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Model
MDS-S50 (serv.man2)
Pages
69
Size
4.41 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
mds-s50-sm2.pdf
Date

Sony MDS-S50 (serv.man2) Service Manual ▷ View online

5
MDS-S50
TABLE  OF  CONTENTS
SELF-DIAGNOSIS  FUNCTION
....................................
2
1.
SERVICING  NOTES
...............................................
7
2.
GENERAL
................................................................... 12
3.
DISASSEMBLY
3-1. Disassembly Flow ........................................................... 14
3-2. Case ................................................................................. 15
3-3. MD Mechanism Deck (MDM-7A) ................................. 15
3-4. MAIN Board ................................................................... 16
3-5. BD Board ......................................................................... 16
4.
TEST  MODE
.............................................................. 17
5.
ELECTRICAL  ADJUSTMENTS
......................... 22
6.
DIAGRAMS
6-1. Block Diagram – SERVO Section – ............................... 33
6-2. Block Diagram – MAIN Section – ................................. 34
6-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 35
6-4. Printed Wiring Boards  – BD Board – ............................ 37
6-5. Schematic Diagram – BD Board (1/2) – ........................ 38
6-6. Schematic Diagram – BD Board (2/2) – ........................ 39
6-7. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 40
6-8. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 41
6-9. Schematic Diagram – MAIN Board (1/3) – ................... 42
6-10. Schematic Diagram – MAIN Board (2/3) – ................... 43
6-11. Schematic Diagram
– MAIN (3/3)/PT/VOL SEL Boards – ........................... 44
6-12. Printed Wiring Boards – PT/VOL SEL Boards – ........... 45
6-13. Printed Wiring Boards
– DISPLAY/POWER SW Boards – ............................... 46
6-14. Schematic Diagram
– DISPLAY/POWER SW Boards – ............................... 47
6-15. IC Pin Function Description ........................................... 51
7.
EXPLODED  VIEWS
7-1. Case Section .................................................................... 58
7-2. Front Panel Section ......................................................... 59
7-3. Mechanism Deck Section-1 (MDM-7A) ........................ 60
7-4. Mechanism Deck Section-2 (MDM-7A) ........................ 61
8.
ELECTRICAL  PARTS  LIST
............................... 62
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  
0
SUR  LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE
DES  PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ
DE  FONCTIONNEMENT.  NE  REMPLACER  CES  COM-
POSANTS  QUE  PAR  DES  PIÈCES  SONY  DONT  LES
NUMÉROS  SONT  DONNÉS  DANS  CE  MANUEL  OU
DANS  LES  SUPPLÉMENTS  PUBLIÉS  PAR  SONY.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED
LINE  WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.
6
MDS-S50
This appliance is classified 
as a CLASS 1 LASER 
product.
The CLASS 1 LASER 
PRODUCT MARKING is 
located on the rear exterior.
The following caution label is located inside the unit.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende type
anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ som
 rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande föreskrifter.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer.
Discard used batteries according to the manufacturer’s instructions.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are
suitable.  (See Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
0.15 
µ
F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
7
MDS-S50
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
SECTION  1
SERVICING  NOTES
MODEL IDENTIFICATION
— BACK PANEL —
MODEL
Part No.
US model
4-228-443-2
[]
Canadian model
4-228-443-3
[]
AEP, UK, Argentina models
4-228-443-4
[]
Singapore model
4-228-443-5
[]
Australian model
4-228-443-6
[]
Hong Kong model
4-228-443-7
[]
Brazilian model
4-228-443-8
[]
Part No.
8
MDS-S50
JIG FOR CHECKING BD BOARD WAVEFORM
The special jig (J-2501-196-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be
performed are shown as follows.
I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)
IOP
: For measuring IOP (Check the deterioration of the optical pick-up laser)
GND : Ground
TE
: Tracking error signal (Traverse adjustment)
FE
: Focus error signal
VC
: Reference level for checking the signal
RF
: RF signal (Check jitter)
I+3V
CN105
IOP
TE
VC
GND
FE
RF
I+3V
IOP
GND
TE
FE
VC
RF
I+3V
IOP
GND
TE
FE
VC
RF
1
7
for
MDM-7A
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