HCD-EX66, HCD-EX88, HCD-EX99, MHC-EX66, MHC-EX88, MHC-EX99 — Sony Audio Service Manual (repair manual)

Model
HCD-EX66 HCD-EX88 HCD-EX99 MHC-EX66 MHC-EX88 MHC-EX99
Pages
74
Size
3.62 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-ex66-hcd-ex88-hcd-ex99-mhc-ex66-mhc-ex88-mhc-e.pdf
Date

View Sony HCD-EX66 / HCD-EX88 / HCD-EX99 / MHC-EX66 / MHC-EX88 / MHC-EX99 Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-EX66/EX88/EX99
9-893-153-01
2011C04-1
© 
2011.03
E Model
Ver. 1.0  2011.03
•  HCD-EX66 is the amplifi er, USB, CD player 
and tuner section in MHC-EX66.
•  HCD-EX88 is the amplifi er, USB, CD player 
and tuner section in MHC-EX88.
•  HCD-EX99 is the amplifi er, USB, CD player 
and tuner section in MHC-EX99.
COMPACT DISC RECEIVER
CD Section
Model Name Using Similar Mechanism
New
Mechanism Type
CDM76B-D1BD76
Optical Pick-up Block Name
DA11MMVGP
SPECIFICATIONS
Amplifi er section
The following measured at AC 127 V,
60 Hz (Mexican model)
The following measured at AC 220 V,
50/60 Hz (Argentine model)
The following measured at AC 230 V,
50/60 Hz (Other models)
HCD-EX99
Front Speaker:
Power output (rated):
 
80 W + 80 W (at 3 
Ω, 1 kHz, 1% THD)
RMS output power (reference):
 
135 W + 135 W (per channel at 3 
Ω,
 
1 kHz)
Subwoofer:
RMS output power (reference):
 
200 W (at 8 
Ω, 100 Hz)
HCD-EX88
Power output (rated):
 
120 W + 120 W (at 4 
Ω, 1 kHz, 1% THD)
RMS output power (reference):
 
200 W + 200 W (per channel at 4 
Ω,
 
1 kHz)
HCD-EX66
Power output (rated):
 
50 W + 50 W (at 4 
Ω, 1 kHz, 1%
 THD)
RMS output power (reference):
 
90 W + 90 W (per channel at 4 
Ω,
 
1 kHz)
Inputs
DVD/PC IN L/R (phono jacks):
 
Sensitivity 700 mV, impedance
 
22 k
Ω
Outputs
PHONES (stereo mini jack):
 
accepts headphones with an
 
impedance of 8 
Ω or more
SPEAKERS: impedance
 
HCD-EX99: impedance 3 
Ω
 
HCD-EX88/EX66: impedance 4 
Ω
SUBWOOFER (HCD-EX99 only):
 
impedance 8 
Ω
USB section
Supported bit rate:
 
MP3 (MPEG 1 Audio Layer-3):
 
32 kbps – 320 kbps, VBR
 
WMA: 48 kbps – 192 kbps
 
AAC: 48 kbps – 320 kbps
Sampling frequencies:
 
MP3 (MPEG 1 Audio Layer-3):
 
32/44.1/48 kHz
 
WMA: 44.1 kHz
 
AAC: 44.1 kHz
 (USB) port:
 
Maximum current:
 
500 mA
CD player section
System:
 
Compact disc and digital audio
 system
Laser Diode Properties
 
Emission Duration: Continuous
 
Laser Output*: Less than 44.6
μW
 
* This output is the value
 
  measurement at a distance of
 
  200mm from the objective lens
 
  surface on the Optical Pick-up 
 
  Block with 7mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
 
FM lead antenna
 
AM loop antenna
FM tuner section:
Tuning range:
 
87.5 MHz 
‒ 108.0 MHz (50 kHz step)
Intermediate frequency:
 
200/250/300/350/400 kHz
Photo: HCD-EX99
•  MPEG Layer-3 audio coding technology and patents licensed from 
  Fraunhofer IIS and Thomson.
•  Windows Media is either a registered trademark or trademark of Microsoft 
Corporation in the United States and/orother countries.
•  This product contains technology subject to certain intellectual property 
rights of Microsoft. Use or distribution of this technology outside of this 
product is prohibited without the appropriate license(s) from Microsoft.
– Continued on next page –
HCD-EX66/EX88/EX99
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 
repairing.
•  Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
•  Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear exterior.
AM tuner section:
Tuning range
Latin American models:
 
530 kHz ‒ 1,710 kHz (10 kHz step)
 
531 kHz ‒ 1,710 kHz (9 kHz step)
Saudi Arabia model:
 
531 kHz ‒ 1,602 kHz (9 kHz step)
Other models:
 
531 kHz ‒ 1,602 kHz (9 kHz step)
 
530 kHz ‒ 1,610 kHz (10 kHz step)
Intermediate frequency: 400 kHz
General
Power requirements
 
Mexican model:
 
AC 127 V, 60 Hz
 
Argentine model:
 
AC 220 V ‒ 240 V, 50/60 Hz
 
Other models:
 
AC 120 V ‒ 240 V, 50/60 Hz
Power consumption
 
HCD-EX99: 85 W
 
(0.5 W at the Power Saving Mode)
 
HCD-EX88: 70 W
 
(0.5 W at the Power Saving Mode)
 
HCD-EX66: 45 W
 
(0.5 W at the Power Saving Mode)
Dimensions (W/H/D) (excl. speakers)
 
