Sony HCD-ZX50MD Service Manual ▷ View online
5
Description
Table of Error Codes
Error Code
10
12
20
21
22
23
24
30
31
40
41
42
43
50
51
Could not load
Loading switches combined incorrectly
Timed out without reading the top of PTOC
Could read top of PTOC, but detected error
Timed out without accessing UTOC
Timed out without reading UTOC
Error in UTOC
Could not start playback
Error in sector
Retry cause generated during normal recording
Retried in DRAM overflow
Retry occurred during TOC writing
Retry aborted during S.F editing
Other than access processing, and could not read address.
Focus NG occurred and overran.
6
TABLE OF CONTENTS
MODEL IDENTIFICATION
— BACK PANEL —
• Abbreviation
G
: German model
AED
: North European model
MX
: Mexican model
AR
: Argentine model
HK
: Hong Kong model
MY
: Malaysia model
SP
: Singapore model
KR
: Korean model
AUS
: Australian model
MODEL
US model
AEP, UK, G, AED, CIS model
MY, SP model
E model
AR model
HK model
MX model
AUS model
KR model
PARTS No.
4-227-556-0
s
4-227-556-2
s
4-227-556-3
s
4-227-556-4
s
4-227-556-5
s
4-227-556-6
s
4-227-556-7
s
4-227-556-8
s
4-227-556-9
s
Parts No.
1. SERVICING NOTES .............................................
7
2. GENERAL
........................................................................ 15
3. DISASSEMBLY
3-1.
Case .................................................................................. 18
3-2.
Front Panel Section .......................................................... 18
3-3.
MD Mechanism Section
Tape Mechanism Deck Section (TCM-230AWR12) ........ 19
Tape Mechanism Deck Section (TCM-230AWR12) ........ 19
3-4.
Back Panel Section ........................................................... 19
3-5.
MD Mechanism Deck Section (MDM-7B) ...................... 20
3-6.
Main Board, Front AMP Board ........................................ 20
3-7.
CD Base Unit (BU-K4BD40) ........................................... 21
3-8.
CD Mechanism Deck Section (CDM53F-K4BD40) ........ 21
3-9.
Fitting Base (Guide) Assy, Bracket (Chassis) and
Fitting Base (Magnet) Assy .............................................. 22
Fitting Base (Magnet) Assy .............................................. 22
3-10. Tray (Sub) ......................................................................... 22
3-11. Chassis (Mold B) Section, Stocker Section and
3-11. Chassis (Mold B) Section, Stocker Section and
Slider (Selection) ............................................................. 23
3-12. Gears Installation .............................................................. 23
3-13. Slider (Selection) Installation ........................................... 24
3-14. Stocker Section Installation .............................................. 24
3-15. Chassis (Mold B) Section Installation .............................. 25
3-16. BD Board .......................................................................... 25
3-13. Slider (Selection) Installation ........................................... 24
3-14. Stocker Section Installation .............................................. 24
3-15. Chassis (Mold B) Section Installation .............................. 25
3-16. BD Board .......................................................................... 25
4. TEST MODE
...................................................................... 26
5. MECHANICAL ADJUSTMENTS
............................... 35
6. ELECTRICAL ADJUSTMENTS
................................. 35
7. DIAGRAMS
7-1. Circuit Boards Location ...................................................... 51
7-2. Block Diagrams
7-2. Block Diagrams
• CD Section ....................................................................... 54
• MD Section ...................................................................... 55
• SYSCON/SERVO Section ............................................... 56
• MAIN Section .................................................................. 57
• MD Section ...................................................................... 55
• SYSCON/SERVO Section ............................................... 56
• MAIN Section .................................................................. 57
7-3. Printed Wiring Board – Deck Section – .............................. 58
7-4. Schematic Diagram – Deck Section – ................................ 59
7-5. Printed Wiring Board – CD Section – ................................. 60
7-6. Schematic Diagram – CD Section – ................................... 61
7-7. Printed Wiring Board – MD Section – ................................ 62
7-8. Schematic Diagram – MD (1/2) Section – .......................... 63
7-9. Schematic Diagram – MD (2/2) Section – .......................... 64
7-10. Printed Wiring Board – Main Section – ........................... 65
7-11. Schematic Diagram – Main (1/4) Section – ..................... 66
7-4. Schematic Diagram – Deck Section – ................................ 59
7-5. Printed Wiring Board – CD Section – ................................. 60
7-6. Schematic Diagram – CD Section – ................................... 61
7-7. Printed Wiring Board – MD Section – ................................ 62
7-8. Schematic Diagram – MD (1/2) Section – .......................... 63
7-9. Schematic Diagram – MD (2/2) Section – .......................... 64
7-10. Printed Wiring Board – Main Section – ........................... 65
7-11. Schematic Diagram – Main (1/4) Section – ..................... 66
