Sony MDS-PC2 Service Manual ▷ View online
33
33
MDS-PC2
– MAIN SECTION –
IC701
!£
(XOUT)
IC201
!™
(SYSCLK)
IC201
!¶
(LRCK1)
IC201
!§
(BCK)
– PANEL SECTION –
IC901
%•
(OSCO)
3.4Vp-p
2.822MHz
3.0Vp-p
22.581MHz
3.9Vp-p
2.4MHz
3.2Vp-p
10MHz
3.8Vp-p
44.1kHz
WAVEFORMS
1
IC101
1
,
2
(I, J) (PLAY mode)
– BD (1/2) SECTION –
2
3
IC101
4
(A) (PLAY mode)
IC101
8
,
9
(E, F) (PLAY mode)
0.46Vp-p
0.1Vp-p
0.06Vp-p
– BD (2/2) SECTION –
4
5
6
7
8
IC121
!§
(OSCI)
IC121
@¶
(LRCK)
IC121
@•
(XBCK)
IC121
@ª
(FS256)
IC121
(º
(FS4)
3.1Vp-p
22.581MHz
3.2Vp-p
44.1kHz
3.8Vp-p
2.822MHz
3.2Vp-p
176.4kHz
3.8Vp-p
11.29MHz
1
1
2
3
4
Note on Schematic Diagram:
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
¢
: internal component.
•
C
: panel designation.
Note on Printed Wiring Boards:
Note:
Note:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
p
: parts mounted on the conductor side.
•
®
: Through hole.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
no mark : STOP
(
(
) : Play the test disk (TDYS-1)
<
> : REC
∗
: Can not be measured.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Signal path.
E
: PB
: REC
: REC
p
: PB (digital out)
l
: REC (digital in)
Note:
The components identi-
fied by mark
The components identi-
fied by mark
!
or dotted
line with mark
!
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
!
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
Q
C
E
B
C E
B
• Indication of transistor
These are omitted
These are omitted
34
34
MDS-PC2
6-3. PRINTED WIRING BOARD – BD SECTION –
• See page 30 for Circuit Boards Location.
D101
A-1
D181
D-3
D183
D-3
IC103
B-1
IC123
D-2
IC171
D-1
Q102
B-1
Q103
B-1
Q104
B-1
• SEMICONDUCTOR
LOCATION
Ref. No.
Location
IC101
A-3
IC121
C-3
IC124
C-3
IC152
B-1
IC181
C-1
IC192
D-1
Q101
B-3
Q162
B-3
Q163
B-3
Q181
C-1
Q182
C-2
• SEMICONDUCTOR
LOCATION
Ref. No.
Location
: SOLDER BRIDGE
(Page 43)
(Page 39)
35
35
MDS-PC2
6-4. SCHEMATIC DIAGRAM – BD (1/2) SECTION –
• See page 33 for Waveform.
• See page 45 for IC Block Diagrams.
• See page 48 for IC Pin Function.
• See page 45 for IC Block Diagrams.
• See page 48 for IC Pin Function.
(Page 36)
(Page 36)
(Page 36)
(Page 36)
(Page 36)
(Page 36)
(Page 36)
36
36
MDS-PC2
6-5. SCHEMATIC DIAGRAM – BD (2/2) SECTION –
• See page 33 for Waveform.
• See page 34 for Printed Wiring Board.
• See page 34 for Printed Wiring Board.
(Page 35)
(Page 35)
(Page 35)
(Page 35)
(Page 35)
(Page 35)
(Page 35)
(Page 37)
(Page 42)
BA033FP-E2
MAIN BOARD
(1/2)
POWER BOARD
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