (9, 14)
ECHO LEVEL control wk (27)
EDIT 8 (23)
EFFECT ON/OFF 4
DISPLAY 8 (9, 14)
ECHO LEVEL control wk (27)
EDIT 8 (23)
EFFECT ON/OFF 4
(25, 27)
ENTER qa (9, 13, 14, 18, 19,
23 – 25, 28, 29, 35)
GAME ej (26, 30)
GAME EQ 2 (24, 26)
GROOVE 5 (24)
KARAOKE PON ef (27)
GAME EQ 2 (24, 26)
GROOVE 5 (24)
KARAOKE PON ef (27)
MD (VIDEO) qh (30)
MIC 1, 2 jack es (26, 27)
MIC LEVEL control wl (26, 27)
MOVIE EQ q; (24, 25)
MUSIC EQ 7 (24, 25)
P FILE qs (25)
PHONES jack ql
PICTURE EFFECT 3 (18)
PLAY MODE 8 (10 – 12)
REC PAUSE/START wf (22, 23)
REPEAT 8 (11)
SPECTRUM 8 (26)
STEREO/MONO 8 (20)
TAPE A/B qg (20, 22)
TUNER MEMORY 8 (19)
TUNER/BAND qf (19, 22)
VIDEO jack eh (30)
VOLUME control qj
MIC 1, 2 jack es (26, 27)
MIC LEVEL control wl (26, 27)
MOVIE EQ q; (24, 25)
MUSIC EQ 7 (24, 25)
P FILE qs (25)
PHONES jack ql
PICTURE EFFECT 3 (18)
PLAY MODE 8 (10 – 12)
REC PAUSE/START wf (22, 23)
REPEAT 8 (11)
SPECTRUM 8 (26)
STEREO/MONO 8 (20)
TAPE A/B qg (20, 22)
TUNER MEMORY 8 (19)
TUNER/BAND qf (19, 22)
VIDEO jack eh (30)
VOLUME control qj
BUTTON DESCRIPTIONS
?/1 (power) 1
v/V/b/B 6
Z OPEN/CLOSE qk
Z (deck B) w;
M (fast forward) wd
+ wd
. (go back) wh
> (go forward) wh
X (pause) wh
hH (play) wh
x (stop) wh
m (rewind) wj
– wj
Z (deck A) e;
v/V/b/B 6
Z OPEN/CLOSE qk
Z (deck B) w;
M (fast forward) wd
+ wd
. (go back) wh
> (go forward) wh
X (pause) wh
hH (play) wh
x (stop) wh
m (rewind) wj
– wj
Z (deck A) e;