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Procedure :
1.  Connect an oscilloscope to TP123 (RFO) and TP124 (VC).
2.  Turn the power on.
3.  Load a disc (YEDS-18) and playback.
4. Confi rm that oscilloscope waveform is clear and check if RF 

signal level is correct or not.

Note:  Clear RF signal waveform means that the shape “ 

◊ ” can 

be clearly distinguished at the center of the waveform.

 

Connecting Location: CD board

VOLT/DIV: 200 mV

TIME/DIV: 500 ns

RF signal waveform

level: 1.3

±

0.3 Vp-p

– BD93 Board (SIDE B) –

MOTOR (LD) board

SENSOR board

SW board

MOTOR (TB) board

TC board

DRIVER (F) board

MAIN board

MIC board

LED board

JOG board

ILLUMINATION 

board

METER DISPLAY board

PANEL FUNCTION  board

BD93 board

USB R board

USB CONNECTOR board

POWER board

TRANS board

SUB TRANS board

CD-SW board

TUNER PACK

Note on Printed Wiring Board:
• 

X  : parts extracted from the component side.

• 

Y  : parts extracted from the conductor side.

• 

 

 

: Pattern from the side which enables seeing.

  (The other layer’s patterns are not indicated.)

Caution:
Pattern face side: 

Parts on the pattern face side seen from

(Conductor Side) 

the pattern face are indicated.

Parts face side: 

Parts on the parts face side seen from 

(Component Side)  the parts face are indicated.

•  Indication of transistor.

• 

A  : B+ Line.

• 

B  : B– Line.

•  Voltage and waveforms are dc with respect to ground
  under no-signal (detuned) conditions.
•  BD93 and Driver sections.
  no mark  : CD PLAY
•  Except BD93 and Driver sections.
  no mark  : FM
 ( 

   ) 

: 

CD 

PLAY

 < 

   

> 

: 

TAPE 

PLAY

 [ 

   ] 

: 

TAPE 

REC

   

∗

 

: Impossible to measure

•  Voltages are taken with a VOM (Input impedance 10 

M

Ω).

  Voltage variations may be noted due to normal production 

tolerances.

•  Waveforms are taken with a oscilloscope.
  Voltage variations may be noted due to normal production 

tolerances.

•  Circled numbers refer to waveforms.

•  Signal path.
 

F 

 

f 

 

E 

 

G  : TAPE REC 

 

N 

 

J 

 

c  : DIGITAL

 

I  : USB

Note: The components identifi ed by mark 

0 or dotted line 

with mark 

0 are critical for safety.

 

Replace only with part number specifi ed.

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead 
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than 

ordinary solder.

  Ordinary soldering irons can be used but the iron tip has to be 

applied to the solder joint for a slightly longer time.

  Soldering irons using a temperature regulator should be set to 

about 350 °C.

  Caution: The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

• Strong viscosity
  Unleaded solder is more viscous (sticky, less prone to fl ow) than 

ordinary solder so use caution not to let solder bridges occur such 
as on IC pins, etc.

• Usable with ordinary solder
  It is best to use only unleaded solder but unleaded solder may also 

be added to ordinary solder.

C

B

These are omitted.

E

Q

B

These are omitted.

C

E

Q

B

These are omitted.

C

E

Q

Note on Schematic Diagram:
•  All capacitors are in 

μF unless otherwise noted. (p: pF) 

50 WV or less are not indicated except for electrolytics 
and tantalums.

•  All resistors are in 

Ω and 

1

/

4

 

W or less unless otherwise 

specifi ed.

• 

2  : nonfl ammable resistor.

• 

C  : panel designation.