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SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-EX6/EX6T/EX8/
EX8T/EX9/EX9T
9-889-803-03
2012B33-1
©
2012.02
E Model
Ver. 1.2 2012.02
• HCD-EX6 is the amplifi er, USB, CD player
and tuner section in MHC-EX6.
• HCD-EX6T is the amplifi er, USB, CD player,
tape deck and tuner section in MHC-EX6T.
• HCD-EX8 is the amplifi er, USB, CD player
and tuner section in MHC-EX8.
• HCD-EX8T is the amplifi er, USB, CD player,
tape deck and tuner section in MHC-EX8T.
• HCD-EX9 is the amplifi er, USB, CD player
and tuner section in MHC-EX9.
• HCD-EX9T is the amplifi er, USB, CD player,
tape deck and tuner section in MHC-EX9T.
HCD-EX6/EX8/EX9
COMPACT DISC RECEIVER
HCD-EX6T/EX8T/EX9T
COMPACT DISC DECK RECEIVER
CD Section
Model Name Using Similar Mechanism
New
Mechanism Type
CDM88CL-D1BD74UR
Optical Pick-up Block Name
DA11MMVGP
Tape Deck Section
(HCD-EX6T/EX8T/EX9T)
(HCD-EX6T/EX8T/EX9T)
Model Name Using Similar Mechanism
HCD-EC69T/EC79T/EC99T
Tape Transport Mechanism Type
TCM-J1 or CS-21SC-901TP
SPECIFICATIONS
Amplifi er section
The following measured at AC 127 V,
60 Hz (Mexican model)
The following measured at AC 220 V,
50/60 Hz (Argentine model)
The following measured at AC 120 V,
220 V, 240 V, 50/60 Hz (Other models)
60 Hz (Mexican model)
The following measured at AC 220 V,
50/60 Hz (Argentine model)
The following measured at AC 120 V,
220 V, 240 V, 50/60 Hz (Other models)
HCD-EX9/EX9T
Front Speaker:
Power output (rated):
Low
Power output (rated):
Low
channel
40 W + 40 W (at 8
, 1 kHz, 1%
THD)
High
High
channel
40 W + 40 W (at 8
, 1 kHz, 1%
THD)
RMS output power (reference):
Low
RMS output power (reference):
Low
channel
85 W + 85 W (per channel at 8
,
1
kHz)
High
channel
85 W + 85 W (per channel at 8
,
1
kHz)
Subwoofer:
RMS output power (reference):
RMS output power (reference):
125 W (at 4
, 80 Hz)
HCD-EX8/EX8T
Power output (rated):
Low
Low
channel
50 W + 50 W (at 8
, 1 kHz, 1%
THD)
High
High
channel
50 W + 50 W (at 8
, 1 kHz, 1%
THD)
RMS output power (reference):
Low
Low
channel
100 W + 100 W (per channel at 8
,
1
kHz)
High
channel
100 W + 100 W (per channel at 8
,
1
kHz)
HCD-EX6/EX6T
Power output (rated):
40 W + 40 W (at 6
, 1 kHz, 1%
THD)
RMS output power (reference):
RMS output power (reference):
90 W + 90 W (per channel at 6
,
1
kHz)
Inputs
PC IN (stereo mini jack):
Sensitivity 800 mV, impedance
22
kilohms
Outputs
PHONES (stereo mini jack):
accepts headphones with an
impedance of 8
or more
SPEAKERS: impedance
HCD-EX9/EX9T/EX8/EX8T:
HCD-EX9/EX9T/EX8/EX8T:
8
HCD-EX6/EX6T:
6
SUBWOOFER (HCD-EX9/EX9T only):
impedance
impedance
4
USB section
Supported bit rate:
MP3 (MPEG 1 Audio Layer-3):
32 kbps – 320 kbps, VBR
WMA: 48 kbps – 192 kbps
AAC: 48 kbps – 320 kbps
Sampling frequencies:
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48
kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
(USB) port:
Maximum
current:
500
mA
CD player section
System:
Compact disc and digital audio
system
Laser Diode Properties
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6
W
* This output is the value
measurement at a distance of
200mm from the objective lens
surface on the Optical Pick-up
Block with 7mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
Tape deck section (HCD-EX9T/
EX8T/EX6T only)
EX8T/EX6T only)
Recording system: 4-track 2-channel, stereo
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
Antenna:
FM lead antenna
AM loop antenna
FM tuner section:
Tuning range:
Tuning range:
87.5 MHz – 108.0 MHz (50 kHz step)
Intermediate frequency: 225 kHz
AM tuner section:
Tuning range
Latin American models:
Tuning range
Latin American models:
530 kHz – 1,710 kHz (10 kHz step)
531 kHz – 1,710 kHz (9 kHz step)
Other models:
531 kHz – 1,602 kHz (9 kHz step)
530 kHz – 1,610 kHz (10 kHz step)
Intermediate frequency: 53 kHz
– Continued on next page –
Photo: HCD-EX9T
• MPEG Layer-3 audio coding technology and pat-
ents licensed from Fraunhofer IIS and Thomson.
