DOWNLOAD Sony MDS-DRE1 Service Manual ↓ Size: 6.56 MB | Pages: 79 in PDF or view online for FREE

Model
MDS-DRE1
Pages
79
Size
6.56 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
mds-dre1.pdf
Date
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Sony MDS-DRE1 Service Manual ▷ View online

– 30 –
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
Ω
 and 
1
/
4
 
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
¢
: internal component.
•
2
: nonflammable resistor.
•
C
: panel designation.
Note on Printed Wiring Board:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
®
: Through hole.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : STOP
(
) : PLAY
〈〈
 
〉〉
: REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E
: PLAY
j
: REC (ANALOG IN)
k
: REC (DIGITAL IN)
f
: REC (COAXIAL DIGITAL IN)
h
: REC (OPTICAL DIGITAL IN)
Note:
The components identi-
fied by mark 
!
 or dotted
line with mark 
!
 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 
!
 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
B
These are omitted.
C
E
Q
C
B
These are omitted.
E
Q
6-5.
NOTES  FOR  PRINTED  WIRING  BOARD  AND  SCHEMATIC  DIAGRAM
(In addition to this, the necessary note is printed in each block)
• Indication of transistor.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
MDS-DRE1
– 31 –
– 32 –
6-6.
PRINTED  WIRING  BOARD  – BD Board (SIDE A) –
•
 See page 29 for Circuit Boards Location.
• Semiconductor
Location
Ref. No.
Location
D101
A-7
D181
B-2
D183
A-2
IC191
G-6
Q181
B-1
Q182
A-1
MDS-DRE1
– 33 –
– 34 –
6-7.
PRINTED  WIRING  BOARD  – BD Board (SIDE B) –
•
 See page 29 for Circuit Boards Location.
• Semiconductor
Location
Ref. No.
Location
D155
E-2
D161
A-6
IC101
C-4
IC102
C-2
IC121
F-5
IC122
C-5
IC151
G-2
IC171
C-6
IC172
B-4
IC181
B-2
IC182
A-3
Q101
A-6
Q151
E-2
Q162
A-4
Q163
A-6
Q164
A-6
(Page 43)
(Page 43)
MDS-DRE1
– 35 –
– 36 –
6-8.
SCHEMATIC  DIAGRAM  – BD Section (1/2) –
•
 See page 67 for Waveforms.
•
 See page 70 for IC Block Diagrams.
The components identified by mark 
!
 or dotted
line with mark 
!
 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 
!
 sont
critiques pour la sécurité.
Ne les remplacer que
par une piéce portant le numéro spécifié.
(Page 37)
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