Sony FST-GTK33IP / RDH-GTK11IP / RDH-GTK33IP Service Manual ▷ View online
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
5
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistors referring to the fi gure below.
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistors referring to the fi gure below.
• Connetion position
1.
MAIN board (Ref. No. C734) (page 5)
2.
GTK11-SMPS board (Ref. No. C914) (GTK11iP only)
(page
5)
3.
GTK33-SMPS board (Ref. No. C914) (GTK33iP only)
(page
6)
1. MAIN board (Ref. No. C734)
The MAIN board can be discharged by two kinds of following
methods.
1. Both ends of C734.
The MAIN board can be discharged by two kinds of following
methods.
1. Both ends of C734.
– MAIN Board (Conductor Side) –
C734
C734
800
:/2 W
2. Ground terminal (ET703) and R727.
Note: When you use this connection, confi rm that the GTK11-SMPS
board (GTK11iP) or the GTK33-SMPS board (GTK33iP) is not
connected with CN811 on the MAIN board.
connected with CN811 on the MAIN board.
– MAIN Board (Component Side) –
CN811
Not connect
Not connect
0
:
R727
ET703
R727
ET703
2. GTK11-SMPS board (Ref. No. C914) (GTK11iP only)
The GTK11-SMPS board can be discharged by two kinds of fol-
lowing methods.
1. Both ends of C914.
The GTK11-SMPS board can be discharged by two kinds of fol-
lowing methods.
1. Both ends of C914.
– GTK11-SMPS Board (Conductor Side) –
C914
C914
800
:/2 W
2. Heat sink (A930) and R914.
– GTK11-SMPS Board (Component Side) –
A930
0
:
R914
A930
R914
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
6
3. GTK33-SMPS board (Ref. No. C914) (GTK33iP only)
The GTK33-SMPS board can be discharged by two kinds of fol-
lowing methods.
1. Both ends of C914.
The GTK33-SMPS board can be discharged by two kinds of fol-
lowing methods.
1. Both ends of C914.
– GTK33-SMPS Board (Conductor Side) –
C914
C914
800
:/2 W
2. Heat sink (A930) and R914.
A930
0
:
– GTK33-SMPS Board (Component Side) –
R914
R914
A930
BOND FIXATION OF ELECTRIC PARTS
When MAIN board is replaced or the following object parts are
replaced, it is necessary to fi x parts to the boards by using a speci-
fi ed bond without fail.
When MAIN board is replaced or the following object parts are
replaced, it is necessary to fi x parts to the boards by using a speci-
fi ed bond without fail.
• Object boards
Complete MAN board
Complete MAN board
• Object parts
Board
Ref. No.
GTK11-SMPS
C905, C914, C967, C969, L903, L904, R933,
R934, T901, VDR901
R934, T901, VDR901
GTK33-SMPS
C905, C911, C912, C914, C943, C944, C986,
L901, L902, R930, R931, T901, T903, VDR901
L901, L902, R930, R931, T901, T903, VDR901
MAIN
C730, C731, C732, C733, C734, C811, L703,
L704, L705, L706, L707, L708, L709, L710,
R727
L704, L705, L706, L707, L708, L709, L710,
R727
• Use bond
Part No.
Description
7-432-912-52
BOND, SONY (SC-608LV)
• Parts position
1.
MAIN board (page 7)
2.
GTK11-SMPS board (GTK11iP only) (page 8)
3.
GTK33-SMPS board (GTK33iP only) (page 9)
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
7
1. MAIN board
– MAIN Board (Component Side) –
C811
C734
C734
J301
HS1
C730
L703
L707
L708
L709
L710
L704
L705
L706
C731
C732
C733
R727
The portion which applies bond:
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
8
2. GTK11-SMPS board (GTK11iP only)
– GTK11-SMPS Board (Component Side) –
C905
VDR901
C914
A930
A931
C967
T901
R933
R934
C969
Fix the 180 degrees or larger
circumferences of C914.
circumferences of C914.
Confirmation points:
1. The bond does not become thin on
1. The bond does not become thin on
the way, and is applied in a fixed
quantity 180 degrees or more.
2. There is no space between C914 and
board.
3. The bond is applied to both C914 and
board.
4. The bond total amount is not less
board.
3. The bond is applied to both C914 and
board.
4. The bond total amount is not less
than 5 g.
Confirmation points:
1. The leads of L903 and L904 cannot be
seen.
2. There is no space between L903/L904 and
board.
3. The bond is applied to both L903 and L904.
4. The bond is applied not less than 10 mm
1. The leads of L903 and L904 cannot be
seen.
2. There is no space between L903/L904 and
board.
3. The bond is applied to both L903 and L904.
4. The bond is applied not less than 10 mm
to the side body of L903 and L904.
5. The bond total amount in both sides
(the board-edge side and board-center
side) is not less than 7 g, respectively.
Fix the 90-degree or larger
circumferences of C967.
circumferences of C967.
Fix the 90-degree or larger
circumferences of C969.
circumferences of C969.
Fix both the sides of
L903 and L904 with the board.
L903 and L904 with the board.
Fix both the sides of
T901 with the board.
T901 with the board.
Fix A931 with the board.
Fix A930 with the board.
Fix R933 and R934
with the board.
with the board.
Apply bond on
C905 and VDR901.
C905 and VDR901.
L904
L903
The portion which applies bond:
Ver. 1.1
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