Sony HTC-NX1 / MHC-NX1 / MHC-NX3AV Service Manual ▷ View online
MICROFILM
SERVICE MANUAL
CD
Section
Tape Deck
Section
Section
Model Name Using Similar Mechanism
HCD-MD555
CD Mechanism Type
CDM53D-K1BD33
Base Unit Name Type
BU-K1BD33
Optical Pick-up Name
KSM-213BFN-C2NP
Model Name Using Similar Mechanism
HCD-GRX7
Tape Transport Mechanism Type
TCM-230AWR2
MINI Hi-Fi COMPONENT SYSTEM
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Tourist Model
SPECIFICATIONS
HTC-NX1
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
a
are trade-
marks of Dolby Laboratories Licensing Corporation.
HTC-NX1 is the CD player and Tape
Deck section in MHC-NX1/NX3AV.
Deck section in MHC-NX1/NX3AV.
2
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
!
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED
LINE WITH MARK
!
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
2
2.
GENERAL
Location of Controls .......................................................
5
3.
DISASSEMBLY
.........................................................
6
4.
TEST MODE
.............................................................. 13
5.
MECHANICAL ADJUSTMENTS
....................... 14
6.
ELECTRICAL ADJUSTMENTS
TAPE DECK Section ...................................................... 14
CD Section ...................................................................... 17
CD Section ...................................................................... 17
7.
DIAGRAMS
7-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 19
7-2. Printed Wiring Board – BD Board – ............................. 20
7-3. Schematic Diagram – BD Board – ................................ 21
7-4. Printed Wiring Boards
7-3. Schematic Diagram – BD Board – ................................ 21
7-4. Printed Wiring Boards
– CD MOTOR/SENSOR Section – ................................ 22
7-5. Schematic Diagram
– CD MOTOR/SENSOR Section – ................................ 23
7-6. Printed Wiring Board – AUDIO Board – ...................... 24
7-7. Schematic Diagram – AUDIO Board – ......................... 25
7-8. Printed Wiring Board – LEAF SW Board – .................. 26
7-9. Schematic Diagram – LEAF SW Board – ..................... 26
7-10. Printed Wiring Board – MAIN Board – ........................ 27
7-11. Schematic Diagram – MAIN Board (1/2) – .................. 28
7-12. Schematic Diagram – MAIN Board (2/2) – .................. 29
7-13. Printed Wiring Boards – PANEL Section – .................. 30
7-14. Schematic Diagram – PANEL Section – ....................... 31
7-15. IC Pin Function Description ........................................... 34
7-7. Schematic Diagram – AUDIO Board – ......................... 25
7-8. Printed Wiring Board – LEAF SW Board – .................. 26
7-9. Schematic Diagram – LEAF SW Board – ..................... 26
7-10. Printed Wiring Board – MAIN Board – ........................ 27
7-11. Schematic Diagram – MAIN Board (1/2) – .................. 28
7-12. Schematic Diagram – MAIN Board (2/2) – .................. 29
7-13. Printed Wiring Boards – PANEL Section – .................. 30
7-14. Schematic Diagram – PANEL Section – ....................... 31
7-15. IC Pin Function Description ........................................... 34
8.
EXPLODED VIEWS
................................................ 37
9.
ELECTRICAL PARTS LIST
............................... 44
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
The following caution label is located inside the unit.
CAUTION
:
INVISIBLE LASER RADIATION WHEN OPEN AND
INTERLOCKS DEFEATED. AVOID EXPOSURE TO BEAM.
ADVARSEL :
USYNLIG LASERSTRÅLING VED ÅBNING NÅR
SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDGÅ UDSAETTELSE
FOR STRÅLING.
FOR STRÅLING.
VORSICHT :
UNSICHTBARE LASERSTRAHLUNG, WENN
ABDECKUNG GEÖFFNET UND SICHEREITSVERRIEGELUNG
ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN.
ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN.
VARO
!
:
AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALT-
TIINA NÄKYMÄTTÖMÄLLE LASERSÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN.
VARNING
:
OSYNLING LASERSTRÅLING NÄR DENNA DEL ÄR ÖPPNAD
OCH SPÄRREN ÄR URKOPPLAD. BETRAKTA EJ STRÅLEN.
ADVERSEL :
USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES OG
SIKKERHEDSLÅS BRYTES. UNNGÅ EKSPONERING FOR STRÅLEN.
VIGYAZAT
! :
A BURKOLAT NYITÁSAKOR LÁTHATATLAN LÉZERSU-
GÁRVESZÉLY
! KERÜLJE A BESUGÁRZÁST!
3
POWER SUPPLY DURING SERVICING
• As this set has not own power supply, it does not operate inde-
pendently. Therefore, during servicing, connect it to the Pre-
Main amplifier and Tuner Unit (STR-NX1/NX3) of MHC-NX1/
NX3AV.
Main amplifier and Tuner Unit (STR-NX1/NX3) of MHC-NX1/
NX3AV.
If STR-NX1/NX3 are not available, use the Power Feed Jig (PFJ-
1) and Relay Connector Jig.
In this case, after turn on the POWER switch on the Power Feed
Jig, supply power with the following methods.
1) and Relay Connector Jig.
In this case, after turn on the POWER switch on the Power Feed
Jig, supply power with the following methods.
Procedure:
1. Press three buttons of s (DECK B), A (DISC 1),
1. Press three buttons of s (DECK B), A (DISC 1),
and s (CD) simultaneously.
2. The G (CD) and S (CD) LEDs blink, and then pressing G
(CD), G / g (DECK A), or G / g (DECK B) button can
make each play possible.
make each play possible.
3. Also, the other functions are enabled by pressing two buttons
simultaneously.
A combination of respective functions and buttons is as fol-
lows.
A combination of respective functions and buttons is as fol-
lows.
function
button
CD AMS –
s (DECK A), S (CD)
AMS +
s (DECK A), s (CD)
FR
s (DECK B), S (CD)
FF
s (DECK B), s (CD)
Deck-A REW/AMS –
s (CD), g (DECK A)
FF/AMS +
s (CD), G (DECK A)
Deck-B REW/AMS –
s (CD), g (DECK B)
FF/AMS +
s (CD), G (DECK B)
Set
SYSTEM CONTROL terminal
SYSTEM CONTROL terminal
Connector cable (19P)
Pre-Main AMP
and Tuner Unit
and Tuner Unit
AC IN
Power feed jig
(PFJ-1)
(PFJ-1)
Connector cable (17P) of
attachment to power feed jig
attachment to power feed jig
Relay connector jig
(J-2501-174-A)
(J-2501-174-A)
CD/TC signal
change switch
change switch
CN101 (15P)
SYSTEM CONTROL
terminal
SYSTEM CONTROL
terminal
system cable
Exclusive cable (15P)
P707, P909
Set
CDP/TC
ST
Connection:
4
Note 1: In cleaning the lens, do not apply an excessive force.
As the optical pick-up is vulnerable, application of
excessive force could damage the lens holder.
excessive force could damage the lens holder.
Note 2: In cleaning, do not use a cleaner other than exclusive clean-
ing liquid (KK-91 or isopropyl alcohol).
Note 3: Wipe the objective lens spirally from center toward outside.
(See Figure A)
OPTICAL PICK-UP CLEANING
1
Remove the case. (Refer to disassembly page 8)
3
Open the magnet
ass’y.
ass’y.
4
Cleaning the
optical pick-up.
optical pick-up.
2
four screws
(BVTP M2.6)
(BVTP M2.6)
(Figure A)
