DOWNLOAD Sony DAV-X1 / HCD-X1 Service Manual ↓ Size: 10.68 MB | Pages: 116 in PDF or view online for FREE

Model
DAV-X1 HCD-X1
Pages
116
Size
10.68 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
dav-x1-hcd-x1.pdf
Date

Sony DAV-X1 / HCD-X1 Service Manual ▷ View online

5
HCD-X1
TABLE  OF  CONTENTS
1.
SERVICING  NOTES
...............................................
6
2.
GENERAL
................................................................... 10
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 12
3-2.
Optical Pick-up Block (KHM-310CAA) ........................ 12
3-3.
Side Panel (L/R) .............................................................. 13
3-4.
Case (AL) ........................................................................ 13
3-5.
Front Panel Section ......................................................... 14
3-6.
MAIN Board .................................................................... 15
3-7.
D.C. Fan (M450), Back Panel Section ............................ 15
3-8.
DVD Mechanism Deck (CDM85-DVBU102) ................ 16
3-9.
Chuck Cam, Belt ............................................................. 17
4.
TEST  MODE
.............................................................. 18
5.
ELECTRICAL  ADJUSTMENTS
......................... 21
6.
DIAGRAMS
6-1.
Block Diagram – RF SERVO/VIDEO Section – ............ 22
6-2.
Block Diagram
– HDMI Section (US and Canadian models) – ............... 23
6-3.
Block Diagram – MAIN Section – .................................. 24
6-4.
Block Diagram – AMP Section – .................................... 25
6-5.
Block Diagram
– PANEL/POWER SUPPLY Section – ........................... 26
6-6.
Printed Wiring Boards – DMB10 Section (1/2) – ........... 28
6-7.
Printed Wiring Board – DMB10 Section (2/2) – ............. 29
6-8.
Schematic Diagram – DMB10 Section (1/4) – ............... 30
6-9.
Schematic Diagram – DMB10 Section (2/4) – ............... 31
6-10. Schematic Diagram – DMB10 Section (3/4) – ............... 32
6-11. Schematic Diagram – DMB10 Section (4/4) – ............... 33
6-12. Printed Wiring Board – MIB01 Board (Component Side)
(US and Canadian models) – ........................................... 34
6-13. Printed Wiring Board – MIB01 Board (Conductor Side)
(US and Canadian models) – ........................................... 35
6-14. Schematic Diagram
– MIB01 Board (1/5) (US and Canadian models) – ........ 36
6-15. Schematic Diagram
– MIB01 Board (2/5) (US and Canadian models) – ........ 37
6-16. Schematic Diagram
– MIB01 Board (3/5) (US and Canadian models) – ........ 38
6-17. Schematic Diagram
– MIB01 Board (4/5) (US and Canadian models) – ........ 39
6-18. Schematic Diagram
– MIB01 Board (5/5) (US and Canadian models) – ........ 40
6-19. Schematic Diagram – IO Board – ................................... 41
6-20. Printed Wiring Board
– IO Board (Component Side) – ...................................... 42
6-21. Printed Wiring Board
– IO Board (Conductor Side) – ....................................... 43
6-22. Printed Wiring Board
– SCART Board (AEP, UK and Russian models) – ........ 44
6-23. Schematic Diagram
– SCART Board (AEP, UK and Russian models) – ........ 45
6-24. Printed Wiring Board
– MAIN Board (Component Side) – ............................... 46
6-25. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................. 47
6-26. Schematic Diagram – MAIN Board (1/4) – .................... 48
6-27. Schematic Diagram – MAIN Board (2/4) – .................... 49
6-28. Schematic Diagram – MAIN Board (3/4) – .................... 50
6-29. Schematic Diagram – MAIN Board (4/4) – .................... 51
6-30. Printed Wiring Board – SWITCH Board – ..................... 52
6-31. Schematic Diagram – SWITCH Board – ........................ 53
6-32. Printed Wiring Board – FL Board – ................................ 54
6-33. Schematic Diagram – FL Board – ................................... 55
6-34. Printed Wiring Board
– POWER-AMP Board (Component Side) – .................. 56
6-35. Printed Wiring Board
– POWER-AMP Board (Conductor Side) – .................... 57