• Windows Media is a registered trademark of
Microsoft Corporation in the United States and/or
other countries.
other countries.
HCD-EX6/EX6T/EX8/EX8T/EX9/EX9T
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Side Panel (R)/(L) .......................................................... 7
2-2. Top Panel Section ........................................................... 7
2-3. Tape Mechanism Deck (HCD-EX6T/EX8T/EX9T) ....... 8
2-4. Front Panel Section ......................................................... 8
2-5. MAIN
2-2. Top Panel Section ........................................................... 7
2-3. Tape Mechanism Deck (HCD-EX6T/EX8T/EX9T) ....... 8
2-4. Front Panel Section ......................................................... 8
2-5. MAIN
Board
................................................................... 9
2-6. Back Panel Section ......................................................... 10
2-7. CD Mechanism Section .................................................. 11
2-8. Belt
2-7. CD Mechanism Section .................................................. 11
2-8. Belt
(DLM3A)
................................................................ 11
2-9. Base
Unit
......................................................................... 12
2-10. BD74 Board .................................................................... 12
3.
TEST MODE
............................................................ 13
4. MECHANICAL
ADJUSTMENTS
...................... 15
5. ELECTRICAL
ADJUSTMENTS
........................ 15
6. DIAGRAMS
6-1. Block Diagram –CD/Tuner Section– .............................. 21
6-2. Block Diagram –Tape/Audio Section– ........................... 22
6-3. Block Diagram –Display/Power Supply Section– .......... 23
6-4. Printed Wiring Board –CD Section– .............................. 24
6-5. Schematic Diagram –CD Section– ................................. 25
6-6. Printed Wiring Board –USB Section– ............................ 26
6-7. Schematic Diagram –USB Section– ............................... 27
6-8. Printed Wiring Board –Panel Section– ........................... 28
6-9. Schematic Diagram –Panel Section– .............................. 29
6-10. Printed Wiring Board –USB-JACK Section– ................. 30
6-11. Schematic Diagram –USB-JACK Section– .................... 30
6-12. Printed Wiring Boards –MAIN-AMP Section– .............. 31
6-13. Schematic Diagram –MAIN-AMP Section (1/2)–.......... 32
6-14. Schematic Diagram –MAIN-AMP Section (2/2)–.......... 33
6-15. Printed Wiring Board –Power Supply Section– ............. 34
6-16. Schematic Diagram –Power Supply Section– ................ 35
6-17. Schematic Diagram –Tape Deck Section
(HCD-EX6T/EX8T/EX9T)–
6-2. Block Diagram –Tape/Audio Section– ........................... 22
6-3. Block Diagram –Display/Power Supply Section– .......... 23
6-4. Printed Wiring Board –CD Section– .............................. 24
6-5. Schematic Diagram –CD Section– ................................. 25
6-6. Printed Wiring Board –USB Section– ............................ 26
6-7. Schematic Diagram –USB Section– ............................... 27
6-8. Printed Wiring Board –Panel Section– ........................... 28
6-9. Schematic Diagram –Panel Section– .............................. 29
6-10. Printed Wiring Board –USB-JACK Section– ................. 30
6-11. Schematic Diagram –USB-JACK Section– .................... 30
6-12. Printed Wiring Boards –MAIN-AMP Section– .............. 31
6-13. Schematic Diagram –MAIN-AMP Section (1/2)–.......... 32
6-14. Schematic Diagram –MAIN-AMP Section (2/2)–.......... 33
6-15. Printed Wiring Board –Power Supply Section– ............. 34
6-16. Schematic Diagram –Power Supply Section– ................ 35
6-17. Schematic Diagram –Tape Deck Section
(HCD-EX6T/EX8T/EX9T)–
..........................................
