DOWNLOAD Sony HTC-NX1 / MHC-NX1 / MHC-NX3AV Service Manual ↓ Size: 4.1 MB | Pages: 52 in PDF or view online for FREE

Model
HTC-NX1 MHC-NX1 MHC-NX3AV
Pages
52
Size
4.1 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio / S/M HTC-NX1 US CAN AEP UK E
File
htc-nx1-mhc-nx1-mhc-nx3av.pdf
Date

Sony HTC-NX1 / MHC-NX1 / MHC-NX3AV Service Manual ▷ View online

17
Note:
1. CD Block is basically designed to operate without adjustment.  There-
fore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10 M
 impedance.
4. Clean the object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
5. Use the following extension cables and relay connector.
• Extension cable (19P) (Part No. J-2501-011-B)
Relay connector (Part No. J-2501-167-A)
(BD board CN101 to MAIN board CN111)
• Extension cable (17P) (with connector) (Part No. J-2501-167-A)
(CONNECTOR board CN701 to MAIN board CN301)
1. S-CURVE  CHECK
Procedure:
1. Connect oscilloscope to TP (FEO).
2. Connect between TP (FEO) and TP (VC) by lead wire.
3. Connect between TP (AGCCON) and TP (GND) by lead wire.
4. Turn the power ON.
5. Load a disc (YEDS-18) and turn the power ON again and ac-
tuate the focus search.  (Actuate the focus search when disc
tray is moving in and out)
6. Check the oscilloscope waveform (S-curve) is symmetrical
between A and B.  And confirm peak to peak level within
2.4±0.7 Vp-p.
S-curve waveform
7. After check, remove the lead wire connected in step 2.
Note:
• Try to measure several times to make sure than the ratio of A : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the brightness
to obtain best waveform.
CD SECTION
A
B
symmetry
within 2.4 
±
 0.7 Vp-p
+
BD board
TP (RF)
TP (VC)
oscilloscope
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
level:
1.2 
±
 0.2 Vp-p
+
BD board
TP (FEO)
TP (VC)
oscilloscope
2.
RF  LEVEL  CHECK
Procedure:
1. Connect oscilloscope to TP (RF).
As TP (RF) and TP (VC) are located at the edge of board, clip
them together with the board using alligator clips.
2. Turn the power ON.
3. Load a disc (YEDS-18) and playback.
4. Confirm that oscilloscope waveform is clear and check RF sig-
nal level is correct or not.
Note:
Clear RF signal waveform means that the shape “ ” can be clearly
distinguished at the center of the waveform.
RF signal waveform
18
Connecting points:
– BD  BOARD (Side B) –
IC102
TP
(VC)
TP
(RF)
TP
(FEO)
IC101
TP (FEI)
TP (VC)
TP
(TEO)
TP
(GND)
TP
(AGCCON)
IC103
– MAIN  BOARD (Conductor Side) –
IC101
SL101
(ADJ)
19
19
SECTION  7
DIAGRAMS
7-1.
NOTE  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC  DIAGRAMS
(In addition to this, the necessary note is printed in each block)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
5
: fusible resistor.
C
: panel designation.
U
: B+ Line.
V
: B– Line.
H
: adjustment for repair.
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E
: TAPE PLAYBACK (DECK A)
d
: TAPE PLAYBACK (DECK B)
G
: RECORD
J
: CD PLAY (ANALOG OUT)
c
: CD PLAY (DIGITAL OUT)
• Abbreviation
AUS
: Australian model
CND : Canadian model
JE
: Tourist model
KR
: Korean model
MY
: Malaysia model
SP
: Singapore model
TH
: Thai model
Note:
The components identi-
fied by mark 
0
  or dotted
line with mark 
 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 
0
  sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
Note on Printed Wiring Board:
X
: parts extracted from the component side.
Y
: parts extracted from the conductor side.
x
: parts mounted on the conductor side.
b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
• Circuit Boards Location
CLAMP MOTOR board
BD board
IN SW board
INT/COUNT SW board
MAIN board
CONNECTOR board
LOAD MOTOR board
AUDIO board
OUT SW board
PANEL TC-A board
PANEL TC-B board
LEAF SW board
PANEL board
SENSOR board
SENSOR 2 board
20
20
HTC-NX1
TP
(GND)
7-2.
PRINTED  WIRING  BOARD  – BD Board –
 See page 19 for Circuit Boards Location.
• Semiconductor
Location
(Side A)
Ref. No.
Location
Q101
C-3
• Semiconductor
Location
(Side B)
Ref. No.
Location
IC101
C-2
IC102
B-3
IC103
B-3
(Page 27)
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