Approx. 210 mm × 312 mm ×
 
375 mm
Mass (excl. speakers)
 
HCD-EX99/EX88: Approx. 3.8 kg
 
HCD-EX66: Approx. 3.6 kg
Design and specifi cations are subject to
change without notice.
HCD-EX66/EX88/EX99
3
1. 
SERVICING  NOTES
  .............................................   4
2. DISASSEMBLY
2-1.   Side Case (L), Side Case (R)  .........................................   9
2-2.  Top Panel Section ...........................................................   9
2-3.   Shield (Power-PWB) ......................................................   10
2-4.   Front Panel Section .........................................................   10
2-5.  Back Panel Section .........................................................   11
2-6.  AMP SMPS Board ..........................................................   12
2-7. 
Knob  (VOL) ....................................................................   13
2-8.  CD Mechanism Deck ......................................................   13
2-9. 
Base  Unit .........................................................................   14
2-10.  Optical Pick-up ...............................................................   14
3. 
TEST  MODE
  ............................................................   15
4. 
ELECTRICAL  ADJUSTMENTS
   ........................   16
5. DIAGRAMS
5-1.  Block Diagram –CD Section– ........................................   17
5-2.  Block Diagram –Tuner/Audio Section– .........................   18
5-3.  Block Diagram –Display/Power Section– ......................   19
5-4.  Printed Wiring Board –CD Section– ..............................   21
5-5.  Schematic Diagram –CD Section (1/2)– ........................   22
5-6.  Schematic Diagram –CD Section (2/2)– ........................   23
5-7.  Printed Wiring Board –Panel Section– ...........................   24
5-8.  Schematic Diagram –Panel Section (1/3)– .....................   25
5-9.  Schematic Diagram –Panel Section (2/3)– .....................   26
5-10.  Schematic Diagram –Panel Section (3/3)– .....................   27
5-11.  Schematic Diagram –Tuner Section– .............................   28
5-12.  Printed Wiring Board –Tuner Section– ...........................   29
5-13.  Printed Wiring Board –Module Section– ........................   29
5-14.  Schematic Diagram –Module Section– ..........................   30
5-15.  Printed Wiring Board 
 
–AMP SMPS Section (HCD-EX66)– .............................   31
5-16.  Schematic Diagram 
 
–AMP SMPS Section (1/2) (HCD-EX66)– ....................   32
5-17.  Schematic Diagram 
 
–AMP SMPS Section (2/2) (HCD-EX66)– ....................   33
5-18.  Printed Wiring Board 
 
–AMP SMPS Section (HCD-EX88)– .............................   34
5-19.  Schematic Diagram 
 
–AMP SMPS Section (1/2) (HCD-EX88)– ....................   35
5-20.  Schematic Diagram 
 
–AMP SMPS Section (2/2) (HCD-EX88)– ....................   36
5-21.  Printed Wiring Board 
 
–Regulator Section (HCD-EX88)– .................................   37
5-22.  Schematic Diagram 
 
–Regulator Section (HCD-EX88)– .................................   38
5-23.  Printed Wiring Board 
 
–AMP SMPS Section (HCD-EX99)– .............................   39
5-24.  Schematic Diagram 
 
–AMP SMPS Section (1/2) (HCD-EX99)– ....................   40
5-25.  Schematic Diagram 
 
–AMP SMPS Section (2/2) (HCD-EX99)– ....................   41
5-26.  Printed Wiring Board 
 
–Regulator Section (HCD-EX99)– .................................   42
5-27.  Schematic Diagram 
 
–Regulator Section (HCD-EX99)– .................................   43
6. 
EXPLODED  VIEWS
6-1.  Overall Section ...............................................................   51
6-2.  Front Panel Section .........................................................   52
6-3.  Top Panel Section ...........................................................   53
6-4.  Chassis Section ...............................................................   54
7. 
ELECTRICAL  PARTS  LIST
   ..............................   55
Accessories are given in the last of the electrical parts list.
TABLE  OF  CONTENTS
HCD-EX66/EX88/EX99
4
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
•  Strong viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
• Abbreviation
  AR 
: Argentina model
  E2 
: 120V AC area in E model
  E4 
: 220 – 240V AC area in E model
  E51 
: Chilean and Peruvian models
  EA 
: Saudi Arabia model
  MX 
: Mexican model
Model
Part No.
EX99: MX model
4-263-771-0[]
EX99: AR model
4-263-772-0[]
EX88: E2, E51 models
4-263-773-0[]
EX88: MX model
4-263-774-0[]
EX88: AR model
4-263-775-0[]
EX66: E4 model
4-263-778-0[]
EX66: EA model
4-263-779-0[]
EX66: E2, E51 models
4-263-780-0[]
EX66: AR model
4-263-782-0[]
EX99: E2, E51 models
*
MODEL  IDENTIFICATION
– Model Number Lavel –
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1.  Press [
?/1
] button to turn the power on.
2.  Press the [FUNCTION] button to select CD function.
3.  While pressing the [
x
] button for more 5 seconds.
4.  The message “CHILD LOCK OFF” is displayed and the disc 
tray is unlocked.
Note: When “CHILD LOCK ON” is displayed, the slot lock is not re-
leased by turning power on/off with the [?/1] button.
*
: Since the HCD-EX99: E2 and E51 models have their model 
number labels marked directly on the back panel, the model 
number labels have no relative part numbers.
  Because of this, determine the model through the marked model 
number when comparing the difference between these models.
Parts No.
Page of 74
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  • Schematics, wiring and block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Parts list (bill of materials).