Sony HCD-D890AV / HCD-XB55AV / HCD-XB80AV / HCD-XB88AV / LBT-D890AV / LBT-XB55AV / LBT-XB80AV Service Manual ▷ View online
– 31 –
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
¢
: internal component.
•
2
: nonflammable resistor.
•
5
: fusible resistor.
•
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
•
p
: parts mounted on the conductor side.
•
®
: Through hole.
•
¢
: internal component.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal pro-
duction tolerances.
duction tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
F
: FM
f
: AM
E
: PB (DECK A)
d
: PB (DECK B)
G
: REC (DECK B)
J
: CD
c
: digital out
I
: PHONO
• Abbreviation
CND : Canadian model.
EE
EE
: East European model.
AUS
: Australian model.
AR
: Argentine model.
MX
: Mexican model.
Note:
The components identi-
fied by mark
The components identi-
fied by mark
!
or dotted
line with mark
!
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
!
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
– 32 –
IC103
@¶
MDP
1
2
3
4
5
WAVEFORMS
– CD SECTION –
– CD SECTION –
IC101
#£
RFO
IC101
2
FEI
IC101
$¶
TEI
IC103
^™
RFCK
6
IC103
^º
XPCK
7
IC103
&¢
WFCK
IC103
*ª
XTAI
8
500mV/DIV, 500nsec/DIV
1.3Vp-p
200mV/DIV, 1
µ
sec/DIV
0.5Vp-p
50mV/DIV, 1msec/DIV
0.2Vp-p
7.8
µ
sec
2.5Vp-p
230
µ
sec
5Vp-p
135
µ
sec
5Vp-p
135
µ
sec
5Vp-p
16.9344MHz
2.6Vp-p
1
2
IC1752
!¢
IC21
@¢
XOUT
– TUNER SECTION –
(AEP, UK, German model)
(AEP, UK, German model)
4.332MHz
2Vp-p
1
IC21
@¢
XOUT
– TUNER SECTION –
(East European, CIS model)
(East European, CIS model)
4.5MHz
4.2Vp-p
1
IC601
!™
X-OUT
– DISPLAY SECTION –
1
IC602
@¢
XTAL
– MAIN SECTION (1/5) –
4.5MHz
4.2Vp-p
1
2
IC701
!£
XT2
IC701
0
X2
– MAIN SECTION (2/5) –
8MHz
4.8Vp-p
32.768kHz
5.2Vp-p
8MHz
4Vp-p
8MHz
5.5Vp-p
– 33 –
– 34 –
6-3. PRINTED WIRING BOARD – CD SECTION –
• See page 18 for Circuit Boards Location.
Ref. No.
Location
• Semiconductor
Location
IC101
C-5
IC102
B-5
IC103
C-6
Q101
C-3
• Indication of transistor
HCD-D890AV/XB55AV/XB80AV/XB88AV
(Page 44)
Q
C
These are omitted
E
B
– 35 –
– 36 –
6-4. SCHEMATIC DIAGRAM – CD SECTION –
• See page 32 for Waveforms.
• See page 87 for IC Block Diagrams.
• See page 92 for IC Pin Functions.
• See page 87 for IC Block Diagrams.
• See page 92 for IC Pin Functions.
HCD-D890AV/XB55AV/XB80AV/XB88AV
(Page 48)
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