Sony HCD-GX750 / HCD-RG551 / HCD-RX550 / MHC-GX750 / MHC-RG551S Service Manual ▷ View online
29
29
HCD-GX750/RG551/RX550
5-4. BLOCK DIAGRAM — PANEL/POWER SECTION —
SYSTEM CONTROLLER
IC601(2/2)
D401
B+
B–
F904
12 I-XT1
X601
32.768kHz
13 I-XT2
15 CF1
X602
10MHz
16 CF2
28
1
SIRDS-IN
REMOTE
CONTROL
RECIEVER
IC610
82
STREM-LED1
74
42
30
POWER RELAY
11
RESET
29
AC CUT
MASTER VOLUME
A
CD
SECTION
25 KEY3
MP3-RESET
6
MP3-REQ
4
MP3-ACK
3
MP3-LP
2
MP3-CS
1
MP3-CLK
100
MP3-DI
99
MP3-DO
98
CD-CLK
97
SENS
96
CD-DATA
95
XLT
94
XRES
93
XTCN
92
SCOR
5
FUNCTION
KEY
S641-S650,SW601
27 KEY1
FUNCTION
KEY
S601-S608,S610-S612
26 KEY2
FUNCTION
KEY
S621-S630
9 VOLUME-IN1
10 VOLUME-IN2
ENCODER
S660
LED
DRIVER
Q610
LED610
LED
DRIVER
Q612
LED
DRIVER
Q611
LED
DRIVER
Q615
LED
DRIVER
Q614
LED
DRIVER
Q613
80
STREM-LED3
LED612
81
STREM-LED2
LED611
77
STREM-LED6
LED615
78
STREM-LED5
LED614
79
STREM-LED6
LED613
76
POWER LED
G01-G13
S1-S21
LED601
F905
AC3
D301-D304
D908
–VFL
F906
D402
VL+
VL–
F908
D401
GX750/RX550
VH+
VH–
F905
F909
F904
AC4
VF1
VF2
D305-D308
D902-905
F907
REG
Q902
D+3.5V
SW+3.5V
1
3
RELAY DRIVE
Q361,362
+9V
1
3
D309-D312
M+9V
VF1
–VFL
VF2
1
3
A+3.5V REG
IC302
D+3.5V REG
IC301
+9V REG
IC303
M+9V REG
IC304
A+3.5V
1
2
+4V
EVER+9V
+3.5V
PT902
SUB TRANSFORMER
RY901
PT901
POWER TRANSFORMER
+4V REG
IC603
1
5
RESET
IC604
1
3
RESET
SWITCH
Q605
FL601
FLUORESCENT
INDICATOR
TUBE
AC
IN
SCOR
XTCN
XRST
XLT(CD LAT)
CD-DATA
SENS
CD-CLK
MP3-DO
MP3-DI
MP3-CLK
MP3-CS
MP3-LP
MP3-ACK
MP3-REQ
MP3-RESET
C15
C14
C13
C12
C11
C10
C9
C8
C7
C6
C5
C4
C3
C2
C1
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
43
45
47
50
52
65
45
47
50
52
65
B+ SWITCH
Q604,616
M+9V
AC4
B+ SWITCH
Q315,316
AC
IN
RY901
RY901
S901
VOLTAGE
SELECTOR
LIVE
220V
240V
LIVE
220V
240V
220V
240V
LIVE
220V
240V
AC
IN
RG551:E2,E3,E51 MODEL
RG551:MX,AR MODEL
GX750/RX550
RG551
(Page 27)
30
30
HCD-GX750/RG551/RX550
5-6. CIRCUIT BOARDS LOCATION
5-5. BLOCK DIAGRAM — SUB WOOFER SECTION —
(Page 28)
(Page 28)
DETECT
SWITCH
OVERCOAR
DETECT
AMP
IC501
RY501
JK501
SUB WOOFER OUT
Q501
Q502
Q507
Q503
SW-IN
SW-LIMITER
SW-ON/OFF
C
MAIN
SECTION
OVERLOAD/DC
RELAY+(+B)
RELAY-
E
MAIN
SECTION
CN503
2
PT-2
3
SW IN
8
12
-RE
13
+RE
DETECT
Q506,Q505
DETECT
CONTROL
MOTOR (LD) board
SW board
SENSOR board
BD81A board
MOTOR (TB) board
DRIVER board
CONNECT board
SUB TRANS board
SUB WOOFER board
AMP board
VIDEO OUT board
GAME JACK board
PANEL board
6 STREAM LED board
H/P JACK board
MAIN board
TRANS board
REM board
31
31
HCD-GX750/RG551/RX550
5-7. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
5-8. WAVEFORMS
Note on Printed Wiring Board:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
Note on Schematic Diagram:
• All capacitors are in
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
2
: nonflammable resistor.
•
C
: panel designation.
•
Indication of transistor.
•
A
: B+ Line.
•
B
: B– Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
(
no mark : FM
(
) : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER (FM/AM)
J
: CD PLAY
E
: TAPE PLAY (DECK-A)
d
: TAPE PLAY (DECK-B)
G
: REC
f
: AUDIO
• Abbreviation
MX
: Mexican model
AR
: Argentine model
E2
: 120 V AC area in E model
E3
: 240 V AC area in E model
E51
: Chilean and Peruvian model
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350
°
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
be added to ordinary solder.
Note:
The components iden-
tified by mark
The components iden-
tified by mark
0
or dot-
ted line with mark
0
are critical for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés
par une marque
Les composants identifiés
par une marque
0
sont cri-
tiques pour la sécurité.
Ne les remplacer que par
une piéce portant le numéro
spécifié.
Ne les remplacer que par
une piéce portant le numéro
spécifié.
– PANEL Board –
1
2
IC601
qh
(CF2)
IC601
qd
(I-XT2)
2V/DIV, 10
µ
s/DIV
2V/DIV, 40ns/DIV
5.2 Vp-p
30.5 s
4.9 Vp-p
100 ns
32
32
HCD-GX750/RG551/RX550
5-9. PRINTED WIRING BOARD — CD MECHANISM SECTION (1/2) — • Refer to page 30 for Circuit Boards Location.
: Uses unleaded solder.
(Page 42)
1
A
B
C
D
E
F
G
H
2
3
4
5
6
7
8
9
10
11
12
13
14
C10
C260
C14
C15
C16
C18
C11
R405
C316
R354
R353
R352
R351
R302
R253
C315
R191
R172
R171
R162
R313
X171
R121
R12
R11
R10
Q10
C116
C312
C184
C183
C303
C305
C259
C258
C257
C255
C203
C196
C195
C201
C182
C171
C172
C308
C151
C134
C125
C314
C123
R165
R13
C17
FB301
C318
C174
R173
R205
C209
C210
C302
R201
R419
R412
R411
R410
R409
R408
R407
R406
R404
R403
R402
R401
R305
R303
R301
R252
R251
R182
R181
R163
R151
R143
R142
R141
R133
R132
R131
R114
R113
R112
R111
R307
C311
C310
C309
C307
C306
IC251
C252
C251
C194
C181
IC101
C163
C162
C143
C142
C141
C133
C132
C131
C124
C111
C122
C115
C114
C113
C112
IC301
C185
C186
R306
CN101
CN201
C317
R202
R203
R161
C161
C211
C212
R204
C213
IC303
C313
C320
M101
M102
S101
Ref. No.
Location
IC101
F-11
IC251
D-8
IC301
D-11
IC303
B-12
Q10
G-6
• Semiconductor
Location
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