Sony HTC-NX1 / MHC-NX1 / MHC-NX3AV Service Manual ▷ View online
17
Note:
1. CD Block is basically designed to operate without adjustment. There-
fore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10 M
3. Use an oscilloscope with more than 10 M
Ω
impedance.
4. Clean the object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
5. Use the following extension cables and relay connector.
• Extension cable (19P) (Part No. J-2501-011-B)
Relay connector (Part No. J-2501-167-A)
(BD board CN101 to MAIN board CN111)
(BD board CN101 to MAIN board CN111)
• Extension cable (17P) (with connector) (Part No. J-2501-167-A)
(CONNECTOR board CN701 to MAIN board CN301)
1. S-CURVE CHECK
Procedure:
1. Connect oscilloscope to TP (FEO).
2. Connect between TP (FEO) and TP (VC) by lead wire.
3. Connect between TP (AGCCON) and TP (GND) by lead wire.
4. Turn the power ON.
5. Load a disc (YEDS-18) and turn the power ON again and ac-
1. Connect oscilloscope to TP (FEO).
2. Connect between TP (FEO) and TP (VC) by lead wire.
3. Connect between TP (AGCCON) and TP (GND) by lead wire.
4. Turn the power ON.
5. Load a disc (YEDS-18) and turn the power ON again and ac-
tuate the focus search. (Actuate the focus search when disc
tray is moving in and out)
tray is moving in and out)
6. Check the oscilloscope waveform (S-curve) is symmetrical
between A and B. And confirm peak to peak level within
2.4±0.7 Vp-p.
2.4±0.7 Vp-p.
S-curve waveform
7. After check, remove the lead wire connected in step 2.
Note:
• Try to measure several times to make sure than the ratio of A : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the brightness
to obtain best waveform.
CD SECTION
A
B
symmetry
within 2.4
±
0.7 Vp-p
+
–
–
BD board
TP (RF)
TP (VC)
TP (VC)
oscilloscope
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
TIME/DIV: 500 ns
level:
1.2
1.2
±
0.2 Vp-p
+
–
–
BD board
TP (FEO)
TP (VC)
TP (VC)
oscilloscope
2.
RF LEVEL CHECK
Procedure:
1. Connect oscilloscope to TP (RF).
1. Connect oscilloscope to TP (RF).
As TP (RF) and TP (VC) are located at the edge of board, clip
them together with the board using alligator clips.
them together with the board using alligator clips.
2. Turn the power ON.
3. Load a disc (YEDS-18) and playback.
4. Confirm that oscilloscope waveform is clear and check RF sig-
3. Load a disc (YEDS-18) and playback.
4. Confirm that oscilloscope waveform is clear and check RF sig-
nal level is correct or not.
Note:
Clear RF signal waveform means that the shape “ ” can be clearly
distinguished at the center of the waveform.
distinguished at the center of the waveform.
RF signal waveform
18
Connecting points:
– BD BOARD (Side B) –
IC102
TP
(VC)
TP
(RF)
TP
(FEO)
IC101
TP (FEI)
TP (VC)
TP
(TEO)
TP
(GND)
TP
(AGCCON)
IC103
– MAIN BOARD (Conductor Side) –
IC101
SL101
(ADJ)
(ADJ)
19
19
SECTION 7
DIAGRAMS
7-1.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
(In addition to this, the necessary note is printed in each block)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
5
: fusible resistor.
•
C
: panel designation.
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
E
: TAPE PLAYBACK (DECK A)
d
: TAPE PLAYBACK (DECK B)
G
: RECORD
J
: CD PLAY (ANALOG OUT)
c
: CD PLAY (DIGITAL OUT)
• Abbreviation
AUS
: Australian model
CND : Canadian model
JE
JE
: Tourist model
KR
: Korean model
MY
: Malaysia model
SP
: Singapore model
TH
: Thai model
Note:
The components identi-
fied by mark
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
Note on Printed Wiring Board:
•
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
x
: parts mounted on the conductor side.
•
b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
• Circuit Boards Location
CLAMP MOTOR board
BD board
IN SW board
INT/COUNT SW board
MAIN board
CONNECTOR board
LOAD MOTOR board
AUDIO board
OUT SW board
PANEL TC-A board
PANEL TC-B board
LEAF SW board
PANEL board
SENSOR board
SENSOR 2 board
20
20
HTC-NX1
TP
(GND)
7-2.
PRINTED WIRING BOARD – BD Board –
•
See page 19 for Circuit Boards Location.
• Semiconductor
Location
(Side A)
(Side A)
Ref. No.
Location
Q101
C-3
• Semiconductor
Location
(Side B)
(Side B)
Ref. No.
Location
IC101
C-2
IC102
B-3
IC103
B-3
(Page 27)
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