7-12. Schematic Diagram – Main (2/4) Section – ..................... 67
7-13. Schematic Diagram – Main (3/4) Section – ..................... 68
7-14. Schematic Diagram – Main (4/4) Section – ..................... 69
7-15. Printed Wiring Board – Digital (Side A) Section – .......... 70
7-16. Printed Wiring Board – Digital (Side B) Section – .......... 71
7-17. Schematic Diagram – Digital (1/2) Section – .................. 72
7-18. Schematic Diagram – Digital (2/2) Section – .................. 73
7-19. Printed Wiring Board
7-13. Schematic Diagram – Main (3/4) Section – ..................... 68
7-14. Schematic Diagram – Main (4/4) Section – ..................... 69
7-15. Printed Wiring Board – Digital (Side A) Section – .......... 70
7-16. Printed Wiring Board – Digital (Side B) Section – .......... 71
7-17. Schematic Diagram – Digital (1/2) Section – .................. 72
7-18. Schematic Diagram – Digital (2/2) Section – .................. 73
7-19. Printed Wiring Board
– AMP (US, AEP, UK, G, AED, CIS model) Section – .. 74
7-20. Schematic Diagram
– AMP (US, AEP, UK, G, AED, CIS model) Section – .. 75
7-21. Printed Wiring Board – AMP (E, MX, AR, HK,
MY, SP, KR, AUS model) Section – ................................ 76
7-22. Schematic Diagram – AMP (E, MX, AR, HK,
MY, SP, KR, AUS model) Section – ................................ 77
7-23. Printed Wiring Board – Panel Section – ........................... 78
7-24. Schematic Diagram – Panel Section – ............................. 79
7-25. Printed Wiring Board – Switch Section – ........................ 80
7-26. Schematic Diagram – Switch Section – ........................... 81
7-27. Printed Wiring Board – CD Mechanism Section – .......... 82
7-28. Schematic Diagram – CD Mechanism Section – ............. 83
7-29. Printed Wiring Board – Leaf SW Section – ..................... 84
7-30. Schematic Diagram – Leaf SW Section – ........................ 84
7-31. Printed Wiring Board – MIC Section – ............................ 85
7-32. Schematic Diagram – MIC Section – ............................... 85
7-33. Printed Wiring Board – Power Supply (US, AEP, UK,
7-24. Schematic Diagram – Panel Section – ............................. 79
7-25. Printed Wiring Board – Switch Section – ........................ 80
7-26. Schematic Diagram – Switch Section – ........................... 81
7-27. Printed Wiring Board – CD Mechanism Section – .......... 82
7-28. Schematic Diagram – CD Mechanism Section – ............. 83
7-29. Printed Wiring Board – Leaf SW Section – ..................... 84
7-30. Schematic Diagram – Leaf SW Section – ........................ 84
7-31. Printed Wiring Board – MIC Section – ............................ 85
7-32. Schematic Diagram – MIC Section – ............................... 85
7-33. Printed Wiring Board – Power Supply (US, AEP, UK,
G, AED, CIS model) Section – ........................................ 86
7-34. Schematic Diagram – Power Supply (US, AEP, UK,
G, AED, CIS model) Section – ........................................ 87
7-35. Printed Wiring Board – Power Supply (E, MX, AR, HK,
MY, SP, KR, AUS model) Section – ................................ 88
7-36. Schematic Diagram – Power Supply (E, MX, AR, HK,
MY, SP, KR, AUS model) Section – ................................ 89
7-37. IC Block Diagrams ........................................................... 90
7-38. IC Pin Functions ............................................................... 94
7-38. IC Pin Functions ............................................................... 94
8. EXPLODED VIEWS
8-1.
Back Panel Section ......................................................... 106
8-2.
Front Panel Section ........................................................ 107
8-3.
Chassis Section ............................................................... 108
8-4.
CD Mechanism Deck Section-1 ..................................... 109
8-5.
CD Mechanism Deck Section-2 ..................................... 110
8-6.
Base Unit Section ........................................................... 111
8-7.
Tape Mechanism Deck Section-1 ................................... 112
8-8.
Tape Mechanism Deck Section-2 ................................... 113
8-9.
MD Mechanism Section-1 .............................................. 114
8-10. MD Mechanism Section-2 .............................................. 115
9. ELECTRICAL PARTS LIST
...................................... 117
7
SAFETY CHECK-OUT
(US model only)
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1.
A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2.
A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
digital multimeter is suitable for this job.
3.
Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
0.15
µ
F
To Exposed Metal
Parts on Set
Parts on Set
1.5k
Ω
AC
voltmeter
(0.75V)
voltmeter
(0.75V)
Earth Ground
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
FOR CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
FOR MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
checking it for adjustment. It is feared that you will lose your sight.
This caution
label is located
inside the unit.
label is located
inside the unit.
SECTION 1
SERVICE NOTES
8
CN503
CN701
Jig (J-2501-076-A)
Jig (J-2501-165-A)
Jig (J-2501-167-A)
Jig (J-2501-011-B)
SERVICE POSITION
• CD MECHANISM BLOCK
Ver 1.3
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