6-36. Schematic Diagram – POWER-AMP Board (1/3) – ....... 58
6-37. Schematic Diagram – POWER-AMP Board (2/3) – ....... 59
6-38. Schematic Diagram – POWER-AMP Board (3/3) – ....... 60
7.
EXPLODED  VIEWS
7-1.
Case (AL), Side Panel Section ........................................ 90
7-2.
Front Panel Section ......................................................... 91
7-3.
MAIN Board Section ....................................................... 92
7-4.
POWER-AMP Board Section ......................................... 93
7-5.
Chassis Section ................................................................ 94
7-6.
DVD Mechanism Deck Section (CDM85-DVBU102) ... 95
8.
ELECTRICAL  PARTS  LIST
................................ 96
6
HCD-X1
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD  FREE  MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure :
Press two buttons of
Z
and
x
simultaneously for five seconds.
The message “UNLOCKED” is displayed and the tray is unlocked.
Note:
When “LOCKED” is displayed, the tray lock is not released by turning
power on/off with the
I/
1
button.
NOTE  OF  REPLACING  THE  DMB10  BOARD
New part of EEPROM (IC103) on the DMB10 board cannot be
used. Therefore, if the mounted DMB10 board is replaced, exchange
new EEPROM with that used before the replacement.
RELEASING  THE  DEMO  PLAY  LOCK
Releasing Procedure:
Press two buttons of
N
and
x
.
The message “DEMO OFF”.
NOTE  OF  HANDLING  THE  MIB01  BOARD (Part No. A-
1124-106-A)
When the MIB01 board is replaced by a repair for a fee, throw
away the MIB01 board after obtaining consent of not returning of
the MIB01 board to the customer. When throwing away the MIB01
MODEL  IDENTIFICATION
PART No.
– Back Panel –
MODEL
PART No.
US and Canadian model
2-588-835-0[]
AEP and UK model
2-588-835-1[]
Russian model
2-588-835-2[]
Singapore model
2-588-835-4[]
S-FORCE  FRONT  SURROUND  OPERATION  CHECK
When complaint by the effect of the sound field, check as follows
and confirm abnormality is not found in the set.
Procedure:
4HE
/
;
PRESS
4HE
$D
%.4%2
,ISTENING
(INT
"
TRIANGLE
#
.OTE
s
A
s
7)$%
Y
;
M
"
&
'
board, be sure to throw away after destroying IC602 physically with
the hammer etc.
Ver. 1.2
7
HCD-X1
DMB10  BOARD  SERVICE  POSITION
In checking the DMB10 board, prepare four extension jigs (Part No. J-2501-239-A: 1.00 mm Pitch, 5 cores, Length 300 mm, Part No.
J-2501-242-A: 1.00 mm Pitch, 11 cores, Length 300 mm and Part No. J-2501-280-A: 5 cores, Length 300 mm).
Note:
 Follow the disassembly procedure in the numerical order given.
HOW  TO  OPEN  THE  LOADING  ASSY  PANEL  WHEN  POWER  SWITCH  TURNS  OFF
1
Open the cover dust.
2
Slide the chuck cam in the direction
of arrow to release the chucking.
3
Draw out the loading assy panel
in the direction of the arrow.
DMB10 board
(CN401)
MAIN board
(CN508)
DMB10 board
(CN4501)
DMB10 board
(CN106)
Connect extension jig (J-2501-280-A) to the
MAIN board (CN508) and DMB10 board (CN401).
Connect extension jig (J-2501-242-A) to the
MAIN board (CN504) and DMB10 board (CN4501).
Connect extension jig (J-2501-242-A) to the
MAIN board (CN503) and DMB10 board (CN106).
Connect extension jig (J-2501-239-A) to the
DMB10 board (CN202) and MS-203 (CN001) board.
Note: Don’t remove the
wire (flat type) 24 core (CN101).
If you remove the
wire (flat type) 24 core (CN101),
solder the bridge of optical pick-up.
MAIN board
(CN503)
MAIN board
(CN504)
DMB10 board
(CN202)
DMB10 board
(CN101)
wire (flat type) 24 core
MS-203 board
(CN001)
8
HCD-X1
MAIN  BOARD  SERVICE  POSITION
• In checking the MAIN board, prepare two extension jigs (Part No. J-2501-243-A: 1.00 mm Pitch, 17 cores, Length 300 mm and Part
No. J-2501-244-A: 1.00 mm Pitch, 21 cores, Length 300 mm).
MIB01  BOARD (US,  Canadian  MODELS)  SERVICE  POSITION
MAIN board
(CN506)
POWER-AMP board
(CN301)
Connect extension jig (J-2501-244-A) to the
MAIN board (CN506) and POWER-AMP board (CN301).
Connect extension jig (J-2501-243-A) to the
MAIN board (CN505) and SWITCH board (CN801).
MAIN board
(CN505)
SWITCH board
(CN801)
Any to board
MIB01 board
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