DOWNLOAD Sony DHC-VZ50MD / HCD-VZ50MD Service Manual ↓ Size: 22.12 MB | Pages: 127 in PDF or view online for FREE

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— BACK PANEL —

• Abbreviation

HK

: Hong Kong model

MY

: Malaysia model

SP

: Singapore model

JE

: Tourist model

SP, MY model

HK model

JE model

4-227-557-0s

4-227-557-1s

4-227-557-2s

1. SERVICING NOTES ···················································

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7-1. Circuit Boards Location ·············································· 48
7-2. Block Diagrams ··························································· 51
7-3. Printed Wiring Board – Deck Section – ······················ 56
7-4. Schematic Diagram – Deck Section – ························· 57
7-5. Printed Wiring Board – CD Section – ························· 58
7-6. Schematic Diagram – CD Section – ···························· 59
7-7. Printed Wiring Board – MD Section – ························ 60
7-8. Schematic Diagram – MD (1/2) Section – ·················· 61
7-9. Schematic Diagram – MD (2/2) Section – ·················· 62
7-10. Printed Wiring Board – Main Section – ······················ 63
7-11. Schematic Diagram – Main (1/4) Section – ················ 64
7-12. Schematic Diagram – Main (2/4) Section – ················ 65
7-13. Schematic Diagram – Main (3/4) Section – ···············  66
7-14. Schematic Diagram – Main (4/4) Section – ················ 67
7-15. Printed Wiring Board – Digital (Side A) Section – ····· 68
7-16. Printed Wiring Board – Digital (Side B) Section – ····· 69
7-17. Schematic Diagram – Digital (1/2) Section – ············· 70
7-18. Schematic Diagram-Digital (2/2) Section ··················· 71
7-19. Printed Wiring Board – Amp Section – ······················· 72
7-20. Schematic Diagram – Amp Section – ·························· 73
7-21. Printed Wiring Board – Panel Section – ······················ 74
7-22. Schematic Diagram – Panel Section – ························ 75
7-23. Printed Wiring Board – Switch Section – ··················· 76
7-24. Schematic Diagram – Switch Section – ······················ 77
7-25. Printed Wiring Board – CD Mechanism Section – ····· 78
7-26. Schematic Diagram – CD Mechanism Section – ········ 79
7-27. Printed Wiring Board – Leaf Sw Section – ················· 80
7-28. Schematic Diagram – Leaf Sw Section – ···················· 80
7-29. Printed Wiring Board – Mic Section – ························ 81
7-30. Schematic Diagram – Mic Section – ··························· 81
7-31. Printed Wiring Board – Power Supply Section – ········ 82
7-32. Schematic Diagram – Power Supply Section – ··········· 83
7-33. Schematic  Diagram – Video CD Section (1/2) – ········ 84
7-34. Schematic  Diagram – Video CD Section (2/2) – ········ 85
7-35. Printed  Wiring Boards – Video CD Section – ············ 86
7-36. IC Block Diagrams ······················································ 87
7-37. IC Pin Functions ·························································· 94

······················································ 105

8-1. Back Panel Section ···················································· 105
8-2. Front Panel Section ··················································· 106
8-3. Chassis Section ·························································· 107
8-4. CD Mechanism Deck Section-1 ································ 108
8-5. CD Mechanism Deck Section-2 ································ 109
8-6. Tape Mechanism Deck Section ································· 110
8-7. MD Mechanism Section-1 ········································· 111
8-8. MD Mechanism Section-2 ········································· 112

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COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

This caution
label is located
inside the unit.

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To repair the BD (CD) board,remove the bottom plate.

Bottom view