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2008J05-1

© 

2008.10

•  HCD-GT111 is the amplifi er, USB, CD player, tape 

deck and tuner section in MHC-GT111/GT111BP.

•  HCD-GT222 is the amplifi er, USB, CD player, tape 

deck and tuner section in MHC-GT222.

•  HCD-GT444 is the amplifi er, USB, CD player, tape 

deck and tuner section in MHC-GT444.

•  HCD-GT555 is the amplifi er, USB, CD player, tape 

deck and tuner section in MHC-GT555.

Photo: HCD-GT555

CD
Section

Model Name Using Similar Mechanism

NEW

Mechanism Type

CDM88A-K6BD93-WOD

Optical Pick-up Block Name

KSM-213DCP

Tape deck 
Section 

Model Name Using Similar Mechanism

HCD-EC55/EC77

Tape Transport Mechanism Type

TCM-J1 or CS-21SC-900TP

The following are measured at AC 120, 127,
220, 230 – 240 V 50/60 Hz
Front speaker

Power output (rated): 110 W + 110 W
(at 6

Ω, 1 kHz, 1% THD)

RMS output power (reference):
200W + 200 W (per channel at 6

Ω,

1 kHz, 10% THD)

Subwoofer

RMS output power (reference): 190 W
(at 6

Ω, 100 Hz, 10% THD)

HCD-GT444
The following are measured at AC 120, 127,
220, 230 – 240 V 50/60 Hz
Front speaker

Power output (rated): 90 W + 90 W
(at 6

Ω, 1 kHz, 1% THD)

RMS output power (reference):
150 W + 150 W (per channel at 6

Ω,

1 kHz, 10% THD)

Subwoofer

RMS output power (reference): 150 W
(at 6

Ω, 100 Hz, 10% THD)

HCD-GT222
The following are measured at AC 120, 127,
220, 230 – 240V 50/60 Hz

Power output (rated): 110 W + 110 W
(at 6

Ω, 1 kHz, 1% THD)

RMS output power (reference):
200 W + 200 W (per channel at 6

Ω,

1 kHz, 10% THD)

HCD-GT111
The following are measured at AC 120, 127,
220, 230 – 240V 50/60 Hz

Power output (rated): 60 W + 60 W
(at 6

Ω, 1 kHz, 1% THD)

RMS output power (reference):
100 W + 100 W (per channel at 6

Ω,

1 kHz, 10% THD)

Inputs
AUDIO INPUT L/R : voltage
250 mV, impedance 47 kilohms
MIC: sensitivity 1 mV, impedance
10 kilohms

(USB) port: Type A

Outputs
PHONES: accepts headphones of 8

Ω or

more
FRONT SPEAKER: accepts impedance of
6

Ω

SUBWOOFER (HCD-GT555/
HCD-GT444 only): accepts
impedance of 6

Ω

Supported bit rate

MP3 (MPEG 1 Audio Layer-3):
32 – 320 kbps, VBR
WMA: 32 – 192 kbps, VBR
AAC: 48 – 320 kbps

Sampling frequencies

MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz

Transfer speed

Full-Speed

Supported USB device

Mass Storage Class

Maximum current

500 mA

System: Compact disc and digital audio
system

Laser Diode Properties

Emission Duration: Continuous
Laser Output*: Less than 44.6

μW

* This output is the value measurement

at a distance of 200 mm from the
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.

Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB

Recording system: 4-track 2-channel, stereo

FM stereo, FM/AM superheterodyne tuner

FM tuner section
Tuning range:

87.5 – 108.0 MHz (50 kHz step)

Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz

AM tuner section
Tuning range

Pan American and Oceanian models:
530 – 1,710 kHz (with 10 kHz tuning
interval)
531 – 1,710 kHz (with 9 kHz tuning
interval)
European and Russian models:
531 – 1,602 kHz (with 9 kHz tuning
interval)
Other models:
530 – 1,610 kHz (with 10 kHz tuning
interval)
531 – 1,602 kHz (with 9 kHz tuning
interval)

Antenna: AM loop antenna, external antenna
terminal
Intermediate frequency: 450 kHz

Mexican model: AC 127 V, 60 Hz
Argentine model: AC 220 V, 50/60 Hz
Other models: AC 120, 220 or 230 –

240 V, 50/60 Hz, Adjustable with

voltage selector

Power consumption

HCD-GT555: 216 W
HCD-GT444: 286 W
HCD-GT222: 163 W
HCD-GT111: 150 W

Dimensions (w/h/d) (excl. speakers)

Approx. 231 × 361 × 437.5 mm
(9 1/8 × 14 1/4 × 17 1/4 inch)

Mass (excl. speakers)

HCD-GT555/GT444/GT222 
(Except European model),
HCD-GT222 (European model):
9.6 kg
HCD-GT111: 8.0 kg

Design and specifications are subject to
change without notice.

Power requirements

European and Russian models:
AC 230 V, 50/60 Hz

  .............................................   3

  ..................................................................   7

3-1. Disassembly 

Flow 

...........................................................   9

3-2. Side-L/R 

Case 

.................................................................  10

3-3.  Top Panel Block ..............................................................   10
3-4.  Tape Mechanism Deck ....................................................   11
3-5.  Front Panel Block ...........................................................   11
3-6.  DC Fan (M102), Back Panel ...........................................   12
3-7. MAIN 

Board 

...................................................................  12

3-8.  CD Mechanism Block .....................................................   13
3-9.  DC Fan (M101), POWERAMP Board ...........................   13
3-10. Base Unit .........................................................................   14
3-11.  OP Base Assy (KSM-213D) ...........................................   14
3-12. Belt (DLM3A) ................................................................   15

