Sony HCD-F150 / HCD-FR10 / MHC-F150 / MHC-FR10 Service Manual ▷ View online
— 33 —
FUNC board
AMPLIFIER board
CD DOOR board
DOOR LED board
HP/MIC board
SW/POWER board
PANEL board
TRANS board
MAIN board
TABLE SENSOR board
DISC SENSOR (R) board
DOOR SW board
BU board
CD LED board
AUDIO board
LEAF SW board
CD MOTOR board
DISC SENSOR (S) board
6-4. CIRCUIT BOARDS LOCATION
— 34 —
For schematic diagrams.
Note:
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
¢
: internal component.
•
2
: nonflammable resistor.
•
1
: fusible resistor.
•
C
: panel designation.
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
g
: VIDEO/MD
E
: PB (DECK A)
d
: PB (DECK B)
G
: REC (DECK B)
J
: CD
c
: CD DIGITAL
• Abbreviation
CND : Canadian
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this necessary note is printed in each
block.)
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this necessary note is printed in each
block.)
Note:
The components identi-
fied by mark
The components identi-
fied by mark
!
or dotted
line with mark
!
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
!
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
For printed wiring boards.
Note:
Note:
• X
: parts extracted from the component side.
•
¢
: internal component.
• b
: Pattern from the side which enables seeing.
HCD-F150/FR10
M
TO
MAIN BOARD
CN402
(Page 52)
N
TO
MAIN BOARD
CN401
(Page 52)
1-664-
353-
12
(12)
BD BOARD
M
M
M101
SPINDLE
MOTOR
M102
SLED
MOTOR
OPTICAL
PICK-UP
E
E
E
(LIMIT)
TP
(DVDD)
TP
(FE)
TP
(TE)
TP
(VC)
TP
(RF)
TP
(PLCK)
JW135
TP
(TOFF)
1
2
A
B
C
D
E
F
G
H
I
J
3
4
5
6
7
8
9
10
— 35 —
— 36 —
6-5. PRINTED WIRING BOARD — BD SECTION —
• See page 33 for Circuit Boards Location.
Ref. No.
Location
D151
B-4
IC101
E-4
IC102
E-7
IC103
B-8
IC104
C-8
Q101
H-6
Q102
G-6
Q103
B-2
• Semiconductor
Location
HCD-F150/FR10
— 37 —
— 38 —
6-6. SCHEMATIC DIAGRAM — BD SECTION —
• See page 71 for Waveforms. • See page 72 for IC Pin Functions.
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