36
6-18. Printed Wiring Board –Tape Deck Section
(HCD-EX6T/EX8T/EX9T)–
(HCD-EX6T/EX8T/EX9T)–
..........................................
37
7.
EXPLODED VIEWS
7-1. Overall
Section
............................................................... 46
7-2. Front Panel Section ......................................................... 47
7-3. Top Panel Section (HCD-EX6T/EX8T/EX9T) .............. 48
7-4. Chassis
7-3. Top Panel Section (HCD-EX6T/EX8T/EX9T) .............. 48
7-4. Chassis
Section
............................................................... 49
7-5. MAIN Board Section ...................................................... 50
7-6. CD Mechanism Section (CDM88CL-D1BD74UR) ....... 51
7-6. CD Mechanism Section (CDM88CL-D1BD74UR) ....... 51
8.
ELECTRICAL PARTS LIST
.............................. 52
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
General
Power requirements
Mexican
Mexican
model:
AC 127 V, 60 Hz
Argentine
model:
AC 220 V, 50/60 Hz
Other
models:
AC 120 V, 220 V or 230 V – 240 V,
50/60 Hz, adjustable with voltage
selector
Power consumption
HCD-EX9/EX9T:
Power consumption
HCD-EX9/EX9T:
175
W
(0.5 W at the Power Saving Mode)
HCD-EX8/EX8T:
170
W
(0.5 W at the Power Saving Mode)
HCD-EX6/EX6T:
110
W
(0.5 W at the Power Saving Mode)
Dimensions (W/H/D) (excl. speakers)
Approx. 200 mm × 306 mm ×
350
mm
Mass (excl. speakers)
HCD-EX9: Approx. 6.7 kg
HCD-EX9T: Approx. 7.0 kg
HCD-EX8: Approx. 6.6 kg
HCD-EX8T: Approx. 6.9 kg
HCD-EX6: Approx. 5.6 kg
HCD-EX6T: Approx. 5.9 kg
Design and specifi cations are subject to
change without notice.
change without notice.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
HCD-EX6/EX6T/EX8/EX8T/EX9/EX9T
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
• Abbreviation
E4
E4
: 220 – 240V AC area in E model
AR :
Argentina
model
MX
: Mexican model
E2
: 120V AC area in E model
E51
: Chilean and Peruvian models
Model
Part No.
EX6T: E4 model
4-178-730-0[]
EX6: AR model
4-178-731-0[]
EX8T: E4 model
4-178-733-0[]
EX8: AR model
4-178-734-0[]
EX8: MX model
4-178-735-0[]
EX9T: E4 model
4-178-736-0[]
EX9: AR model
4-178-737-0[]
EX9: MX model
4-178-738-0[]
EX6: E2, E51 models
*
EX8: E2, E51 models
*
EX9: E2, E51 models
*
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Model Number Label
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[
?/1
] button to turn the power on.
2. Press the [FUNCTION] button to select CD function.
3. While pressing the [
3. While pressing the [
x
] button, press the [
Z
] button for more 5
seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When “LOCKED” is displayed, the slot lock is not released by turn-
ing power on/off with the [?/1] button.
*
: Since the HCD-EX6/EX8/EX9: E2 and E51 models have their
model number labels marked directly on the back panel, the
model number labels have no relative part numbers.
model number labels have no relative part numbers.
Because of this, determine the model through the marked model
number when comparing the difference between these models.
HCD-EX6/EX6T/EX8/EX8T/EX9/EX9T
4
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
HOW TO REMOVE THE KNOB (VOL)
1 Turn a gear by a driver
till a lever rises up
to the position of the figure.
lever
state of opening the CD tray
gear
2 Pull the tray by the hand.
2 VOL knob
hole
1 Push the VOL knob by the flat head driver.
front panel block
(back view)
(back view)
Note: Please take out the side panel (R) from a set refer to DISASSEMBLY (page 7).