Sony HCD-DX80 Service Manual ▷ View online
SERVICE MANUAL
MINI HI-FI COMPONENT SYSTEM
E Model
SPECIFICATIONS
HCD-DX80
Ver 1.1 2001.11
9-929-593-12
Sony Corporation
2001K0500-1
Home Audio Company
C
2001.11
Published by Sony Engineering Corporation
Model Name Using Similar Mechanism
HCD-DX50
CD
CD Mechanism Type
CDM58E-30BD60
Section
Base Unit Name
BU-30BD60
Optical Pick-up Name
A-MAX.3
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
TCM-230AWR41
– Continued on next page –
• HCD-DX80 is the tuner, deck, CD and
amplifier section in MHC-DX80.
2
HCD-DX80
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
3
HCD-DX80
MODEL IDENTIFICATION
— BACK PANEL —
MODEL
BR, E2, E51, SP, AR models
MX model
PARTS No.
4-231-580-4
s
4-231-580-5
s
• Abbreviation
AR
: Argentina model
BR
: Brazilian model
E2
: 120 V AC Area in E model
E51
: Chilean and Peruvian model
SP
: Singapore model
MX
: Mexican model
PARTS No.
TABLE OF CONTENTS
1.
GENERAL
...................................................................
4
2.
DISASSEMBLY
.........................................................
7
2-1. Disassembly Flow ...........................................................
7
2-2. Case (Top) .......................................................................
8
2-3. Loading Panel ..................................................................
8
2-4. CD Mechanism Deck (CDM58E-30BD60) ...................
9
2-5. Front Panel Section .........................................................
9
2-6. Tape Mechanism Deck (TCM-230AWR41) ................... 10
2-7. Back Panel Section .......................................................... 10
2-8. Main Board ...................................................................... 11
2-9. LEAF SW Board, HEAD (A) Board,
2-7. Back Panel Section .......................................................... 10
2-8. Main Board ...................................................................... 11
2-9. LEAF SW Board, HEAD (A) Board,
HEAD (B) Board ............................................................ 11
2-10. Base Unit (BU-30BD60) ................................................ 12
2-11. DRIVER Board, MOTOR Board, SENSOR Board ....... 12
2-11. DRIVER Board, MOTOR Board, SENSOR Board ....... 12
3.
TEST MODE
............................................................... 13
4.
MECHANICAL ADJUSTMENTS
........................ 15
5.
ELECTRICAL ADJUSTMENTS
.......................... 15
6.
DIAGRAMS
6-1. Block Diagram –TUNER/CD Section – ......................... 21
6-2. Block Diagram –MAIN Section – .................................. 22
6-3. Note for Printed Wiring Boards and
6-2. Block Diagram –MAIN Section – .................................. 22
6-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 23
6-4. Schematic Diagram –BD Board – .................................. 24
6-5. Printed Wiring Board –BD Board – ............................... 25
6-6. Schematic Diagram –MAIN Board (1/4) – .................... 26
6-7. Schematic Diagram –MAIN Board (2/4) – .................... 27
6-8. Schematic Diagram –MAIN(3/4)/HEAD Board – ......... 28
6-9. Schematic Diagram –MAIN Board (4/4) – .................... 29
6-10. Printed Wiring Board –MAIN Board – .......................... 30
6-11. Schematic Diagram
6-5. Printed Wiring Board –BD Board – ............................... 25
6-6. Schematic Diagram –MAIN Board (1/4) – .................... 26
6-7. Schematic Diagram –MAIN Board (2/4) – .................... 27
6-8. Schematic Diagram –MAIN(3/4)/HEAD Board – ......... 28
6-9. Schematic Diagram –MAIN Board (4/4) – .................... 29
6-10. Printed Wiring Board –MAIN Board – .......................... 30
6-11. Schematic Diagram
–POWER AMP/SENSOR Board – ................................. 32
6-12. Printed Wiring Boards
–POWER AMP/SENSOR Board – ................................. 33
6-13. Schematic Diagram
–PANEL/VIDEO SWITCH Board – .............................. 34
6-14. Printed Wiring Boards
–PANEL/VIDEO SWITCH Board – .............................. 35
6-15. Schematic Diagram
–CD SWITCH/PAD SWITCH Board – ......................... 36
6-16. Printed Wiring Boards
–CD SWITCH/PAD SWITCH Board – ......................... 37
6-17. Schematic Diagram –LEAF SW Board – ....................... 38
6-18. Printed Wiring Boards –LEAF SW/HEAD Board – ...... 39
6-19. Schematic Diagram
6-18. Printed Wiring Boards –LEAF SW/HEAD Board – ...... 39
6-19. Schematic Diagram
–ADDRESS SENSOR/DRIVER/MOTOR Board – ...... 40
6-20. Printed Wiring Boards
–ADDRESS SENSOR/DRIVER/5MOTOR Board – .... 41
6-21. Schematic Diagram
–MAIN TRANS/SUB TRANS Board – ........................ 42
6-22. Printed Wiring Boards
–MAIN TRANS/SUB TRANS Board – ......................... 43
6-23. IC Pin Function Description ........................................... 47
7.
EXPLODED VIEWS
7-1. Cabinet Section ............................................................... 52
7-2. Front Panel Section ......................................................... 53
7-3. Main Board Section ........................................................ 54
7-4. CD Mechanism Deck Section (CDM58E-30BD60) ...... 55
7-5. Base Unit Section (BU-30BD60) ................................... 56
7-6. Tape Mechanism Deck Section-1 (TCM-230AWR41) .... 57
7-7. Tape Mechanism Deck Section-2 (TCM-230AWR41) .... 58
7-2. Front Panel Section ......................................................... 53
7-3. Main Board Section ........................................................ 54
7-4. CD Mechanism Deck Section (CDM58E-30BD60) ...... 55
7-5. Base Unit Section (BU-30BD60) ................................... 56
7-6. Tape Mechanism Deck Section-1 (TCM-230AWR41) .... 57
7-7. Tape Mechanism Deck Section-2 (TCM-230AWR41) .... 58
8.
ELECTRICAL PARTS LIST
.................................. 59
4
HCD-DX80
SECTION 1
GENERAL
This section is extracted from
instruction manual.
instruction manual.