DOWNLOAD Sony HCD-M100 / HCD-M300AV Service Manual ↓ Size: 7.55 MB | Pages: 81 in PDF or view online for FREE

Model
HCD-M100 HCD-M300AV
Pages
81
Size
7.55 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-m100-hcd-m300av.pdf
Date

Sony HCD-M100 / HCD-M300AV Service Manual ▷ View online

HCD-M100/M300AV
45
45
6-21. SCHEMATIC DIAGRAM – FRONT AMP SECTION –
HCD-M100/M300AV
46
46
6-22. SCHEMATIC DIAGRAM – REAR AMP SECTION – (HCD-M300AV ONLY)
HCD-M100/M300AV
47
47
6-23. PRINTED WIRING BOARD – REAR AMP SECTION – (HCD-M300AV ONLY)  • See page 27 for Circuit Boards Location.
11
CENTER SPEAKER
(11)
REAR SP TERM BOARD
REAR SPEAKER
R
L
4
1
1
A
B
C
D
E
2
3
4
1-677-248-
REAR AMP BOARD
TO
FRONT AMP 
BOARD
CN701
O
(Page34)
11
(11)
1
15
E
E
E
E
4
E
7
E
TO
TRANS  BOARD
CN993
D
(Page41)
TO
MAIN BOARD
CN841B
G
(Page34)
4
3
1
1
L842
L841
Ref. No.
Location
D771
B-1
D841
B-3
D842
B-3
D882
C-2
D883
C-1
D961
D-4
IC831
A-4
Q291
B-1
Q292
B-2
Q771
C-1
Q772
C-1
Q841
B-4
Q842
B-3
• Semiconductor
Location
48
48
6-24. WAVEFORMS
6-25. IC PIN FUNCTION DESCRIPTION
BD BOARD IC101 LA9240M (FOCUS/TRACKING/SLED SERVO, RF AMP)
Pin No.
Pin Name
I/O
Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
FIN2
FIN1
E
F
TB
TE–
TE
TESI
SCI
TH
TA
TD–
TD
JP
TO
FD
FD–
FA
FA–
FE
FE–
AGND
SP
SPI
SPG
SP–
SPD
SLEQ
SLD
SL–
SL+
JP–
JP+
TGL
TOFF
TES
HFL
Connected to the pick-up photodiode
Added with FIN1 to create RF signal, subtracted with FIN1 to create FE signal
Connected to the pick-up photodiode
Connected to the pick-up photodiode Subtracted with F to create TE signal
Connected to the pick-up photodiode
DC component of the TE signal is input
Connects the TE signal gain setting resistor between TE pins
TE signal output
TES (Track Error Sense) comparator input. The TE signal is band-passed and input
Shock detection input
Tracking gain time constant setting
TA amplifier output
Creates a tracking phase compensation constant between TD and VR pins
Tracking phase compensation setting
Tracking jump signal (kick pulse) amplitude setting
Tracking control signal output
Focusing control signal output
Creates a focusing phase compensation constant between FD and FA pins
Creates a focusing phase compensation constant between FD- and FA- pins
Creates a focusing phase compensation constant between FA and FE pins
FE signal output
Connects the FE signal gain setting resistor between TE pins
Analog signal Ground
Single end output of CV+ and CV- pin signal
Spindle amplifier input
Gain setting resistor is connected when the spindle 12cm mode
Works together with the SPD pin to connect to the spindle phase compensation constant
Spindle control signal output
Sled phase compensation constant is connected
Sled control signal output
Sled feeding signal is input from the microprocessor
Sled feeding signal is input from the microprocessor
Tracking jump signal is input from the DSP
Tracking jump signal is input from the DSP
Tracking gain control signal is input from the DSP Gain becomes low when TGL is “H”
Tracking off control signal is input from the DSP
Tracking becomes off when TOFF is “H”
Outputs TES signal to the DSP
HFL (High Frequency Level) is used to determine whether the main beam is
positioned on a pit or a mirror
I
I
I
I
I
I
O
I
I
I
O
I
O
I
O
O
I
O
I
O
I
O
I
I
I
O
I
O
I
I
I
I
I
I
O
O
– MAIN Section –
– PANEL Section –
1
 
IC2 ws (XOUT)
5.5Vp-p
75 kHz
3
 
IC501 ea (EXTAL)
2
 
IC401 ea (EXTAL)
4.8Vp-p
10 MHz
4.8Vp-p
10 MHz
1
 
IC601 8 (X-OUT)
4.2Vp-p
8MHz
1
 
IC101 ra (RFSM)TP(RF)
1.7Vp-p
0.4Vp-p
5.2Vp-p
230ns
6
 
IC102 y; (16M)
16.9344 MHz
4.2336 MHz
7
 
IC102 ya (4.2M)
5Vp-p
5
 
IC102 rf (XOUT)X101
5.2Vp-p
16.9344 MHz
2
 
IC101 w; (FE)
       (PLAY MODE)
3
 
IC101 7 (TE)TP(TE)
4
 
IC102 wa (PCK)TP(PLCK)
0.5Vp-p
5.3Vp-p
– BD Section –
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