TEST  MODE 

 ............................................................   16

ADJUSTMENTS 

 ......................   20

ADJUSTMENTS 

 ........................   21

7-1.  Block Diagram - CD SERVO, USB Section - ................   23
7-2.  Block Diagram - MAIN Section - ...................................   24
7-3.  Block Diagram - AMP Section - .....................................   25
7-4. Block 

Diagram 

 

- PANEL, POWER SUPPLY Section - ...........................   26

7-5.  Schematic Diagram - CD Board (1/2) - ..........................   28
7-6.  Schematic Diagram - CD Board (2/2) - ..........................   29
7-7.  Printed Wiring Board - CD Board - ................................   30
7-8.  Printed Wiring Board - TC Board - .................................   31
7-9.  Schematic Diagram - TC Board - ...................................   31
7-10.  Printed Wiring Board - USB Board - ..............................   32
7-11.  Schematic Diagram - USB Board - .................................   33
7-12.  Printed Wiring Boards - REG Section - ..........................   34
7-13.  Schematic Diagram - REG Section - ..............................   34
7-14.  Printed Wiring Board - MAIN Board - ...........................   35
7-15.  Schematic Diagram - MAIN Board (1/4) - .....................   36
7-16.  Schematic Diagram - MAIN Board (2/4) - .....................   37

0 OR  DOTTED  LINE  

0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

Notes on chip component replacement
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

Flexible Circuit Board Repairing
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

This appliance is 
classified as a CLASS 1
LASER product. This
marking is located on the 
rear exterior.

CAUTION
Use of controls or adjustments or performance of procedures other than 
those specifi ed herein may result in hazardous radiation exposure.

7-17.  Schematic Diagram - MAIN Board (3/4) - .....................   38
7-18.  Schematic Diagram - MAIN Board (4/4) - .....................   39
7-19.  Printed Wiring Boards - JACK Section - ........................   40
7-20.  Schematic Diagram - JACK Section - ............................   40
7-21.  Printed Wiring Board - POWERAMP Board - ...............   41
7-22.  Schematic Diagram - POWERAMP Board (1/2) - .........   42
7-23.  Schematic Diagram - POWERAMP Board (2/2) - .........   43
7-24.  Printed Wiring Board - DISPLAY Board - .....................   44
7-25.  Schematic Diagram - DISPLAY Board - ........................   45
7-26.  Printed Wiring Boards - PANEL Section - .....................   46
7-27.  Schematic Diagram - PANEL Section - ..........................   47
7-28. Printed Wiring Board 
 

- TRANS1 Board (GT111: 120V AC area in E, 240V AC 
area in E, Chilean and Peruvian models) - ......................   48

7-29.  Schematic Diagram - TRANS1 Board 
 

(GT111: 120V AC area in E, 240V AC area in E, 

 

Chilean and Peruvian models) - ......................................   49

7-30.  Printed Wiring Board - TRANS2 Board 
 (GT222/GT444/GT555) 

- 

...............................................  

50

7-31.  Schematic Diagram - TRANS2 Board 
 (GT222/GT444/GT555) 

- 

...............................................  

51

7-32.  Printed Wiring Board - TRANSX Board 
 

(GT111: AEP, Russian and Argentina models) - .............   52

7-33.  Schematic Diagram - TRANSX Board 
 

(GT111: AEP, Russian and Argentina models) - .............   53

8-1. Case 

Section 

....................................................................  63

8-2.  Loading Panel Section ....................................................   64
8-3.  DISPLAY Board Section ................................................   65
8-4.  Front Panel Section .........................................................   66
8-5. Meter 

Display 

Assy 

.........................................................  67

8-6.  Top Panel Section ...........................................................   68
8-7.  Back Panel Section .........................................................   69
8-8.  MAIN Board Section ......................................................   70
8-9. Chassis 

Section 

...............................................................  71

8-10.  CD Mechanism Section (CDM88A-K6BD93-WOD) ....   72

  ..............................   73

GT555: E2

3-287-080-0

[]

GT444: E2

3-287-080-1

[]

GT222: E2

3-287-080-2

[]

GT111: E2

3-287-080-3

[]

GT555: MX

3-287-081-0

[]

GT444: MX

3-287-081-1

[]

GT222: MX

3-287-081-2

[]

GT111: E3

3-287-082-0

[]

GT555: AR

3-287-085-0

[]

GT444: AR

3-287-085-1

[]

GT222: AR

3-287-085-2

[]

GT111: AR

3-287-085-3

[]

GT555: E51

3-287-086-0

[]

GT444: E51

3-287-086-1

[]

GT222: E51

3-287-086-2

[]

GT111: E51

3-287-086-3

[]

GT111: AEP

3-287-088-0

[]

GT222: AEP

3-287-088-1

[]

GT444: AEP, UK

3-287-088-2

[]

GT111: RU

3-287-090-0

[]

GT222: RU

3-287-090-1

[]

GT444: RU

3-287-090-2

[]

GT555: RU

3-287-090-3

[]

The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•   Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

•   Strong viscosity
 

Unleaded solder is more viscou-s (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•   Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1. Press 

[I/

1

] button to turn the power on.

2.  Press the [CD] button to select CD function.
3.  While pressing the [

x

] button, press the [

Z

] button for more 5 

seconds).

4.  The message “UNLOCKED” is displayed and the disc tray is 

unlocked.

Note: When 

“

LOCKED

”

 is displayed, the slot lock is not released by 

turning power on/off with the

 [I/

1]

 button.

• Abbreviation
 AR  : 

Argentina 

model

  E2 

: 120V AC area in E model

  E3 

: 240V AC area in E model

  E51 

: Chilean and Peruvian models

  MX 

: Mexican model

 RU  : 

Russian 

model